Abstract: A method includes transforming, based on a first transform, a first markup language document associated with a first version of a schema to generate a second markup language document associated with a second version of the schema. The second markup language document is representative of a third markup language document associated with the second version of the schema and the first transform represents a transform from the first version of the schema to the second version of the schema. The method further includes comparing the second markup language document to the third markup language document to identify whether at least one discrepancy exists between the second markup language document and the third markup language document. The method additionally includes determining a suitability of the first transform based on the comparison of the second markup language document to the third markup language document.

Abstract: A method, system and apparatus is provided for dispensing drugs quickly, conveniently, securely, and accurately and at relatively less cost than traditional pharmacy-based dispensing systems. A script for a drug prescribed to a user is generated comprising a human readable description of the drug and the user or a machine readable description of the drug and the user. The script is provided to a robotic prescription dispensary operable to recognize either the human readable description or the machine readable description, and validate and dispense the drug accordingly. The robotic prescription dispensary includes a user interface, a tele conferencing or video conferencing means enabling communication between the user and a human validation agent, and a scanning means for capturing an image of the script. A method for managing inventory and distribution of drugs is also provided.

Abstract: A guide (2) for inserting a fold of fabric into the batten of a Roman blind comprising a leading end (12) and a trailing end (4). A slot (10) runs from trailing end (12) to leading end (4). The slot (10) has a T-section which opens into a countersunk central area (14) towards the leading end (12) and into a bore (6) towards the trailing end (4). The bore (6) is adapted to receive a leading end of the batten (8) and a screw (18) projects from the sidewall into the bore (6) in order to engage the batten (8).

Abstract: A method, system and apparatus is provided for dispensing drugs quickly, conveniently, securely, and accurately and at relatively less cost than traditional pharmacy-based dispensing systems. A script for a drug prescribed to a user is generated comprising a human readable description of the drug and the user or a machine readable description of the drug and the user. The script is provided to a robotic prescription dispensary operable to recognize either the human readable description or the machine readable description, and validate and dispense the drug accordingly. The robotic prescription dispensary includes a user interface, a teleconferencing or videoconferencing means enabling communication between the user and a human validation agent, and a scanning means for capturing an image of the script. A method for managing inventory and distribution of drugs is also provided.

Abstract: A shielded package includes a shield assembly having a shield fence, a shield lid, and a shield lid adhesive electrically coupling the shield lid to the shield fence. The shield fence includes a porous sidewall through which molding compound passes during molding of the shielded package. Further, the shield fence includes a central aperture through which an electronic component is die attached and wire bonded.

Abstract: A semiconductor fabrication architecture which includes a middleware component, a fabrication facility coupled to the middleware component, a real time dispatcher application program interface coupled between the fabrication facility and the middleware component, a work in progress application program interface coupled between the fabrication facility and the middleware component, an enterprise resource planning system coupled to the middleware component, and an order processing system coupled to the middleware component. The fabrication facility includes a manufacturing execution system and a real time dispatch system. The manufacturing execution system tracks overall processing of semiconductor wafers. The real time dispatch system provides near real time information regarding processing of semiconductor wafers. The real time dispatcher application program interfaces publishing information to the middleware component.

Abstract: A spectral acquisition method includes actively processing a sample, such as a an opaque, friable pharmaceutical dosage unit, to expose characteristics of interior portions of the sample, and acquiring spectral information from the interior portions.

Abstract: The present invention provides fast drying aqueous compositions, suitable for use in making roadway markings, as well as the road markings made therefrom, the compositions comprising one or more anionically stabilized binder having a phosphorus acid functional polymer component having a glass transition temperature (Tg) range of from ?30° C. to 60° C. and a polyfunctional amine component in combination with one or more volatile base in an amount sufficient to stabilize the composition by at least partially deprotonating the polyfunctional amine, and one or more phosphorus acid surfactant, such as an alkyl ethoxylated phosphate. Further, the present invention provides two component compositions comprising the above composition as one component and a second component comprising an absorber and/or the polyfunctional amine component. The fast-drying compositions are viscosity stable and provide wear resistant fast dry coatings even in humid application conditions.

Abstract: A method, system and computer program is provided for protecting against one or more security attacks from third parties directed at obtaining user credentials on an unauthorized basis, as between a client computer associated with a user and a server computer is provided. The server computer defines a trusted Public Key Cryptography utility for use on the client computer. The Public Key Cryptography utility is operable to perform one or more cryptographic operations consisting of encrypting/decrypting data, authenticating data, and/or authenticating a sender, decrypting and/or verifying data. The user authenticates to the Public Key Cryptography utility, thereby invoking the accessing of user credentials associated with the user, as defined by the server computer. The Public Key Cryptography Utility facilitates the communication of the user credentials to the server computer, whether directly or indirectly via an authentication agent, the server computer thereby authenticating the user.

