Patents by Inventor Dong-sik Shim

Dong-sik Shim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200312715
    Abstract: A manufacturing and packaging method for a semiconductor die is provided. The method prepares a wafer which has a seal-ring region, forms a first interlayer insulating film on the wafer, forms a metal wiring in the first interlayer insulating film, forms a second interlayer insulating film on the first interlayer insulating film, forms metal pads on the second interlayer insulating film, forms a passivation layer on the metal pads, removes a portion of the passivation layer in a region adjacent to the seal-ring region to expose the second interlayer insulating film, etches a portion of the second interlayer insulating film, forms a bump on the metal pads, removes the first interlayer insulating film and the second interlayer insulating film in the region adjacent to the seal-ring region by a laser grooving process, and dices the wafer into a first semiconductor die and a second semiconductor die.
    Type: Application
    Filed: July 30, 2019
    Publication date: October 1, 2020
    Applicant: MagnaChip Semiconductor, Ltd.
    Inventors: Jae Sik CHOI, Jin Won JEONG, Byeung Soo SONG, Dong Ki SHIM, Jin Han BAE
  • Publication number: 20200254666
    Abstract: A resin composition useful for making an inside door handle with a skin-core structure made by using co-injection, an inside door handle manufactured using the resin composition, and a method for manufacturing such a door handle are provided herein.
    Type: Application
    Filed: April 27, 2020
    Publication date: August 13, 2020
    Applicants: Hyundai Motor Company, Kia Motors Corporation, LG CHEM, LTD.
    Inventors: Jae Sik Seo, Sung Ho Yoon, Woo Chul Jung, Jeong Moo Lee, Cheol Hwan Hwang, Woo Young Park, Dong Chul Shim
  • Patent number: 10693969
    Abstract: An apparatus and method for providing one or more protocols for one or more electronic devices are provided. The method includes establishing, by an electronic device configured to provide a framework interface by executing instructions stored in a memory, one or more physical channels with an external electronic device, using one or more communication modules, executing, by the electronic device, two or more application programs to interface with the framework interface, and communicating, via the framework interface, data from the two or more application programs through the one or more physical channels to the external electronic device, using at least one logical channel or session for a respective one of the two or more application programs.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: June 23, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-Soo Cho, Aravind Iyer, Mahesh Anjanappa, Ranjeet Kumar Patro, Prasad Tirumala Sree Hari Vara Vadlapudi, Suck-Ho Seo, In-Hyuk Choi, Il-Sung Hong, Abhijit C Pathak, Amit Prabhudesai, Ashok Subash, Ravindra Balkrishna Shet, Dong-Hyoun Son, Byeong-Ho Shim, Ji-Ryang Chung, Kangli Hao, Madhavan Vasudevan, Mahesh Malagouda Patil, M. S. S. K. Sharma, Ranjitsinh Udaysinh Wable, Shekhar Anantha Ambekar, Subba Reddy Venkata Kota, Raghavendra Vaddarahalli Ramegowda, Varunjith Therath Kainoth, Vishwanath Balekudige Gopalakrishna, Nam-Kun Kim, Young-Ju Kim, Jeong-Mi Kim, Chang-Sik Kim, Hyeong-Geun Kim, Shashanka Dasari, Gyu-Seok Shim, Won-Geun Shim, Anil Agiwal, Jin-Hyuk Lee, Sang-Hyun Han, In-Hyup Hwang, Ji-Young Hwang
  • Publication number: 20200173506
    Abstract: A brake disk of a composite material includes a load part and friction parts coupled to opposing sides of the load part, wherein the load part includes a reinforcing part formed of a carbon-carbon fiber (C-CF) material and a matrix part formed of a material including silicon carbide (SiC) and covering the reinforcing part, and a weight ratio of the reinforcing part is equal to or lower than a weight ratio of the matrix part in the load part.
