Abstract: A non-volatile memory device and a sensing method thereof are disclosed, which can sense multi-level data using resistance variation. The non-volatile memory device includes a cell array and a sensing unit. The cell array includes a plurality of unit cells where data is read out or written. The sensing unit compares a sensing voltage corresponding to data stored in the unit cell with a reference voltage, amplifies/outputs the compared result, measures a difference in discharge time where the sensing voltage is discharged in response to a resistance value of the unit cell during an activation period of a sensing enable signal after a bit line is precharged, and senses the data in response to the measured result.

Abstract: A non-volatile memory device includes a cell array configured to read or write data, a local column switch configured to selectively connect a bit line of the cell array to a global bit line in response to a column selection signal, a global column switch configured to selectively connect the global bit line to a sense-amp in response to an enable signal, and a switching unit configured to selectively connect or sever a current path of the global column switch in response to a control signal corresponding to a bank active operation.

Abstract: A phase change random access memory (PCRAM) apparatus includes: a memory cell array including a plurality of phase change memory cells; and a firing control unit configured to provide a firing voltage for firing the plurality of phase change memory cells to a global bit line in response to an enable signal based on a test mode signal.

Abstract: A non-volatile semiconductor memory circuit includes a memory cell array, and a verification sense amplifier controller configured to control switching devices, which receive external input data, depending on a level of the input data such that distribution voltage is changed when controlling a write operation by comparing the input data with cell data written in the memory cell array so as to provide cell data.

Abstract: A phase change random access memory device includes: a sense amplifier driving unit configured to compare an input voltage applied through an input signal line with a reference voltage and amplify an output signal in response to the comparison result; an input unit configured to receive an input signal from the input signal line and transmit the received signal to the sense amplifier driving unit; and a coupling prevention unit including a plurality of MOS transistors sharing a bulk bias, coupled between the sense amplifier driving unit and the input unit, and configured to control a sensing margin in response to a level of the input signal.

Abstract: A phase-change memory device is capable of reducing current consumption and preventing performance deterioration caused due to line load by improving a process of selecting memory cells for a write/read operation. The phase-change memory device has a plurality of cell matrixes and includes word line decoding units that are each shared by a plurality of cell matrixes arranged in a row direction and are configured to activate one of global row signals according to a first row address, local row switch units that are provided to the respective cell matrixes and are configured to connect local current lines to corresponding word lines in response to the activated global row signal, bus connecting units that are provided to the respective cell matrixes and are configured to connect the local current lines to global current lines, and enabling units configured to activate one of the global current lines according to a second row address.

Abstract: A chemical-mechanical polishing (CMP) method of polishing a phase-change material and a method of fabricating a phase-change memory, the CMP method including forming the phase-change material on an activation surface of a semiconductor wafer, and performing a CMP process on the phase-change material using a polishing pad, wherein the performing the CMP process includes reducing a change in the composition of the phase-change material by adjusting, within a predetermined range, a temperature of a region where the semiconductor wafer and the polishing pad contact each other.

Abstract: The disclosed phase change random access memory apparatus is configured to program a predetermined phase change memory cell in the phase change memory apparatus in response to a plurality of write instructions applied at independent points of time.

Abstract: A test circuit transfers data, which is generated by current supplied from an external source, to a memory cell in response to a test mode signal.

Abstract: A non-volatile memory device includes a cell array configured to read or write data, a local column switch configured to selectively connect a bit line of the cell array to a global bit line in response to a column selection signal, a global column switch configured to selectively connect the global bit line to a sense-amp in response to an enable signal, and a switching unit configured to selectively connect or sever a current path of the global column switch in response to a control signal corresponding to a bank active operation.

Abstract: A non-volatile memory device for performing a sensing operation using a current signal includes a cell array, a current-voltage converter, and a sense amplifier. The cell array includes at least one unit cell so as to read or write data. The current-voltage converter converts a sensing current corresponding to data stored in the unit cell into a sensing voltage, outputs the sensing voltage, receives a feedback input of the sensing voltage, and adjusts a level of a current applied to an input terminal of the sensing current in response to a level of the feedback input sensing voltage. The sense amplifier compares the sensing voltage with a predetermined reference voltage, and amplifies the result of comparison.

