Abstract: Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.

Abstract: Disclosed herein is substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.

Abstract: Disclosed are a pixel, a pixel array, an image sensor including the pixel array and a method for operating the image sensor. The pixel includes a photo-electro conversion unit; a capacitor for storing charges converted by the photo-electro conversion unit; an output switching device for outputting an electric potential of the capacitor; and a removal unit for removing a part of the charges converted by the photo-electro conversion unit.

Abstract: Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.

Abstract: Disclosed herein are an anti-bacterial, anti-fungal and anti-viral composition with excellent sterilizing power, deodorization and adhesion activity, an application thereof, and a method for preparing the same. The composition with sterilizing activity against bacteria, fungus and virus comprises colloidal silver particles in an amount of from 11 wt % to 15 wt %, titanium dioxide nanoparticles in an amount of from 18 wt % to 25 wt %, a dispersion stabilizer in an amount of from 0.01 wt % to 10 wt %, a binder in an amount of from 0.1 wt % to 4 wt %, and a balance of water in an amount required to form 100 wt %.

Abstract: A sewing machine having a rotatable head portion includes a sewing machine frame shaped in a box using supporting posts and supporting bars to hold the sewing machine; a sewing machine main body mounted on the sewing machine frame; a head portion disposed at the front end of the sewing machine main body and rotatably installed through head portion rotating means; a bed portion rotatably installed under the head portion through bed portion rotating means; X-axis transporting means moving the sewing machine main body mounted on the sewing machine frame in X direction; Y-axis transporting means moving the sewing machine main body mounted on the sewing machine frame in Y direction; and a sewing object fixing frame provided at the front part of the sewing machine frame where the sewing object is held. The head portion and the bed portion are rotated to sew the sewing object.

Abstract: Disclosed is a ceramic laminate sheet comprising a ceramic sheet having a plurality of cracks and a polymer resin layer disposed on one side or both sides of the ceramic sheet, wherein the plurality of cracks pass through the ceramic sheet from one side to the other side thereof, the cracks divide the ceramic sheet into a plurality of pieces, grooves for formation of the cracks are not provided in one side and the other side of the ceramic sheet.

Abstract: Disclosed are a pixel, a pixel array, an image sensor including the pixel array and a method for operating the image sensor. The pixel includes a photo-electro conversion unit; a first capacitor for storing a first quantity of charges of the photo-electro conversion unit; a second capacitor for storing a second quantity of charges of the photo-electro conversion unit; and an output unit to output the first and second quantities of the charges.

Abstract: A display apparatus includes a backlight assembly, a first display panel assembly and a second display panel assembly. The backlight assembly includes a plurality of lamps disposed substantially parallel with each other. The backlight assembly emits first light through a first face and second light through a second face. The first display panel assembly is disposed adjacent to the first face to receive the first light. The second display panel assembly is disposed adjacent to the second face to receive the second light. The backlight assembly may further include a driving inverter electrically connected to first and second ends of the lamps to provide the lamps with driving voltages. Therefore, the backlight assembly applies light to the first and second display panel assemblies to reduce the number of backlight assemblies. Therefore, costs for manufacturing a display apparatus may be reduced.

Abstract: A method of fabricating a package substrate including preparing a substrate having at least one conductive pad, forming an insulating layer having an opening to expose the conductive pad on the substrate, forming a separation barrier layer on the conductive pad inside the opening to be higher than the upper surface of the insulating layer along the side walls thereof, forming a post terminal on the separation barrier layer, and forming a solder bump on the post terminal.

Abstract: There is provided a method of manufacturing a substrate for flip chip, and a substrate for flip chip manufactured using the same. The method includes providing a base substrate including at least one conductive pad, forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad, forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening, forming a metal post in the first opening and a part of the second opening, filling the second opening above the metal post with solder paste, forming a solder cap by performing a reflow process on the filled solder paste, planarizing a surface of the solder cap, and removing the dry film. Accordingly, fine pitches and improve reliability can be achieved.

Abstract: There is provided a package substrate capable of controlling the degree of warpage thereof by improving the composition and formation of a post terminal and a method of fabricating the same. The package substrate includes a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a separation barrier layer provided on the conductive pad inside the opening and formed to be higher than the upper surface of the insulating layer along the side walls thereof; a post terminal provided on the separation barrier layer; and a solder bump provided on the post terminal.

Abstract: Disclosed herein are an anti-bacterial, anti-fungal and anti-viral composition with excellent sterilizing power, deodorization and adhesion activity, an application thereof, and a method for preparing the same. The composition with sterilizing activity against bacteria, fungus and virus comprises colloidal silver particles in an amount of from 11 wt % to 15 wt %, titanium dioxide nanoparticles in an amount of from 18 wt % to 25 wt %, a dispersion stabilizer in an amount of from 0.01 wt % to 10 wt %, a binder in an amount of from 0.1 wt % to 4 wt %, and a balance of water in an amount required to form 100 wt %.

Abstract: An air conditioner having an indoor unit and an outdoor unit, at least one of which includes a communication unit, a switching unit turned on when communication lines are connected to the communication unit, turned off in a standby mode, and turned on when the standby mode is released, a voltage distribution unit distributing voltage applied to the communication unit when the switching unit is turned off, a voltage adjustment unit adjusting the voltage applied to the communication unit and transmitting the adjusted voltage to the communication unit, and a control unit turning the switching unit on when driving voltage is input to the control unit, turning the switching unit off when the at least one of the indoor unit and the outdoor unit enters the standby mode, and turning the switching unit on based on the voltage distributed by the voltage distribution unit in the standby mode.

Abstract: A sewing machine having a rotatable head portion includes a sewing machine frame shaped in a box using supporting posts and supporting bars to hold the sewing machine; a sewing machine main body mounted on the sewing machine frame; a head portion disposed at the front end of the sewing machine main body and rotatably installed through head portion rotating means; a bed portion rotatably installed under the head portion through bed portion rotating means; X-axis transporting means moving the sewing machine main body mounted on the sewing machine frame in X direction; Y-axis transporting means moving the sewing machine main body mounted on the sewing machine frame in Y direction; and a sewing object fixing frame provided at the front part of the sewing machine frame where the sewing object is held. The head portion and the bed portion are rotated to sew the sewing object.

Abstract: Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.

Abstract: Provided are a pixel, a pixel array, and an image sensor including the pixel array. The pixel includes a photoelectric converter, a capacitor, a variable capacitor, and a switching element. The capacitor accumulates electric charges converted by the photoelectric converter. The variable capacitor is connected to the capacitor, and has capacitance varied according to a potential of the capacitor. The switching element outputs the potential of the capacitor.

Abstract: Disclosed are a pixel, a pixel array, an image sensor including the pixel array and a method for operating the image sensor. The pixel includes a photo-electro conversion unit; a capacitor for storing charges converted by the photo-electro conversion unit; an output switching device for outputting an electric potential of the capacitor; and a removal unit for removing a part of the charges converted by the photo-electro conversion unit.

Abstract: Disclosed are a pixel, a pixel array, a method for manufacturing the pixel array, and an image sensor including the pixel array. The pixel includes a first color filter layer to transmit a visible light and an IR, and a second color filter layer to transmit a light, in which the visible light is blocked, at one side of the first color filter layer.

Abstract: Disclosed are a pixel, a pixel array, an image sensor including the pixel array and a method for operating the image sensor. The pixel includes a photo-electro conversion unit; a first capacitor for storing a first quantity of charges of the photo-electro conversion unit; a second capacitor for storing a second quantity of charges of the photo-electro conversion unit; and an output unit to output the first and second quantities of the charges.