Patents by Inventor Dong Hyung Lee

Dong Hyung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240339438
    Abstract: A stacked semiconductor device includes at least one upper chip including first and second channels, each including first and second pseudo-channels; and first and second transfer control circuits respectively corresponding to the first and second channels, each configured to select one of the first and second pseudo-channels according to a channel designation signal designating one of the first and second pseudo-channels and a location information signal indicating a location of a corresponding channel, and transfer a data word between the selected pseudo-channel and a lower chip, wherein the first transfer control circuit transfers the data word in a first order in units of bytes, and the second transfer control circuit transfers the data word in a second order in units of bytes, opposite to the first order.
    Type: Application
    Filed: June 19, 2024
    Publication date: October 10, 2024
    Inventors: Jae Hyung PARK, Seung Geun BAEK, Dong Uk LEE
  • Publication number: 20240339134
    Abstract: A stacked semiconductor device includes at least one upper chip including a plurality of channels each including first and second pseudo-channels; and a plurality of transfer control circuits respectively corresponding to the channels and each configured to output channel commands according to a channel designation signal designating one of the first and second pseudo-channels and a location information signal indicating a location of a corresponding channel of the channels, and transmit first and second data words between the corresponding channel and a lower chip according to the channel commands.
    Type: Application
    Filed: June 18, 2024
    Publication date: October 10, 2024
    Inventors: Jae Hyung PARK, Seung Geun BAEK, Dong Uk LEE
  • Patent number: 12114561
    Abstract: The present disclosure relates to a plurality of light-emitting materials comprising at least one of first compounds and at least one of second compounds, wherein the first compound is represented by formula 1, and the second compound is represented by formula 2, and an organic electroluminescent device having improved lifetime properties can be provided by comprising the plurality of light-emitting materials.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: October 8, 2024
    Assignee: Rohm and Haas Electronic Materials Korea Ltd.
    Inventors: Chi-Sik Kim, Soo-Yong Lee, Seung-Hoon Yoo, Dong-Hyung Lee, Tae-Jin Lee
  • Patent number: 12112949
    Abstract: Methods and techniques for deposition of amorphous carbon films on a substrate are provided. In one example, the method includes depositing an amorphous carbon film on an underlayer positioned on a susceptor in a first processing region. The method further includes implanting a dopant or the inert species into the amorphous carbon film in a second processing region. The implant species, energy, dose & temperature in some combination may be used to enhance the hardmask hardness. The method further includes patterning the doped amorphous carbon film. The method further includes etching the underlayer.
    Type: Grant
    Filed: October 10, 2022
    Date of Patent: October 8, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Rajesh Prasad, Sarah Bobek, Prashant Kumar Kulshreshtha, Kwangduk Douglas Lee, Harry Whitesell, Hidetaka Oshio, Dong Hyung Lee, Deven Matthew Raj Mittal, Scott Falk, Venkataramana R. Chavva
  • Publication number: 20240332032
    Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.
    Type: Application
    Filed: April 1, 2024
    Publication date: October 3, 2024
    Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
  • Publication number: 20240332424
    Abstract: A semiconductor device including first fin-shaped patterns in a first region of a substrate and spaced apart from each other in a first direction, second fin-shaped patterns in a second region of the substrate and spaced apart from each other in a second direction, a first field insulating film on the substrate and covering sidewalls of the first fin-shaped patterns, a second field insulating film on the substrate and covering sidewalls of the second fin-shaped patterns, a first source/drain pattern on the first field insulating film, connected to the first fin-shaped patterns, and including a first silicon-germanium pattern, and a second source/drain pattern on the second field insulating film, connected to the second fin-shaped patterns, and including a second silicon-germanium pattern, the second source/drain pattern and the second field insulating film defining one or more first air gaps therebetween may be provided.
    Type: Application
    Filed: June 12, 2024
    Publication date: October 3, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yang XU, Nam Kyu CHO, Seok Hoon KIM, Yong Seung KIM, Pan Kwi PARK, Dong Suk SHIN, Sang Gil LEE, Si Hyung LEE
  • Patent number: 12103284
    Abstract: A display device includes a display panel that is bent so that at least a portion of the display panel overlaps another portion of the display panel; and a spacer surrounded by the display panel and that includes a flat portion and a bent portion connected to the flat portion, where an upper surface of the bent portion has a first curvature and a lower surface of the bent portion has a second curvature that differs from the first curvature.