Abstract: A semiconductor memory apparatus includes a memory cell, a data transfer unit configured to adjust an access to the memory cell according to a voltage level of a selection signal, a selection signal output unit configured to output the selection signal having a first control voltage level in a data write mode and a second control voltage level in a data read mode. A data detection unit may also be configured to detect a voltage formed by a sensing current supplied to the memory cell through the data transfer unit in the data read mode, and output read data according to the detection result, wherein the second control voltage level is lower than the first control voltage level.

Abstract: A semiconductor memory apparatus includes: a read current supply unit configured to supply a read current; a resistive memory cell configured to pass a current having a magnitude corresponding to a resistance value thereof in a data read mode; a voltage transfer unit coupled between the read current supply unit and the resistive memory cell and configured to transfer the read current to the resistive memory cell, wherein a voltage corresponding to the magnitude of the passed current is formed at a sensing node; and a feedback unit configured to pull-down drive a connection node, which is coupled between the voltage transfer unit and the resistive memory cell, when a voltage level of the sensing node reaches a predefined level.

Abstract: A semiconductor memory device can reduce a circuit area necessary for row repair. The semiconductor memory device includes a plurality of memory banks, a plurality of cell arrays arranged in each of the memory banks, a plurality of array word lines arranged in each of the cell arrays, one or more repair word lines arranged in each of the cell arrays, and a plurality of repair information storages configured to store bank information and row addresses of the array word lines to be replaced with the repair word lines.

Abstract: A non-volatile memory device for measuring a read current of a unit cell is disclosed. The non-volatile memory device includes a unit cell configured to read or write data, a column switching unit configured to select the unit cell in response to a column selection signal, a sense amplifier controlled by a sense-amplifier enable signal, configured to sense and amplify data that is received from the unit cell through the column switching unit, a first latch unit configured to latch the sense-amplifier enable signal for a predetermined time when a test code signal received from an external part is activated, a column controller configured to output a latch control signal in response to a combination of a column switch-off signal and a column control signal, and a second latch unit configured to control whether or not the column selection signal is latched in response to an activation state of the latch control signal.

Abstract: Disclosed is an integrated circuit device including a plurality of power domain blocks, which includes a core power domain block. A power control circuit is configured to control power supplied to each of the plurality of power domain blocks independently responsive to control communication from the core power domain block. The power control circuit includes a plurality of power clusters corresponding to the plurality of power domain blocks, respectively. The plurality of power clusters control power supplied to the plurality of power domain blocks, respectively, independently responsive to the control communication from the core power domain block.

Abstract: A semiconductor memory apparatus includes a plurality of unit cell arrays having a plurality of word lines which are disposed in a row direction and a plurality of global bit lines which are disposed in a column direction; a row decoder configured to activate at least two word lines among the plurality of word lines in response to a row address which designates one word line; a global column switch block configured to select two different global bit lines among the plurality of global bit lines in response to column control signals; and a column decoder configured to generate the column control signals in response to a column address.

Abstract: A semiconductor memory device substantially prevents a faulty operation from being generated in a read operation, and increases the operation reliability. The semiconductor memory device includes a cell array configured to include a memory element having a different resistance value in response to data, a sense-amp configured to sense and amplify the data, a global bit line configured to couple the sense-amp to a cell array, and a discharge unit configured to discharge the global bit line prior to execution of a read operation.

Abstract: A nonvolatile semiconductor integrated circuit includes a memory cell array configured to include each of memory cells having a variable resistor; a current sensing unit configured to convert a current which depends on the variable resistor of a corresponding memory cell, into a sensing voltage; and a voltage control unit configured to receive the sensing voltage for a predetermined time in response to a sensing control signal, regulate the received sensing voltage, and provide a sensing output voltage.

Abstract: The disclosed phase change random access memory apparatus is configured to program a predetermined phase change memory cell in the phase change memory apparatus in response to a plurality of write instructions applied at independent points of time.