Abstract: A latch assembly capable of maintaining a locking state includes a locking plate including a striker selectively disposed in and out of the locking plate, and rotatably provided, a pawl engaged with the locking plate to prevent rotation of the locking plate, maintaining a locking state in which the locking plate restrains the striker, and separated from the locking plate when being rotated by a cable coupled to the pawl to release restraint of the striker from the locking plate, being in an unlocking state, and a locking maintenance member configured to prevent the rotation of the pawl and the rotation of the locking plate in the locking state, and enable the rotation of the pawl and the rotation of the locking plate when starting to be unlocked from the locking state, which is provided between the pawl and the locking plate.

Abstract: A method of manufacturing a flip chip package includes forming a plurality of semiconductor chips and bonding the semiconductor chips to a package substrate. The method further includes electrically testing the plurality of semiconductor chips on the package substrate, molding the tested semiconductor chips, and singulating the molded chips. Electrically testing the semiconductor chips includes covering the semiconductor chips with a protection member.

Abstract: A positive electrode active material precursor and method of preparing the same are disclosed herein. In some embodiments, a positive electrode active material precursor includes a particle having a first region, a second region, and a third region, a composition of the particle is represented by the following Formula 1 or Formula 2: [M1aM2bM3cM4d](OH)2??[Formula 1] [M1aM2bM3cM4d]O·OH??[Formula 2] M1, M2, and M3 are different from each other and independently selected from the group consisting of Ni, Co, and Mn, M4 is at least one selected from the group consisting of B, Mg, Ca, Al, Ti, V, Cr, Fe, Zn, Ga, Y, Zr, Nb, Mo, Ta, and W, and 0<a<1, 0<b<1, 0<c<1, 0?d<1, and a+b+c+d=1, wherein the first region is at a center of a particle, the second region is disposed on the first region, and the third region is disposed on the second region.

Abstract: A composition for a stainless coating according to the present disclosure includes a sodium silicate, a lithium silicate, a polysiloxane, ethanol, and a residual solvent. The composition may be uniformly and smoothly coated on a curved, stainless steel surface, cleaning may be easier, and yellowing may be reduced or prevented.

Abstract: Provided is a sound processing method performed by a computer, the method comprising generating a DJ transform spectrogram indicating estimated pure-tone amplitudes for respective frequencies corresponding to natural frequencies of a plurality of springs and a plurality of time points by modeling an oscillation motion of the plurality of springs having different natural frequencies, with respect to an input sound, and calculating the estimated pure-tone amplitudes for the respective natural frequencies; calculating degrees of fundamental frequency suitability based on a moving average of the estimated pure-tone amplitudes or a moving standard deviation of the estimated pure-tone amplitudes with respect to each natural frequency of the DJ transform spectrogram; and extracting the fundamental frequency based on local maximum values of the degrees of fundamental frequency suitability for the respective natural frequencies at each of the plurality of time points.

Abstract: Proposed is a secondary battery assembly. A secondary battery assembly according to an embodiment includes a secondary battery having, at an end or each end thereof, an electrode tab including a tab sealing part, and a side sealing part bent on a side surface thereof to a predetermined length, and a venting delay device including a protrusion formed to be spaced apart and face the bent side sealing part. According to the embodiment, it is possible to effectively prevent and delay breakage of a fusion portion of a sealing part of a secondary battery from occurring due to pressure caused by discharge of gas generated inside the secondary battery.

Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

Abstract: A coating composition has heat resistance, transparency, and high hardness. The coating composition is configured to be applied to a stainless steel material. The coating composition includes a polysilazane, a solvent, a dark pigment and a dispersant. A home appliance includes a base including a stainless steel material and a coating layer disposed on the base. The coating layer includes the coating composition.

Abstract: Disclosed is a lifting thread for a press. A thread in which protrusions of a protruding structure, evenly distributed along a surface portion of a yarn, are configured through a pressing method of a press device is provided. Accordingly, even though a tensile force and a traction force of the entire thread have a significant difference depending on the hardness and the degree of density of the skin tissue lipids of patients to be treated, it is possible to provide a customized and molded lifting thread.

