Abstract: Multimodal polyolefin resin having superior characteristics including moldability, mechanical strength, external appearance, melt strength and a polyolefin resin molded product meeting the requirements: (1) polymerized in the presence of at least two different metallocene compounds as catalysts; (2) matrix index of 2 or less and a melt strength of 4.0 Force (cN) or greater at 190° C.; (3) melt flow index (MIP, 190° C., 5.0 kg load condition) of 0.01 to 5.0 g/10 min; (4) ratio (Mw/Mn, MWD) of weight average molecular weight (Mw) to number average molecular weight (Mn) of 5-35 as measured by gel permeation chromatography; and (5) bimodal or multimodal peaks in a weight average molecular weight distribution measured by gel permeation chromatography, wherein the height ratio of two peaks (the ratio of the height of low molecular weight peak to the height of high molecular weight peak) is 0.7-3.

Abstract: A circuit board comprises a mother substrate including first and second scribing regions, the first scribing region extending in first direction, the second scribing region extending in second direction, the first and second directions crossing each other, the mother substrate including chip regions defined by the first and second scribing regions, and a through via penetrating the chip regions of the mother substrate. The mother substrate comprises a first alignment pattern protruding from a top surface of the mother substrate. The first alignment pattern is disposed on at least one of the scribing regions.

Abstract: A method of evaluating a process of fabricating a semiconductor device includes obtaining measurement values from a plurality of sensors and predetermined reference values for each sensor, calculating, for each sensor, a measurement difference value between the reference value and the measurement value, calculating, for each sensor, a reference mean difference value between a maximum reference value for each sensor, which is greater than the reference value, and a minimum reference value for each sensor, which is less than the reference value, and dividing, for each sensor, the measurement difference value by the reference mean difference value to obtain a score value for each sensor.

Abstract: Multimodal polyolefin resin having superior characteristics including moldability, mechanical strength, external appearance, melt strength and a polyolefin resin molded product meeting the requirements: (1) polymerized in the presence of at least two different metallocene compounds as catalysts; (2) matrix index of 2 or less and a melt strength of 4.0 Force (cN) or greater at 190° C.; (3) melt flow index (MIP, 190° C., 5.0 kg load condition) of 0.01 to 5.0 g/10 min; (4) ratio (Mw/Mn, MWD) of weight average molecular weight (Mw) to number average molecular weight (Mn) of 5-35 as measured by gel permeation chromatography; and (5) bimodal or multimodal peaks in a weight average molecular weight distribution measured by gel permeation chromatography, wherein the height ratio of two peaks (the ratio of the height of low molecular weight peak to the height of high molecular weight peak) is 0.7-3.

Abstract: A semiconductor device includes a substrate; a hydrogen insulating layer disposed on the substrate and including hydrogen ions; a first level layer disposed on the substrate and including a first wire and a second wire; a second level layer disposed on the substrate at a different level from the first level layer and including a third wire; an interlayer insulating layer disposed between the first level layer and the second level layer; a diffusion prevention layer contacting the third wire; a contact plug penetrating the interlayer insulating layer and electrically connecting the second wire to the third wire; and a dummy contact plug penetrating the interlayer insulating layer. The dummy contact plug contacts the first and second level layers, is spaced apart from the diffusion prevention layer, and is configured to provide a movement path for the hydrogen ions in the hydrogen insulating layer.

Abstract: The semiconductor device includes a substrate including an integrated circuit and a contact that are electrically connected to each other, an insulation layer covering the substrate and including metal lines, and a through electrode electrically connected to the integrated circuit. The insulation layer includes an interlayer dielectric layer on the substrate and an intermetal dielectric layer on the interlayer dielectric layer. The metal lines include a first metal line in the interlayer dielectric layer and electrically connected to the contact, and a plurality of second metal lines in the intermetal dielectric layer and electrically connected to the first metal line and the through electrode. The through electrode includes a top surface higher than a top surface of the contact.

Abstract: Disclosed herein are a chromium compound represented by Formula 1a or 1b and a catalyst system including the same, exhibiting superior catalytic activity in an olefin trimerization reaction: [{CH3(CH2)3CH(CH2CH3)CO2}2Cr(OH)]??[Formula 1a] [{CH3CH2CH(CH2CH3)CO2}2Cr(OH)]??[Formula 1b].

Abstract: A semiconductor chip is provided including an integrated circuit on a substrate; pads electrically connected to the integrated circuit; a lower insulating structure defining contact holes exposing the pads, respectively; and first, second and third conductive patterns electrically connected to the pads. The second conductive pattern is between the first conductive pattern and the third conductive pattern when viewed from a plan view. Each of the first to third conductive patterns includes a contact portion filling the contact hole, a first conductive line portion extending in one direction on the lower insulating structure, and a bonding pad portion. Ends of the bonding pad portions of the first and third conductive patterns protrude in the one direction as compared with an end of the bonding pad portion of the second conductive pattern when viewed from a plan view.

Abstract: A semiconductor device, a semiconductor package including the same, and a method of fabricating the same are disclosed.

