Abstract: An apparatus may include a first magnetic layer, a second magnetic layer, and a conductive pattern. The conductive pattern is at a third layer between the first and second magnetic layers. Moreover, one or more magnetic vias connect the first and second magnetic layers. The magnetic layers and vias may operate as ferromagnetic cores or shields. Further they may be integrated on a chip (on-die magnetics). The apparatus may be included in inductors, transformers, transmission lines, and so forth.

Abstract: An apparatus includes a magnetic core, a ground node, and one or more vias to provide a connection between the magnetic core and the ground potential. The magnetic core includes a first magnetic layer and a second magnetic layer. In addition, the apparatus may include a conductive pattern. The conductive pattern may be at a third layer between the first and second magnetic layers. The apparatus may be included in inductors, transformers, transmission lines, and other components using ferromagnetic cores or shields. Such components may be integrated on a chip or die.

Abstract: An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.

Abstract: The invention provides a finishing unit (11) for floor covering has a lower section (12b) adapted to engage a floor and an upper section (12a) adapted to engage an adjacent wall, with the area of the lower section (12b) adjacent the upper section (12a) being adapted so that floor covering laid over said area forms a curved surface and wherein the finishing unit is provided with attaching means (14) suitable for attaching the finishing unit to the floor or wall where it is to be used and/or suitable for attaching the finishing unit to the floor covering, a method for using the finishing unit in laying a floor covering and a sealant kit comprising the finishing unit and a front member for sealing a join between edges of floor covering at a corner of an area in which the floor covering is to be laid.

Abstract: An inductor for an integrated circuit or integrated circuit package comprises a three-dimensional structure. In one embodiment the inductor is arranged on an integrated circuit substrate in at least two rows, each row comprising upper segments and lower segments, with the upper segments being longer than the lower segments. The upper segments in a first row are offset 180 degrees from those in an adjoining row to provide greater coupling of magnetic flux. The materials and geometry are optimized to provide a low resistance inductor for use in high performance integrated circuits. In another embodiment the inductor is arranged on an integrated circuit package substrate. Also described are methods of fabricating the inductor on an integrated circuit or as part of an integrated circuit package.

Abstract: A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator die bonded to the CPU die in a three dimensional packaging layout.

Abstract: A method is described that comprises flowing current from one region of a coil to another region of the coil. The flowing induces—through flux linkage—a voltage across a second coil. A second current substantially does not flow through the second coil. The method also includes measuring the current with a first voltage at the another region of the coil and a second voltage at the second coil.

Abstract: A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator/converter die bonded to the CPU die in a three dimensional packaging layout.

Abstract: A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a power management die bonded to the CPU die in a three dimensional packaging layout.

Abstract: A method and apparatus for multi-phase transformers are described. In one embodiment, a coupled inductor topology for the multi-phase transformers comprising N primary inductors. In one embodiment, each primary inductor is coupled to one of N input nodes and a common output node. The transformer further includes N?1 secondary inductors coupled in series between one input node and the common output node. In one embodiment, the N?1 secondary inductors are arranged to couple energy from N?1 of the primary inductors to provide a common node voltage as an average of N input node voltages, wherein N is an integer greater than two. Other embodiments are described and claimed.

Abstract: A light-emitting device and optical communication system based on the light-emitting device is disclosed. The light-emitting device is formed in a float-zone substrate. The light-emitting device includes on the substrate lower surface a reflective layer and on the upper surface spaced apart doped regions. The portion of the upper surface between the doped regions is textured and optionally covered with an antireflection coating to enhance light emission. The light-emitting device can operate as a laser or as a light-emitting diode, depending on the reflectivities of the antireflection coating and the reflective layer.

Abstract: A laser driver for high speed interconnections may convert a digital signal to a current train of a bias mode to represent logical zero and of a modulation mode to represent logical one. An optical signal thus produced may include an optical offset. An optical receiver may include a photo-detector to receive the optical signal and generate a current signal, which includes a corresponding current offset. A first amplifier stage converts the current signal to a voltage signal and a second amplifier stage generates a digital output from the voltage signal. One or more low-pass filters may be used to filter the digital output and generate a filtered offset signal for a differential amplifier to generate an offset cancellation signal. The offset cancellation signal may be provided to offset cancellation circuitry to remove the current offset from the current signal generated by the photo-detector.

Abstract: According to the invention there is provided a ventilating decorative floor covering (1) for loose laying on the upper surface of a floor, which floor covering has a decorative upper surface (5) and a lower surface (15) on which are formed one or more studs (20) which, in use, provide an air gap between the lower surface (15) of the floor covering and the upper surface of the floor sufficient to ventilate the floor. The floor covering can be applied to concrete floors which have not completely cured or on contaminated sub-floors, thus negating the need for timely and expensive sub-floor preparation.

Abstract: Briefly, in accordance with one embodiment of the invention, a method is disclosed. The method includes forming a microresonator on a silicon substrate. The microresonator includes an annular structure to recirculate light at a desired wavelength.

Abstract: Briefly, in accordance with one embodiment of the invention, a light emitting device may comprise a microresonator having an annular structure such as a ring or a disk to recirculate light at a desired wavelength formed on a silicon substrate. A waveguide may be disposed on the silicon substrate to couple with the microresonator. The microresonator may be formed with silicon or silicon-germanium nanocrystals in silicon dioxide and rare earths such as erbium or ytterbium. The light emitting device may be monolithically fabricated using a standard silicon process.

Abstract: An fully integrated DC-to-DC switching converter having an inductor, where the inductor has magnetic material that may be amorphous CoZrTa, CoFeHfO, CoAlO, FeSiO, CoFeAlO, CoNbTa, CoZr, and other amorphous cobalt alloys. The magnetic material allows for a relatively high switching frequency. In one embodiment, the inductor has two sub-structures, where each of the two sub-structures are parallel to each other and each includes a conductor having upper and lower portions. The conductors of the two sub-structures are electrically connected to each other, and the upper and lower portions are arranged so that magnetic flux from one of the sub-structures couples with the magnetic flux from the other sub-structure so as to provide a relatively high inductance with small form factor. In another embodiment, the inductor is a simple conductor surrounded by high-frequency magnetic material. In both structures, oxide insulates the conductors from the magnetic material.

Abstract: A transformer is provided that includes a plurality of metal lines and a magnetic material provided about the plurality of metal lines. The magnetic material may include a structure to reduce Eddy currents flowing in the magnetic material. This structure may be a plurality of slots extending perpendicular to the metal lines. This structure may also be a laminated structure.

Abstract: An inductor comprises a substrate comprising a semiconductor material, a first dielectric layer over the substrate, a magnetic layer over the first dielectric layer, a second dielectric layer over the magnetic layer, and a conductor over the second dielectric layer.

Abstract: Briefly, in accordance with one embodiment of the invention, a light emitting device may comprise a microresonator having an annular structure such as a ring or a disk to recirculate light at a desired wavelength formed on a silicon substrate. A waveguide may be disposed on the silicon substrate to couple with the microresonator. The microresonator may be formed with silicon or silicon-germanium nanocrystals in silicon dioxide and rare earths such as erbium or ytterbium. The light emitting device may be monolithically fabricated using a standard silicon process.

Abstract: The optical modulator may include a strained layer of SiGe to confine carriers in a quantum well. The strained layer of SiGe may be doped with arsenic to provide electrons. The optical modulator may receive an optical signal and modulate the received signal by altering the absorption coefficient of the strained layer of SiGe responsive to an electrical signal. The optical modulator device device may be suitable for use in chip-to-chip and on-chip interconnections.