    Type: Grant
    Filed: May 9, 2021
    Date of Patent: October 1, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Dong Eun Lee, Do Hyung Ryu, Hyun Sang Park
  • Publication number: 20240318208
    Abstract: The present disclosure relates to a novel method of producing poly-4-hydroxybutyrate and/or 1,4-butanediol, and a microorganism using a poly-4-hydroxybutyrate production pathway.
    Type: Application
    Filed: June 24, 2022
    Publication date: September 26, 2024
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Seo Hyoung KIM, Kyung-Chang LEE, Jae Hyung LIM, Hyo-Seok HA, Dong-Eun CHANG
  • Patent number: 12094555
    Abstract: A stacked semiconductor device includes at least one upper chip including a plurality of channels each including first and second pseudo-channels; and a plurality of transfer control circuits respectively corresponding to the channels and each configured to output channel commands according to a channel designation signal designating one of the first and second pseudo-channels and a location information signal indicating a location of a corresponding channel of the channels, and transmit first and second data words between the corresponding channel and a lower chip according to the channel commands.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: September 17, 2024
    Assignee: SK hynix Inc.
    Inventors: Jae Hyung Park, Seung Geun Baek, Dong Uk Lee
  • Publication number: 20240289054
    Abstract: Provided is a method by which a second chip obtains a control code such as firmware in a memory controller having a chiplet-based structure. The memory controller includes a first chip configured to perform a first operation, a plurality of second chips configured to perform a second operation, a plurality of data links configured to connect the first chip and each of the plurality of second chips on a one-to-one basis and used for data transmission between the first chip and each of the plurality of second chips during normal operation after booting, a control link connected to the first chip and all the plurality of second chips and used to transmit a control code for performing the second operation of the plurality of second chips, and a memory connected to the first chip to store the control code of the plurality of second chips.
    Type: Application
    Filed: August 10, 2023
    Publication date: August 29, 2024
    Inventors: Ie Ryung PARK, Joo Hyung KIM, Dong Sop LEE, Tae Ho LIM
  • Publication number: 20240292739
    Abstract: The present disclosure relates to an organic electroluminescent compound represented by formula 1 and an organic electroluminescent device comprising the same. By comprising an organic electroluminescent compound according to the present disclosure, it is possible to produce an organic electroluminescent device having improved current efficiency and/or lifetime properties.
    Type: Application
    Filed: January 19, 2024
    Publication date: August 29, 2024
    Inventors: Hyun KIM, Hyun-Woo KANG, Hong-Se OH, So-Mi PARK, Jin-Man KIM, Dong-Hyung LEE, Samuel KIM, Tae-Jin LEE
  • Publication number: 20240274859
    Abstract: A secondary battery according to an embodiment of the present disclosure may include: a cell assembly in which a plurality of electrode assemblies in which a cathode sheet, a separator, and an anode sheet are wound together are stacked; and a pouch exterior material formed to surround the outer circumference of the cell assembly.
    Type: Application
    Filed: February 12, 2024
    Publication date: August 15, 2024
    Inventors: Moo Hyung LEE, Seong Kook CHOI, Min Woo KANG, Dong Hyuk KIM, Wook Ho SHIN, Sung Wook CHUNG, Kyung Yeon JO, Seong Hyun CHO, In Ung HONG
  • Publication number: 20240262260
    Abstract: The present disclosure relates to a differential power horizontal-vertical switchable actuator module, the differential power horizontal-vertical switchable actuator module including: an actuator which rotates a horizontal drive shaft formed in the horizontal direction as a whole; a first gearbox which is connected to one side end of the horizontal drive shaft and transfers rotational power from the one side of the horizontal drive shaft by switching the direction to a first vertical rotation shaft that is in the vertical direction as a whole; and a second gearbox which is connected to the other side end of the horizontal drive shaft and transfers rotational power from the other side of the horizontal drive shaft by switching the direction to a second vertical rotation shaft that is in the vertical direction as a whole.
    Type: Application
    Filed: June 17, 2022
    Publication date: August 8, 2024
    Inventors: Sun Ho HUR, Dong Kyu LEE, Tae Hyung KIM, Dong Hwi KIM, Seung Hee NOH, Hyun Soo YOON, Jin Yong HONG
  • Publication number: 20240262782
    Abstract: The present disclosure relates to an organic electroluminescent compound and an organic electroluminescent device comprising the same. By comprising the organic electroluminescent compound according to the present disclosure as an organic electroluminescent material, an organic electroluminescent device having long lifespan characteristics can be provided.