Abstract: A substituted thieno pyrimidine compound of Formula 1, pharmaceutically acceptable salts and a pharmaceutical composition thereof is provided. The compound of Formula 1 exhibits superior inhibition activity against various protein kinases involved in growth factor signal transduction. The compound of Formula 1 and its compositions are useful for the prevention and treatment of diseases caused by abnormal cell growth including cancer.

Abstract: The present invention provides an adhesive layer for an electrical connection. The adhesive layer includes a base resin; an ionic optical-curing agent; an optical curing accelerant; and a conductive particle having a size of several to several tens nanometers, wherein the adhesive layer is cured by a UV light, and the UV light is diffused by the optical curing accelerant.

Abstract: The present invention relates to a thieno[3,2-d]pyrimidine derivative of formula (I), or a pharmaceutically acceptable salt, hydrate or solvate thereof, which has an excellent inhibitory activity on protein kinases, and a pharmaceutical composition comprising the same is effective in preventing or treating abnormal cell growth diseases.

Abstract: Disclosed are novel indazole derivatives represented by the following Chemical Formula 1 or pharmaceutically acceptable salts, hydrates or solvates thereof, and pharmaceutical compositions for the prevention or treatment of proliferative diseases, containing the same as an active ingredient. Having potent inhibitory effect against protein kinase, such as b-raf, KDR, Fms, Tie2, SAPK2a and Ret, inducing diseases caused by abnormal cell proliferation, the novel indazole derivatives can be used for the prevention or treatment of diseases caused by abnormal cell proliferation.

Abstract: A semiconductor device may include a first interlayer dielectric layer including a plurality of contacts, a plurality of interconnection patterns disposed on the first interlayer dielectric layer and connected to the contacts, respectively, and a second interlayer dielectric layer disposed on the first interlayer dielectric layer and covering the interconnection patterns. Each of the interconnection patterns may include a first metal pattern, a second metal pattern disposed on the first metal pattern, a first barrier pattern between the contact and the first metal pattern, and a second barrier pattern between the first metal pattern and the second metal pattern. The second metal pattern may expose a portion of a top surface of the second barrier pattern, and the second interlayer dielectric layer may include an air gap between the interconnection patterns adjacent to each other.

Abstract: The present invention provides an adhesive layer for an electrical connection. The adhesive layer includes a base resin; an ionic optical-curing agent; an optical curing accelerant; and a conductive particle having a size of several to several tens nanometers, wherein the adhesive layer is cured by a UV light, and the UV light is diffused by the optical curing accelerant.

Abstract: A semiconductor device may include a first interlayer dielectric layer including a plurality of contacts, a plurality of interconnection patterns disposed on the first interlayer dielectric layer and connected to the contacts, respectively, and a second interlayer dielectric layer disposed on the first interlayer dielectric layer and covering the interconnection patterns. Each of the interconnection patterns may include a first metal pattern, a second metal pattern disposed on the first metal pattern, a first barrier pattern between the contact and the first metal pattern, and a second barrier pattern between the first metal pattern and the second metal pattern. The second metal pattern may expose a portion of a top surface of the second barrier pattern, and the second interlayer dielectric layer may include an air gap between the interconnection patterns adjacent to each other.

Abstract: A liquid crystal display device includes: a bottom frame having a horizontal portion and a vertical portion extending from an edge region of the horizontal portion; a backlight unit disposed on the horizontal portion; a liquid crystal panel on the vertical portion and over the backlight unit; a side frame combined with the bottom frame to surround the vertical portion, the side frame having a step portion; and a side supporting means on the step portion, the side supporting means contacting a side surface of the liquid crystal panel to support the liquid crystal panel, wherein the side supporting means includes a light-curable material that expands due to irradiation of a ultraviolet ray.

Abstract: A method for fabricating an organic electroluminescent display device is provided. The organic electroluminescent display device includes a light-emitting cell having a cathode electrode, an anode electrode and an organic layer interposed therebetween; wherein the cathode electrode is electrically connected to a contact electrode via a contact hole; wherein the contact electrode has acid-resistance with respect to an etchant used in patterning the cathode electrode.

Abstract: The present invention relates to a thieno[3,2-d]pyrimidine derivative of formula (I), or a pharmaceutically acceptable salt, hydrate or solvate thereof, which has an excellent inhibitory activity on protein kinases, and a pharmaceutical composition comprising the same is effective in preventing or treating abnormal cell growth diseases.

Abstract: A liquid crystal display device includes: a bottom frame having a horizontal portion and a vertical portion extending from an edge region of the horizontal portion; a backlight unit disposed on the horizontal portion; a liquid crystal panel on the vertical portion and over the backlight unit; a side frame combined with the bottom frame to surround the vertical portion, the side frame having a step portion; and a side supporting means on the step portion, the side supporting means contacting a side surface of the liquid crystal panel to support the liquid crystal panel, wherein the side supporting means includes a light-curable material that expands due to irradiation of a ultraviolet ray.