    Type: Application
    Filed: April 3, 2019
    Publication date: June 4, 2020
    Inventors: Jae Hun Shim, Gab Bae Jeon, Joung Hee Lee, Dong Won Lim, Hong Sik Park
  • Patent number: 10663237
    Abstract: The present disclosure relates to a heat transfer tube comprising nanostructures formed on the surface, and a method for manufacturing the same, and by forming nanostructures on a heat transfer tube surface, a superhydrophobic surface may be obtained under a high temperature environment as well. In addition, superhydrophobicity may be enhanced by further forming a hydrophobic coating layer on the nanostructure-formed heat transfer tube surface. By using a method of forming nanostructures by dipping the heat transfer tube surface, complex shapes may be coated, and therefore, a plurality of assembled heat transfer tubes may be coated, and damages occurring during a process of assembling the heat transfer tube after coating may be prevented.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: May 26, 2020
    Assignees: Doosan Heavy Industries Construction Co., Ltd., UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
    Inventors: Jin Bum Kim, Hyun Sik Kim, Young Suk Nam, Kyoung Hwan Song, Seung Tae Oh, Jae Hwan Shim, Dong Hyun Seo
  • Publication number: 20190227150
    Abstract: The bi-directional optical integrated circuit device array includes a plurality of bi-directional optical integrated circuit unit devices integrated on a substrate and arranged in two-dimensions. Each of the bi-directional optical integrated circuit unit devices includes a single wavelength laser light source integrated on the substrate, a bi-directional optical device integrated on the substrate and optically connected to the laser light source, and an antenna integrated on the substrate and optically connected to the bi-directional optical device.
    Type: Application
    Filed: October 3, 2018
    Publication date: July 25, 2019
    Inventors: Dong-jae SHIN, Kyoung-ho HA, Seong-gu KIM, Yong-hwack SHIN, Chang-gyun SHIN, Dong-sik SHIM, Chang-bum LEE, Jung-ho CHA
  • Publication number: 20190227403
    Abstract: An optical beam steering device may include a tunable laser diode configured to emit laser beams and an antenna that includes a grating structure and is configured to convert the laser beams to a linear light source based on the grating structure. The tunable laser diode may emit a first laser beam having a first wavelength, and emit a second laser beam having a second wavelength, the second wavelength different from the first wavelength. The antenna may receive the first laser beam and, in response, output a first linear light source having a first emission angle with a surface of the antenna. The antenna may further receive the second laser beam and, in response, output a second linear light source having a second emission angle with the surface of the antenna, the second emission angle different from the first angle.
    Type: Application
    Filed: July 23, 2018
    Publication date: July 25, 2019
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dong Jae SHIN, Seong Gu KIM, Yong Hwack SHIN, Chang Gyun SHIN, Dong Sik SHIM, Chang Bum LEE, Jung Ho CHA, Kyoung Ho HA
  • Patent number: 10093534
    Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: October 9, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik Shim, Seog-woo Hong, Seok-whan Chung, Chang-jung Kim
  • Publication number: 20180201501
    Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.
    Type: Application
    Filed: March 16, 2018
    Publication date: July 19, 2018
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik SHIM, Seog-woo HONG, Seok-whan CHUNG, Chang-jung KIM
  • Patent number: 9957155
    Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: May 1, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik Shim, Seog-woo Hong, Seok-whan Chung, Chang-jung Kim
  • Patent number: 9664894
    Abstract: A micro optical switch device, an image display apparatus including the same, and a method of manufacturing the micro optical switch device are provided. The micro optical switch device includes a substrate; a first electrode disposed on the substrate and having a plurality of openings; a second electrode disposed above and spaced apart from the first electrode, and having a plurality of openings; and support units disposed on the substrate and configured to support the second electrode, wherein the support units include deformation preventing portions protruding beyond a top surface of the second electrode.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: May 30, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik Shim, Woon-bae Kim, Hyung Choi
  • Patent number: 9596528
    Abstract: A capacitive micromachined ultrasonic transducer includes a device substrate including a first trench confining a plurality of first parts corresponding to a plurality of elements and a second trench confining a second part separated from the plurality of first parts, a supporting unit provided on the device substrate for confining a plurality of cavities corresponding to each of the plurality of elements, a membrane provided on the supporting unit to cover the plurality of cavities, an upper electrode provided on the membrane and electrically connected to the second part in the second trench through a via hole passing through the membrane and the supporting unit, and a through-silicon via (TSV) substrate provided on a lower surface of the device substrate, and including a plurality of first via metals connected to the plurality of first parts and a second via metal connected to the second part.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: March 14, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik Shim, Seog-woo Hong, Seok-whan Chung, Chang-jung Kim
  • Patent number: 9475092