    Type: Application
    Filed: January 4, 2024
    Publication date: August 8, 2024
    Inventors: Jin-Man KIM, Seung-Hoon YOO, Hong-Se OH, Su-Hyun LEE, So-Mi PARK, Dong-Hyung LEE, Hyun-Woo KANG
  • Publication number: 20240258182
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Application
    Filed: April 12, 2024
    Publication date: August 1, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Patent number: 12049000
    Abstract: Provided is a joint structure for a robot including: a body part; a link structure connected to an upper portion of the body part and including multiple links; a sensor unit provided on one end of the link structure; a first wire having one end connected to the sensor unit; and an actuator fixed to one side of the body part and connected to the other end of the first wire to move the other end of the first wire in a vertical direction, wherein the sensor unit measures tension applied to the first wire.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: July 30, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Muhammad Zahak Jamal, Dong Hyun Lee, Hyo Seung Han, Suk Hyung Jang
  • Patent number: 12040402
    Abstract: A semiconductor device including first fin-shaped patterns in a first region of a substrate and spaced apart from each other in a first direction, second fin-shaped patterns in a second region of the substrate and spaced apart from each other in a second direction, a first field insulating film on the substrate and covering sidewalls of the first fin-shaped patterns, a second field insulating film on the substrate and covering sidewalls of the second fin-shaped patterns, a first source/drain pattern on the first field insulating film, connected to the first fin-shaped patterns, and including a first silicon-germanium pattern, and a second source/drain pattern on the second field insulating film, connected to the second fin-shaped patterns, and including a second silicon-germanium pattern, the second source/drain pattern and the second field insulating film defining one or more first air gaps therebetween may be provided.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: July 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yang Xu, Nam Kyu Cho, Seok Hoon Kim, Yong Seung Kim, Pan Kwi Park, Dong Suk Shin, Sang Gil Lee, Si Hyung Lee
  • Publication number: 20240237511
    Abstract: The present disclosure relates to a plurality of organic electroluminescent materials comprising at least one first compound and at least one second compound, and an organic electroluminescent device comprising the same. By comprising a specific combination of compounds, in which the first compound is represented by formula 1 and the second compound is represented by formula 2, it is possible to provide an organic electroluminescent device having improved lifetime properties.
    Type: Application
    Filed: January 8, 2024
    Publication date: July 11, 2024
    Inventors: Dong-Hyung LEE, Chi-Sik KIM, Soo-Yong LEE, Seung-Hoon YOO, Doo-Hyeon MOON, Hyun-Woo KANG
  • Publication number: 20240206311
    Abstract: The present disclosure relates to organic electroluminescent devices. The organic electroluminescent device according to the present disclosure exhibits improved lifespan characteristics and progressive driving voltage by including at least one deuterated compound(s).
    Type: Application
    Filed: October 17, 2023
    Publication date: June 20, 2024
    Inventors: Eun-Joung CHOI, Hae-Yeon KIM, Jin-Man KIM, Chi-Sik KIM, Soo-Yong LEE, So-Mi PARK, Jeong-Hwan JEON, Dong-Hyung LEE, Dominea RATHWELL, Yoo-Jin DOH, Mi-Ran SEO
  • Patent number: 12014927
    Abstract: Methods and techniques for deposition of amorphous carbon films on a substrate are provided. In one example, the method includes depositing an amorphous carbon film on an underlayer positioned on a susceptor in a first processing region. The method further includes implanting a dopant or the inert species into the amorphous carbon film in a second processing region. The implant species, energy, dose & temperature in some combination may be used to enhance the hardmask hardness. The method further includes patterning the doped amorphous carbon film. The method further includes etching the underlayer.
    Type: Grant
    Filed: October 11, 2022
    Date of Patent: June 18, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Rajesh Prasad, Sarah Bobek, Prashant Kumar Kulshreshtha, Kwangduk Douglas Lee, Harry Whitesell, Hidetaka Oshio, Dong Hyung Lee, Deven Matthew Raj Mittal, Scott Falk, Venkataramana R. Chavva