Abstract: A dielectric layer is formed over a substrate comprising a semiconductor material. A magnetic layer is formed over the dielectric layer. The magnetic layer comprises an amorphous alloy comprising cobalt.

Abstract: A transformer comprises a substrate comprising a semiconductor material, a first conductor over the substrate, a second conductor over the substrate, and a magnetic layer over the substrate. The first conductor defines a generally spiral-shaped signal path having at least one turn. The second conductor defines a generally spiral-shaped signal path having at least one turn.

Abstract: A transformer comprises a first inductor and a second inductor. The first inductor has one or more trenches and comprises a first conductor defining a signal path along the one or more trenches of the first inductor. The second inductor has one or more trenches and comprises a second conductor defining a signal path along the one or more trenches of the second inductor.

Abstract: An automated tracking system and method is provided which allows the evaluation of the effectiveness of advertisements directing consumers to sites on the Internet. The tracking system uses the Web address entered by a consumer to identify the source of information leading the consumer to the Website of interest. As the consumer navigates the Website, the tracking system associates this source-identifying data with any product transactions effected by the consumer and records the information for reporting and analysis. The tracking system also retains the source-identifying data in the event the consumer leaves the Website and later returns or goes offline to purchase a product.

Abstract: A substrate carrier for a ceramic substrate which supports one or more high power semiconductor devices which is fabricated from a metal base composite and which includes strategically located high conductivity copper based inserts to provide an effective heat transfer path to a heat sink for high power electronic devices. The coefficient of thermal expansion of both the metal based composite and the copper based inserts substantially match that of the substrate. The substrate carrier is formed by a pressure casting process where a porous preform of SiC, for example, is infiltrated with molten aluminum.

Abstract: According to one embodiment, a method for encapsulating a conductive structure having a first layer, a second layer and a third layer, with a cladding layer, for improved electromigration performance is described. The method comprises the following steps: forming a fourth layer over the conductive structure and reacting at least a portion of the first layer, the third layer and the fourth layer with a portion of the second layer to form a cladding layer that encapsulates an unreacted portion of the second layer. In one embodiment of the present invention, the cladding layer is TiAl.sub.3.

Abstract: A formed metal guard mountable to a planter framework to prevent clogging or blockage of furrow closure means. In a particular embodiment, a trapezoidal guard plate vertically extends forward of and in centered relation to a pair of V-mounted furrow closure wheels.