Abstract: The data storage system has metadata server machines, content server machines arranged in groups where each group has a respective one or more of the content server machines, and a system interconnect to which the metadata and content server machines are communicatively coupled. A distributed file system is to be executed in the metadata server machines, the content server machines, and the client machine, to hide complexity of the system from a number of client machine users. The content server machines store slices of the files at locations indicated by the metadata. Other embodiments are also described and claimed.

Abstract: A data storage system has a number of server groups, where each group has data storage servers. A file is stored in the system by being spread across two or more of the servers. The servers are communicatively coupled to internal packet switches. An external packet switch is communicatively coupled to the internal packet switches. Client access to each of the servers is through one of the internal packet switches and the external packet switch. Other embodiments are also described and claimed.

Abstract: An interposer for use in an external lead or land pattern semiconductor package. The interposer includes an interposer body which is molded from a dielectric material. The interposer body defines opposed top and bottom surfaces, an outer peripheral edge, and an inner peripheral edge. Embedded within the interposer body is a die pad which itself defines opposed top and bottom surfaces and a peripheral edge. The bottom surface of the die pad is exposed in and substantially flush with the bottom surface of the interposer body, with the inner peripheral edge of the interposer body and the top surface of the die pad collectively defining a cavity of the interposer. A plurality of electrically conductive interposer leads are embedded within the top surface of the interposer body and at least partially exposed therein. The interposer body forms a nonconductive barrier between each of the interposer leads and between the interposer leads and the die pad.

Abstract: A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.

Abstract: A leadframe, a semiconductor package, and methods of making the same are disclosed. A leadframe includes leads having an inner end segment. A first subset of the leads include a recess in a first surface of the inner end segment. A second subset of the leads include a recess in an opposite second surface of the inner end segment. The first subset leads are in an alternating lateral pattern with the second subset leads such that the recess of adjacent inner end segments are oriented in opposite directions. The recesses separate adjacent inner end segments in a vertical direction, thereby eliminating or reducing a need for horizontal spacing between adjacent inner end segments. In a semiconductor package, a semiconductor chip is electrically connected by a bond wire to the inner end segment of the leads. The bond wire is bonded within the recess of alternating leads.

Abstract: In its various embodiments, the method collects data from process and metrology tools in a semiconductor manufacturing environment, generates statistics from that data, detects tool failures, processing errors, and other conditions that can jeopardize product output, and performs high level process control in the form of tool shutdowns, lot holds, and lot releases. One method as disclosed automates the collection and recording of data from process and metrology tools, automates configuration of data collection, and automates process equipment shut downs, all within the existing framework of existing MES systems and engineering data collection systems. Automation of configurations and data collection is conducted by creation of data collection plans, data collection capability specifications, and other versioned documents within a process control and data collection system as disclosed herein.

Abstract: A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.

Abstract: An interface for a semiconductor fabrication facility which includes a real time dispatch system that provides near real time information regarding processing of semiconductor wafers and a middleware component. The interface includes a real time dispatcher application program interface coupled between the fabrication facility and the middleware component. The real time dispatcher application program interface provides a common interface which provides information to the middleware component.

Abstract: An integrated enterprise resource planning and manufacturing system which includes a middleware component, a fabrication facility coupled to the middleware component, a real time dispatcher application program interface coupled between the fabrication facility and the middleware component, a work in progress application program interface coupled between the fabrication facility and the middleware component, and an enterprise resource planning system coupled to the middleware component. The fabrication facility includes a manufacturing execution system and a real time dispatch system. The manufacturing execution system tracks overall processing of semiconductor wafers. The real time dispatch system provides near real time information regarding processing of semiconductor wafers. The real time dispatcher application program interfaces publishing information to the middleware component.

Abstract: An interface for a semiconductor fabrication facility which includes a real time dispatch system providing near real time information regarding processing of semiconductor wafers and a middleware component. The interface includes a work in progress application program interface coupled between the fabrication facility and the middleware component. The work in progress application program interface provides a common interface for communicating between the fabrication facility and the middleware component.

Abstract: A semiconductor fabrication facility architecture which includes a fabrication facility, a middleware component, a real time dispatcher application program interface coupled between the fabrication facility and the middleware component, and a work in progress application program interface coupled between the fabrication facility and the middleware component. The fabrication facility includes a manufacturing execution system and a real time dispatch system. The manufacturing execution system tracks overall processing of semiconductor wafers and the real time dispatch system provides near real time information regarding processing of semiconductor wafers. The real time dispatcher application program interface provides a common interface for providing information to the middleware component. The work in progress application program interface provides a common interface for communicating to the fabrication facility from the middleware component.