Abstract: A semiconductor product in the form of a stack chip package and a method of manufacturing the same, where a plurality of semiconductor chips are stacked one on another so as to enable the exchange of electrical signals between the semiconductor chips, and where a conductive layer is included for inputting and outputting signals to and from individual chips. A stack chip package having a compact size may, for example, be manufactured by stacking, on a first semiconductor chip, a second semiconductor chip having a smaller surface area by means of interconnection structures so as to enable the exchange of electrical signals between the first and second semiconductor chips, and by using a conductive layer for inputting and outputting signals to and from individual semiconductor chips, in lieu of a thick substrate. Furthermore, heat dissipation effects can be enhanced by the addition of a heat dissipation unit.

Abstract: Provided are a polyester film that is usable for protecting a surface of a metal plate of a construction material, a decorative material, an interior material, an electronic product, etc., and a manufacturing method therefor, and a polyester mold product using the same and a manufacturing method therefor, wherein the polyester film has low orientation and low modulus to have excellent moldability.

Abstract: Disclosed herein are a method for providing a personalized recommendation service based on email and an apparatus for the same. The personalized recommendation service may be provided by determining a personalized recommended item targeted at a recommendation target user, creating dynamic image output code for outputting the personalized recommended item, creating an email based on the dynamic image output code and sending the email to the recommendation target user, and calling the most recent item information about the personalized recommended item from a marketing server based on execution of the dynamic image output code when the recommendation target user reads the email. Also, when a user reads an email, the most recent information about items that are being provided in the marketing server may be provided.

Abstract: A positive electrode active material includes a lithium transition metal oxide represented by Formula 1, wherein the lithium transition metal oxide includes a center portion having a layered structure and a surface portion having a secondary phase with a structure different from that of the center portion. Li1±a(NixCoyM1zM2w)1?aO2??[Formula 1] In Formula 1, 0?a?0.2, 0.6?x?1, 0?y?0.4, 0?z?0.4, and 0?w?0.1, M1 includes at least one selected from the group consisting of manganese (Mn) and aluminum (Al), and M2 includes at least one selected from the group consisting of zirconium (Zr), boron (B), tungsten (W), molybdenum (Mo), chromium (Cr), tantalum (Ta), niobium (Nb), magnesium (Mg), cerium (Ce), hafnium (Hf), lanthanum (La), titanium (Ti), strontium (Sr), barium (Ba), fluorine (F), phosphorus (P), sulfur (S), and yttrium (Y). A method of preparing the positive active material is also provided.

Abstract: A fan-out sensor package includes: a redistribution portion having a through-hole and including a wiring layer and vias; a first semiconductor chip having an active surface having a sensing region of which at least a portion is exposed through the through-hole and first connection pads disposed in the vicinity of the sensing region; a second semiconductor chip disposed side by side with the first semiconductor chip in a horizontal direction and having second connection pads; dam members disposed in the vicinity of the first connection pads; an encapsulant encapsulating the redistribution portion, the first semiconductor chip, and the second semiconductor chip; and electrical connection structures electrically connecting the first connection pads and the second connection pads to the wiring layer or the vias of the redistribution portion.

Abstract: A substrate for a liquid crystal display device includes: a substrate; and an alignment film on the substrate, the alignment film including an alignment material of a photo alignment material and a conductive particle.

Abstract: A composition for coating stainless steel includes sodium silicate, lithium silicate, sodium tetraborate, and a solvent as the remainder so that a contaminant on the surface of stainless steel is easily removed and yellowing of the stainless steel can be prevented. A cooking appliance includes the stainless steel surface coated with the composition.

Abstract: An apparatus for estimating the lifetime of a surge protective device (SPD) using the discharge characteristics of a metal oxide varistor (MOV) includes an MOV having an input terminal and an output terminal; an impulse voltage application unit applying an impulse voltage for MOV test to the input terminal of the MOV; a discharge current measurement unit; a first switching unit connecting a power line to the input terminal of the MOV; a second switching unit connecting a ground line to the output terminal of the MOV in the normal mode and selectively connecting the discharge current measurement unit in the MOV test mode; an MOV test management unit providing information; a discharge current check unit generating an MOV abnormal signal; and an MOV state display unit displaying an MOV abnormal signal.