Abstract: Provided is a lifting cog thread (100) having a predetermined length. The lifting cog thread includes a molded hook portion provided on an outer circumferential surface of the thread. The molded hook portion includes molded recesses (110) and molded protrusions (120) alternating with the molded recesses. The molded hook portion has a spline shape produced by mold processing using a rotational mold processing apparatus. The thread (100) prevents non-uniform pulling in which skin catching force is relatively weakened in a portion of the thread (100).

Abstract: A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.

Abstract: A method of extracting a fundamental frequency of an input sound includes generating a DJ transform spectrogram indicating estimated pure-tone amplitudes for respective natural frequencies of a plurality of springs and a plurality of time points by calculating the estimated pure-tone amplitudes for the respective natural frequencies by modeling an oscillation motion of the plurality of springs having different natural frequencies with respect to an input sound, calculating degrees of fundamental frequency suitability based on a moving average of the estimated pure-tone amplitudes or on a moving standard deviation of the estimated pure-tone amplitudes with respect to each natural frequency of the DJ transform spectrogram, and extracting a fundamental frequency based on local maximum values of the degrees of fundamental frequency suitability for the respective natural frequencies at each of the plurality of time points.

Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

Abstract: The present disclosure may provide a metal-graphene composite having excellent mechanical properties.

Abstract: A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.

Abstract: Proposed are a system and method for checking out a passenger hand-luggage in an airport. The system for checking out a passenger hand-luggage in an airport includes: a platform configured to load a passenger hand-luggage thereon; a weight measurer configured to measure a weight of the passenger hand-luggage loaded onto the platform; a size measurer configured to measure a size of the passenger hand-luggage loaded onto the platform; an allowance-information provider configured to provide allowance information based on the loaded passenger hand-luggage; and a regulation-based determiner configured to compare the weight and size of the passenger hand-luggage measured by the weight measurer and the size measurer with an allowance allowed for the loaded passenger hand-luggage, and provide check-out information about whether the passenger hand-luggage loaded onto the platform is within the allowance.

Abstract: Provided is a method of manufacturing a positive electrode active material, which includes: (A) preparing a positive electrode active material precursor which includes a core portion including randomly aggregated primary particles and a shell portion surrounding the core portion and formed of primary particles oriented in a direction from a particle center to the outside and in which a ratio of a crystal grain size in the (100) plane to a crystal grain size in the (001) plane of the primary particles forming the shell portion is 3 or more; and (B) mixing the positive electrode active material precursor with a lithium-containing raw material and firing the mixture, wherein the lithium transition metal oxide has an average particle diameter (D50) that is 0.

Abstract: A battery module includes: a plurality of secondary battery cells, each including an electrode lead connected to an electrode assembly, a terrace portion forming a periphery of a cell body member in which the electrode assembly is accommodated, and a sealing portion formed to be connected to the terrace portion; a housing in which the plurality of secondary battery cells are accommodated; and a guard unit installed to face at least a portion of the terrace portion and at least a portion of the sealing portion to delay bursting of the sealing portion of at least one of the secondary battery cells. In the guard unit, a gap between internal surfaces facing the terrace portion is formed to be smaller than a thickness of the cell body member to limit expansion thickness of the terrace portion.

Abstract: A battery module includes: a plurality of second battery cells, each including an electrode lead connected to an electrode assembly, a terrace portion of a cell body member in which the electrode assembly is accommodated, and a sealing portion connected to the terrace portion; a housing unit in which the plurality of secondary battery cells are accommodated; and a guard unit including a first area, facing at least a portion of the terrace portion, to delay swelling or bursting of the sealing portion of at least one of the plurality of secondary battery cells. The guard unit has a shape in which a first gap is smaller than a thickness of the cell body member to limit expansion of a thickness of the terrace portion, the first gap being a distance between internal surfaces of the first area.

Abstract: The present disclosure relates to a method for evaluating the quality of graphene, and may provide a method capable of evaluating in real time the quality of graphene, which is being continuously formed, by using a confocal laser scanning microscope.