Abstract: A composition for a stainless coating according to the present disclosure includes a sodium silicate, a lithium silicate, a polysiloxane, ethanol, and a residual solvent. The composition may be uniformly and smoothly coated on a curved, stainless steel surface, cleaning may be easier, and yellowing may be reduced or prevented.

Abstract: The present disclosure relates to an ?-aminoamide derivative compound and a pharmaceutical composition containing the same. According to various embodiments of the present disclosure, provided is a therapeutic agent which can overcome the disadvantages of existing drugs used as a MAO-B inhibitor and, specifically, reversibly inhibits MAO-B through a non-covalent bond so as to alleviate or eliminate the side effects of the existing drugs which exhibit a therapeutic effect by irreversibly acting via a covalent bond with MAO-B. Particularly, a new compound having superior stability and efficacy compared to the existing reversible MAO-B inhibitors may be provided.

Abstract: A method, of which each step is performed by a computer, for extracting a frequency of an input sound according to an embodiment of the present disclosure comprises the steps of: modeling a plurality of springs which have natural frequencies different from each other and oscillate according to an input sound; calculating transient-state-pure-tone amplitudes of the plurality of modeled springs; calculating expected steady-state amplitudes of the plurality of modeled springs; calculating predicted pure-tone amplitudes based on the expected steady-state amplitudes; calculating filtered pure-tone amplitudes by multiplying the transient-state-pure-tone amplitudes with the predicted pure-tone amplitudes ; and extracting the natural frequency of the spring which corresponds to a local maximum value among the filtered pure-tone amplitudes.

Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.

Abstract: A transparent light-emitting display film includes a transparent substrate in a form of film, a transparent electrode on a first side of the transparent substrate, a through hole formed to penetrate the transparent substrate in a direction perpendicular to a plane of the transparent substrate, a light-emitting device mounted in the through hole, and a connection member configured to electrically connect the transparent electrode and the light-emitting device.

Abstract: An organic light-emitting display device is provided. The organic light-emitting display device includes an upper substrate coupling a lower substrate by an encapsulating layer. The upper substrate includes a metal. An inclined surface is formed at an edge of a substrate of the upper substrate by a rotating polishing wheel. Thus, in the organic light-emitting display device, the reliability may be prevented from being decreased by the metal burr without lowering the process efficiency and uniformity.

Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately exposed to opposing surfaces of the body in a length direction with respective dielectric layers interposed therebetween, and first and second external electrodes disposed at opposing ends of the body in the length direction and connected to the first and second internal electrodes, respectively. The plurality of first and second internal electrodes include nickel (Ni) and antimony (Sb) or germanium (Ge).

Abstract: A weight measuring apparatus for vehicles includes a measuring plate on which an object to be measured is placed; a plurality of entry members installed on the measuring plate; and a load cell having one side fixed to the entry member and the other side fixed to the measuring plate, wherein the entry members are installed apart from each other at the edge of the measuring plate. A weight measuring apparatus for vehicles with which a vehicle is easy to enter thereby measuring the weight of the vehicle conveniently, of which structure is simple and light thereby improving the usability and handling thereof, of which cost for manufacturing can be reduced, of which supporting structure is stable and reinforced with structural strength thereby improving durability and safety, and that can measure load weight accurately.

Abstract: An organic light-emitting display device is provided. The organic light-emitting display device includes an upper substrate coupling a lower substrate by an encapsulating layer. The upper substrate includes a metal. An inclined surface is formed at an edge of a substrate of the upper substrate by a rotating polishing wheel. Thus, in the organic light-emitting display device, the reliability may be prevented from being decreased by the metal burr without lowering the process efficiency and uniformity.

Abstract: A semiconductor product in the form of a stack chip package and a method of manufacturing the same, where a plurality of semiconductor chips are stacked one on another so as to enable the exchange of electrical signals between the semiconductor chips, and where a conductive layer is included for inputting and outputting signals to and from individual chips. A stack chip package having a compact size may, for example, be manufactured by stacking, on a first semiconductor chip, a second semiconductor chip having a smaller surface area by means of interconnection structures so as to enable the exchange of electrical signals between the first and second semiconductor chips, and by using a conductive layer for inputting and outputting signals to and from individual semiconductor chips, in lieu of a thick substrate. Furthermore, heat dissipation effects can be enhanced by the addition of a heat dissipation unit.

Abstract: An organic light-emitting display device is provided. The organic light-emitting display device includes an upper substrate coupling a lower substrate by an encapsulating layer. The upper substrate includes a metal. An inclined surface is formed at an edge of a substrate of the upper substrate by a rotating polishing wheel. Thus, in the organic light-emitting display device, the reliability may be prevented from being decreased by the metal burr without lowering the process efficiency and uniformity.

Abstract: A seatback frame for a vehicle is capable of preventing a passenger seated on a seat from being injured by a sharp edge of a side frame in the event of a collision of the vehicle. The seatback frame includes side frames installed to extend longitudinally in a vertical direction at opposite sides of the seatback frame, respectively, an upper frame joined to the side frames, and a lower frame joined to the side frames. Protrusions are formed at a surface of the upper frame while being spaced apart, by a predetermined distance, from edges present at edge portions of the side frames, respectively, to prevent the passenger from being injured by the edges.

Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately exposed to opposing surfaces of the body in a length direction with respective dielectric layers interposed therebetween, and first and second external electrodes disposed at opposing ends of the body in the length direction and connected to the first and second internal electrodes, respectively. The plurality of first and second internal electrodes include nickel (Ni) and antimony (Sb) or germanium (Ge).

Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

Abstract: A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.

Abstract: A method of manufacturing a flip chip package includes forming a plurality of semiconductor chips and bonding the semiconductor chips to a package substrate. The method further includes electrically testing the plurality of semiconductor chips on the package substrate, molding the tested semiconductor chips, and singulating the molded chips. Electrically testing the semiconductor chips includes covering the semiconductor chips with a protection member.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Abstract: The present disclosure relates to an ?-aminoamide derivative compound and a pharmaceutical composition containing the same. According to various embodiments of the present disclosure, provided is a therapeutic agent which can overcome the disadvantages of existing drugs used as a MAO-B inhibitor and, specifically, reversibly inhibits MAO-B through a non-covalent bond so as to alleviate or eliminate the side effects of the existing drugs which exhibit a therapeutic effect by irreversibly acting via a covalent bond with MAO-B. Particularly, a new compound having superior stability and efficacy compared to the existing reversible MAO-B inhibitors may be provided.

Abstract: A steel sheet coating apparatus includes a cleaner configured to apply cleaning liquid to thereby clean a surface of a steel sheet, a polisher that applies polishing liquid to the cleaned surface of the steel sheet and that includes at least one polishing wheel configured to polish the surface of the steel sheet, a coater that includes a plurality of coating rollers that are configured to coat the polished surface of the steel sheet with coating liquid, and a curing furnace that includes curing chambers that are configured to heat the steel sheet coated with the coating liquid, that have different heating temperatures, and that are configured to cure the coating liquid on the steel sheet based on heating the steel sheet in one chamber having a first temperature and then heating the steel sheet in another chamber having a second temperature greater than the first temperature.