    Abstract: An electro-acoustic transducer includes: a conductive substrate in which a first trench is formed, and which includes an electrode connection unit surrounded by the first trench; a membrane provided on the conductive substrate; an upper electrode provided on the membrane to contact an upper surface of the electrode connection unit; a first electrode provided on a lower surface of the conductive substrate to contact a lower surface of the electrode connection unit; and a second electrode spaced apart from the first electrode and provided to contact the lower surface of the conductive substrate.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: October 25, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik Shim, Seog-woo Hong, Seok-whan Chung, Chang-jung Kim
  • Patent number: 9319800
    Abstract: An electro-acoustic transducer includes a conductive substrate provided with at least one cell and at least one electrode, and a pad substrate disposed corresponding to the conductive substrate and provided with at least one pad corresponding to the electrode, in which at least one of the electrode and the pad includes an electric pattern for electric connection and at least one dummy pattern that is provided around the electric pattern to be separated the electric pattern.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: April 19, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seog-woo Hong, Hyung-jae Shin, Dong-sik Shim, Byung-gil Jeong, Seok-whan Chung
  • Patent number: 9164276
    Abstract: A micro optical switching device is provided, including a substrate, a first electrode disposed on a first surface of the substrate and including a first opening array including having a first plurality of openings, a second electrode disposed over the first electrode and including a second opening array including a plurality of second openings which do not overlap with the plurality of first openings, and a support member disposed on the substrate. The support member has a thickness greater than a distance from the first surface of the substrate to the second electrode and protrudes above the second electrode.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: October 20, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Dong-sik Shim
  • Patent number: 9164278
    Abstract: A micro-optical switching device, an image display apparatus including the micro-optical switching device, and a method of manufacturing the micro-optical switching device are provided. The micro-optical switching device includes a substrate; a first electrode disposed on the substrate and including a first opening array, wherein the first opening array includes a plurality of openings; and a second electrode disposed spaced apart from the first electrode and including a second opening array including a plurality of openings, wherein the plurality of openings of the second opening array do not overlap with the plurality of openings of the first opening array.
    Type: Grant
    Filed: May 1, 2012
    Date of Patent: October 20, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik Shim, Jong-seok Kim, Yong-seop Yoon, Hyung Choi, Woon-bae Kim
  • Patent number: 9110318
    Abstract: A driving device of a display apparatus, and a method of manufacturing the driving device. The driving device may have a specific structure, and be manufactured in such a manner, because a first electrode of a micro optical switch device may be formed simultaneously with the formation of at least a source region and a drain region, or a gate electrode of an active device and a capacitor electrode.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: August 18, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik Shim, Woon-bae Kim, Hyung Choi
  • Publication number: 20150230029
    Abstract: An electro-acoustic transducer includes a conductive substrate provided with at least one cell and at least one electrode, and a pad substrate disposed corresponding to the conductive substrate and provided with at least one pad corresponding to the electrode, in which at least one of the electrode and the pad includes an electric pattern for electric connection and at least one dummy pattern that is provided around the electric pattern to be separated the electric pattern.
    Type: Application
    Filed: June 27, 2014
    Publication date: August 13, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seog-woo HONG, Hyung-jae SHIN, Dong-sik SHIM, Byung-gil JEONG, Seok-whan CHUNG
  • Publication number: 20150163599
    Abstract: An electro-acoustic transducer includes: a conductive substrate in which a first trench is formed, and which includes an electrode connection unit surrounded by the first trench; a membrane provided on the conductive substrate; an upper electrode provided on the membrane to contact an upper surface of the electrode connection unit; a first electrode provided on a lower surface of the conductive substrate to contact a lower surface of the electrode connection unit; and a second electrode spaced apart from the first electrode and provided to contact the lower surface of the conductive substrate.
    Type: Application
    Filed: May 27, 2014
    Publication date: June 11, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik SHIM, Seog-woo Hong, Seok-whan Chung, Chang-jung Kim
  • Publication number: 20150156571
    Abstract: A capacitive micromachined ultrasonic transducer includes a device substrate including a first trench confining a plurality of first parts corresponding to a plurality of elements and a second trench confining a second part separated from the plurality of first parts, a supporting unit provided on the device substrate for confining a plurality of cavities corresponding to each of the plurality of elements, a membrane provided on the supporting unit to cover the plurality of cavities, an upper electrode provided on the membrane and electrically connected to the second part in the second trench through a via hole passing through the membrane and the supporting unit, and a through-silicon via (TSV) substrate provided on a lower surface of the device substrate, and including a plurality of first via metals connected to the plurality of first parts and a second via metal connected to the second part.
    Type: Application
    Filed: May 19, 2014
    Publication date: June 4, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik SHIM, Seog-woo HONG, Seok-whan CHUNG, Chang-jung KIM