Abstract: A substrate for a liquid crystal display device includes: a substrate; and an alignment film on the substrate, the alignment film including an alignment material of a photo alignment material and a conductive particle.

Abstract: A ground electrode (100) positioned in the earth and a monitoring device (200) configured to measure a current and resistance of a ground line, where the monitoring device (200) includes a ground current sensing unit (210) configured to measure the current of the ground line, a resistance sensing unit (220) configured to measure ground resistance of the earth and an earth resistance rate, a voltage sensing unit (230) configured to check a voltage value of commercial power, a temperature and humidity sensing unit (240) configured to check a surrounding temperature and humidity of the monitoring device (200), and a monitoring unit (250) configured to confirm whether the ground current, ground resistance and earth resistance measured are abnormal values by compared with reference values classified based on the temperature and humidity measured.

Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.

Abstract: The present disclosure relates to an ?-aminoamide derivative compound and a pharmaceutical composition containing the same, for treating a neurodegenerative diseases.

Abstract: A position information sharing apparatus of a vehicle includes a communication circuit communicating with a server and a processor electrically connected to the communication circuit. The processor is configured to receive authentication information for sharing of position information of the vehicle from the server, using the communication circuit, to transmit the authentication information to an external device, using the communication circuit such that the external device which is a sharing target of the authentication information is capable of obtaining the position information from the server, and to obtain information within a preset range corresponding to the apparatus among the position information at a preset timing corresponding to the apparatus, from the server using the authentication information.

Abstract: A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.

Abstract: A fan-out sensor package includes: a sensor chip having a first connection pads and an optical layer; an encapsulant encapsulating at least portions of the sensor chip; a connection member disposed on the sensor chip and the encapsulant and including a redistribution layer electrically connected to the first connection pads; through-wirings penetrating through the encapsulant and electrically connected to the redistribution layer; and electrical connection structures disposed on the other surface of the encapsulant opposing one surface of the encapsulant on which the connection member is disposed and electrically connected to the through-wirings, wherein the sensor chip and the connection member are physically spaced apart from each other by a predetermined distance, and the first connection pads and the redistribution layer are electrically connected to each other through first connectors disposed between the sensor chip and the connection member.

Abstract: A computer-implemented method of performing inter-process communication includes a first process in a first operating system (OS) level container in a user space sending a message to a buffer process. The message is addressed to a second process in a second OS-level container in the user space. The buffer process communicates the message to the second process. A device for performing the computer-implemented method is also provided.

Abstract: A display apparatus communicatively coupleable to a multi display system is provided. The display apparatus includes a display; a first connector configured to receive an image from a first display apparatus of the multi display system; a processor configured to perform a control so that a feedback signal that informs of a detection of an error is transmitted to the first display apparatus through the first connector when the error is detected in the received image, a compressed image in which the image is compressed is received from the first display apparatus in response to the feedback signal, and the received compressed image is decompressed to display the decompressed image through the display; and a second connector configured to transmit the compressed image to a second display apparatus of the multi display system.

Abstract: A display device of a multi-display system includes a display; a communicator configured to receive a divided image that is displayed on the display device, of a whole image that is displayed through a plurality of display devices included in the multi-display system; a storage configured to store the received divided image; and a processor configured to perform, when a reference image that is synchronized with the divided image is received, at least one among an operation for displaying the divided image that is stored in the storage on the basis of synchronization information that is extracted from the reference image and an operation for transmitting the reference image to another display device among the plurality display devices of the multi-display system.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Abstract: A transparent light-emitting display film includes a transparent substrate in a form of film, a transparent electrode on a first side of the transparent substrate, a through hole formed to penetrate the transparent substrate in a direction perpendicular to a plane of the transparent substrate, a light-emitting device mounted in the through hole, and a connection member configured to electrically connect the transparent electrode and the light-emitting device.