Abstract: An electronic module is provided that includes a housing having electrically conductive top and bottom housing portions in substantial contact with each other and cooperating with each other to define an opening. A printed circuit board is disposed within the housing and includes an edge connector at least partially extending through the opening in the housing. The printed circuit board also defines a non-conductive through opening configured and arranged so that the housing portions contact each other by way of the through opening. In this way, the housing portions cooperate to subdivide the opening defined by the housing into at least two relatively smaller openings that, as a result of their relatively small size, facilitate containment of electromagnetic emissions generated by the electronic module.

Abstract: A PCB is provided that is suitable for use in applications where EMI control is of interest. The PCB includes circuitry that communicates with an edge connector having edge traces located on its surface. Additionally, embedded traces are disposed within the dielectric material of the PCB, and each embedded trace electrically connects an edge trace with a corresponding median trace located on a surface of the PCB. An embedded ground layer substantially disposed within the dielectric material defines an area within the dielectric material through which the embedded traces pass. Finally, one or more vias are provided that extend through the dielectric material of the PCB and are filled with a conductive material. The vias are electrically connected to the embedded ground layer and configured to electrically communicate with an associated module. In this way, a structure is implemented that facilitates control of electromagnetic radiation emitted by the PCB circuitry.

Abstract: A latch mechanism for use with an electronic module, such as an opto-electronic transceiver module. The latch mechanism allows the user to selectively extract the transceiver module from the port by moving an attached bail between a first and second position. Specifically, the bail is connected to, and configured to translate, a pair of sliders that are configured and arranged to engage, and disengage from, corresponding structure of the port. When the bail is in the first position, the sliders releasably engage corresponding structure of the port. When the bail is moved from the first position to a second position, the sliders disengage from the corresponding structure of the port, thereby enabling unhindered extraction of the module from the port.

Abstract: A card cage system is provided that includes a middle card guide interposed between two end card guides in an electronic equipment enclosure. Each of the card guides includes one or more channels adapted to receive a card edge. The middle card guide includes a removable adapter element that, when present in the middle card guide, prevents insertion of double wide, or larger, cards while, at the same time, permitting insertion of two single wide cards in a side-by-side arrangement. When the adapter element is removed, a double-wide card can be received in the middle card guide such that it straddles the middle card guide. The edges of the double-wide card are received in the first and second end card guides. Thus, the card guide can be readily customized to accommodate a variety of card types and sizes, in various arrangements.

Abstract: An adapter element is provided for interfacing with a card guide of a card cage system to enable ready definition of various card storage configurations within the card cage system. The adapter element is configured to be removably attached to a card guide so that different card storage configurations may be readily defined within a particular card storage level by removing one or more adapter elements from the corresponding card guides and/or positioning one or more adapter elements in corresponding card guides. Additionally, the adapter element is configured to engage the fasteners of a functional module so as to securely retain the functional module in position in the card cage assembly when the adapter element is attached to the card guide.

Abstract: An electromagnetic radiation containment system is provided for use in connection with functional modules and an associated card cage disposed in the chassis of an electronic equipment enclosure. The electromagnetic radiation containment system includes conductive elements uniformly distributed about the perimeter of a functional module configured to be received within the card cage, and further includes grounding elements in electrical communication with the chassis so that when the functional module is positioned within a slot of the card cage, at least some of the conductive elements are in electrical communication with the grounding elements. The uniform distribution of the conductive elements on the functional module(s) enables the functional modules to be arranged above and below each other, as well as side by side, without compromising the electromagnetic radiation containment functionality that is afforded when each of the slots of the card cage is occupied.

Abstract: A functional module is provided for use in conjunction with an electronic equipment enclosure that includes a card cage having two end card guides and one or more middle card guides interposed between the end card guides. The functional module includes a double-wide card that is configured to be removably received in the card cage. The double-wide card includes electronic circuitry and defines a cutout configured to engage a middle card guide. When the functional module is operably positioned in the electronic equipment enclosure, the edges of the double wide card are supported by the end card guide and the cutout engages the middle card guide so that the double-wide card straddles the middle card guide and is supported thereby.

Abstract: A heat sink and module cage assembly for receiving a pluggable electronics component, such as an opto-electronic transceiver module. The heat sink is attached to the module cage and includes a bottom surface forming one of four sidewalls of a chamber that receives the electronics component. The attachment of the heat sink in this manner enables the heat sink and module cage to be assembled during fabrication and prior to the assembly being shipped to a third party who may use the assembly on a printed circuit board. The top surface of the heat sink defines a plane that enables the assembly to be press fitted onto the printed circuit board using a flat rock tool. The sidewall of the cage assembly opposite the bottom surface of the heat sink includes leaf springs that bias the electronics module against the heat sink, thereby facilitating heat transfer to the heat sink.

Abstract: An illumination apparatus for a digitizer tablet includes a support structure and a solid sheet optical light guide supported by the support structure and having first and second opposing surfaces and a plurality of edges. Light sources are carried by the support structure and positioned to direct light into light-receiving edges of the light guide. Reflecting structure is disposed adjacent the first surface of the light guide. A predetermined pattern is disposed on the first surface of the light guide structured and arranged in accordance with distance from the light sources.