Abstract: An inkjet printhead and a method of manufacturing the same. The inkjet printhead may include a substrate through which an ink feed hole to supply ink is formed, a chamber layer stacked above the substrate and including a plurality of ink chambers filled with ink supplied from the ink feed hole, and a nozzle layer stacked on the chamber layer, wherein a plurality of nozzles through which ink is ejected and a plurality of via holes are formed in the nozzle layer.

Abstract: An inkjet printhead and a method of manufacturing the same. The inkjet printhead includes a substrate including one or more ink feed holes to supply ink, which penetrates through the substrate, a chamber layer stacked on the substrate and including a plurality of ink chambers, in which the ink supplied from the ink feed hole is filled, a nozzle layer stacked on the chamber layer and including a plurality of nozzles, through which the ink is ejected, and a support member attached on a lower surface of the substrate to support the substrate.

Abstract: A flip-chip package for implementing a fine solder ball, and a flip-chip packaging method using the same. The flip-chip package includes a first wafer having a first electrode and a first under bump metal (UBM) formed on the first electrode and electrically connected to the first electrode; and second wafer opposing the first wafer and having a second electrode located in a position corresponding to the first electrode, and a second UBM formed on the second electrode and electrically connected to the second electrode. The first wafer has a depression formed on one or more areas adjacent to the first UBM, which depression partly receives a solder ball that connects the first and the second UBMs upon flip-chip bonding of the first and second wafers. Since the UBM is formed as an embossing pattern, a fine solder ball can be implemented. Additionally, the reliability of the package can be improved.

Abstract: An inkjet printhead and a method of manufacturing the inkjet printhead. The inkjet printhead includes a substrate including a trench formed to a predetermined depth in an upper portion of the substrate and an ink feed hole formed through a bottom surface of the trench to supply ink, an etch stop layer formed of a metal and formed on an inner surface of the trench, a plurality of heaters, to create bubbles by heating ink, formed on the substrate, a plurality of electrodes, to apply a current to the plurality of heaters, formed on the substrate, a chamber layer stacked on the substrate and including a plurality of ink chambers formed above respective heaters to receive ink from the ink feed hole via the trench, and a nozzle layer stacked on the chamber layer and including a plurality of nozzles to eject ink from the plurality of ink chambers.

Abstract: Provided are a schottky diode having an appropriate low breakdown voltage to be used in a radio frequency identification (RFID) tag and a method for fabricating the same. The schottky diode includes a silicon substrate having a structure in which an N-type well is formed on a P-type substrate, an insulating layer surrounding a circumference of the N-type well so as to electrically separate the N-type well from the P-type substrate, an N+ doping layer partly formed in a portion of a region of an upper surface of the N-type well, an N? doping layer partly formed in the other portion of a region of the upper surface of the N-type well, a cathode formed on the N+ doping layer, and an anode formed on the N? doping layer.

Abstract: A limiter for controlling an overvoltage and an RFID tag having the same are provided. The limiter includes a first limiter part and a second limiter part serially connected to the first limiter part. The second limiter part has at least one limit diode whose threshold voltage is lower than that of elements in the first limiter part. Accordingly, if an overvoltage is input, the limiter can maximize the input current drop so that the limiter can maximize the leakage voltage. As a result, the RFID tag can prevent the RFID driving part from being damaged due to the overvoltage. In addition, the RFID tag can normally operate regardless of the intensity of the driving voltage input from the RFID reader, so that the yields of products can improve.

Abstract: Provided are an RFID tag capable of limiting an over-voltage and a method for controlling an over-voltage thereof. The RFID tag includes: an antenna unit receiving external electromagnetic waves to induce an input voltage; a voltage generator rectifying the input voltage to generate a driving voltage; a voltage limiter adaptively turned on and/or off depending on whether the input voltage is high or low to limit an intensity of the input voltage input into the voltage generator; and a logic controller controlling the antenna unit to generate authentication information based on the driving voltage and transmit the authentication information.

Abstract: A method of fabricating an inkjet printhead.

Abstract: Provided is a thermal inkjet printhead. The inkjet printhead includes a substrate; an insulating layer formed on the substrate; a heater formed on the insulating layer and an electrode to apply current to the heater; a chamber layer that is stacked on the insulating layer and includes an ink chamber; a nozzle layer that is stacked on the chamber layer and includes a nozzle; and at least a heat transfer layer that is formed inside the insulating layer and dissipates heat generated in by the heater toward the substrate.

Abstract: A method of fabricating inkjet print heads usable in an ink jet printer. The method of fabricating ink jet print heads includes preparing a plurality of ink jet print heads on a wafer while forming sub sidewalls around the ink jet print heads when the ink jet print heads are being prepared, attaching protection films onto the sub sidewalls of the wafer and the ink jet print heads, and dicing the ink jet print heads and detaching the individual ink jet print heads from the wafer. In the method, the ink jet print heads are diced in a wafer unit. Particularly, connect pads of the ink jet print heads can be prevented from being contaminated by the protection films.

Abstract: A heater to control an ink bubble, and an inkjet printhead having the heater. The heater has different resistances according to portions thereof.

Abstract: In a fluxgate sensor integrated in a semiconductor substrate and a method for manufacturing the same, the fluxgate sensor includes a soft magnetic core formed on the semiconductor substrate, an excitation coil winding the soft magnetic core and being insulated by first and second insulating layers deposited above and below the soft magnetic core, respectively, and a pick-up coil, winding the soft magnetic core and being insulated by third and fourth insulating layers deposited above and below the excitation coil, respectively.

Abstract: A method for manufacturing a metal structure using a trench includes etching a semiconductor substrate to form a trench, depositing a seed layer over the semiconductor substrate including in the trench, stacking an insulating layer over the seed layer, removing a portion of the insulating layer to expose a portion of the seed layer at a bottom of the trench, filling the trench with a metal material, and removing the seed layer and the insulating layer on the semiconductor substrate. As a result, a subsequent process in forming a multi-layered structure may be easily carried out, thereby simplifying a manufacturing process.

Abstract: Disclosed is a method for forming a plurality of metal structures having different heights on a semiconductor substrate. The disclosed method for manufacturing a metal structure having different heights includes: forming a plurality of seed layers, to have heights corresponding to the metal structure to be formed, on a semiconductor substrate so that those layers can be electrically separated, performing a plating process using a plating mold, and applying different currents to the respective seed layers so that the plating thickness can be adjusted for each of the seed layers. Accordingly, a plurality of metal structures having different heights can be obtained by a plating mold forming process and a plating process that are performed just once, respectively.

Abstract: Disclosed is a magnetic field sensor of high sensitivity, and which is power-saving and can be manufactured with low cost in a very small size. The magnetic field sensor includes a soft magnetic core formed to construct a closed-magnetic circuit on a semiconductor substrate, a magnetic field sensing coil formed by a metal film in a shape that winds the soft magnetic core, and a drive line for exciting the soft magnetic core by directly applying an electric current thereto. The drive line is formed in a rectangular angle to the magnetic field sensing coil, and connected to the both ends of the soft magnetic core in a length direction.

Abstract: Disclosed is a magnetic field sensor of high sensitivity, and which is power-saving and can be manufactured with low cost in a very small size. The magnetic field sensor includes a soft magnetic core formed to construct a closed-magnetic circuit on a semiconductor substrate, a magnetic field sensing coil formed by a metal film in a shape that winds the soft magnetic core, and a drive line for exciting the soft magnetic core by directly applying an electric current thereto. The drive line is formed in a rectangular angle to the magnetic field sensing coil, and connected to the both ends of the soft magnetic core in a length direction.

Abstract: A low leakage Schottky diode and fabrication method thereof. The Schottky diode includes a n-type semiconductor; an anode having a circular periphery formed in a region above the n-type semiconductor; and a cathode formed in a region above the n-type semiconductor and having a pattern surrounding and set apart from the outer periphery of the anode. Because there are no edges at the anode and cathode interface, leakage current is minimized.

Abstract: A semiconductor device using schottky diodes for removing noise, a fabrication method, and an electrostatic discharge prevention device are provided. The semiconductor device includes a P-well substrate; insulation layers deposited on etched regions of the substrate; an N-well layer deposited on an etched region of the P-well substrate between the insulation layers; P+ type implants injected to a first region and a second region of the N-well layer; and first and second metals formed in schottky contact on the first and second regions, respectively. The method includes etching away regions of a P-well substrate and depositing an insulation substance; etching away the P-well substrate and depositing the insulation substance between the insulation layers to create an N-well layer; injecting P+ type implants to a first region and a second region of the N-well layer; and forming first and second metals in schottky contact on the first and second regions, respectively.

Abstract: Disclosed is a magnetic field sensor of high sensitivity, and which is power-saving and can be manufactured with low cost in a very small size. The magnetic field sensor includes a soft magnetic core formed to construct a closed-magnetic circuit on a semiconductor substrate, a magnetic field sensing coil formed by a metal film in a shape that winds the soft magnetic core, and a drive line for exciting the soft magnetic core by directly applying an electric current thereto. The drive line is formed in a rectangular angle to the magnetic field sensing coil, and connected to the both ends of the soft magnetic core in a length direction.

Abstract: A method for manufacturing a magnetic field detecting element having a soft magnetic core formed on a substrate, first and second coils, each having coil lines, arranged above and below the core, the method including forming a seed film on the substrate, removing a portion of the seed film using a predetermined pattern so that coil lines constituting the first coil subsequently formed on the seed film are separated, forming a first plating mold having grooves corresponding to the predetermined pattern on an upper portion of the seed film, forming coil lines constituting the first coil by filling the grooves of the first plating mold with metal, forming the soft magnetic core and the second coil on an upper portion of the substrate and on the seed film where the first coil is formed, and cutting off edges of the substrate so that the separated coil lines are insulated.