Abstract: A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole.

Abstract: Disclosed are an ink ejecting device and a method of manufacturing the same. The disclosed ink ejecting device includes an inkjet head including a substrate, which includes an ink feed hole, a plurality of via holes, which are formed in the rear surface of the substrate, and which expose the ink feed holes therethtough, a chamber layer stacked on the substrate, and a nozzle layer stacked on the chamber layer, and includes a base header, which is attached to the inkjet head and includes a plurality of ink supply slots having a corresponding arrangement with respect to the via holes.

Abstract: Provided is a thermal inkjet printhead that includes a substrate, which may comprise an ink feed hole for supplying ink, a chamber layer, which is stacked on the substrate, and which comprises an ink chamber that is filled with the ink supplied from the ink feed hole, a heater, which is prepared inside the ink chamber and heats the ink, an island, which is formed on the substrate, and which is prepared at an ink inlet port of the ink chamber, and a nozzle layer, which is stacked on the chamber layer, and which comprises a nozzle for ejecting the ink. The walls of the ink chamber and the island that face each other are symmetrical with respect to the center of the nozzle.

Abstract: An apparatus to sense the temperature of an ink-jet head includes at least one or more CMOS (complementary metal oxide semiconductor) lateral BJTs (bipolar junction transistors) to sense the temperature of the ink-jet head, and a current supply unit to supply a current to the CMOS lateral BJTs. Minimum sized CMOS lateral BJTs are applied to an ink-jet printer head so that precise temperature control can be performed in a shuttle or array type ink-jet printer.

Abstract: An inkjet printhead and a method of manufacturing the same. The inkjet printhead includes a substrate, a chamber layer to define an ink chamber on an upper portion of the substrate, and an adhesive portion to adhere to the substrate and the chamber, wherein the adhesive portion is formed of a phenolic sensitive resin.

Abstract: An inkjet printhead and a method of manufacturing the same. The inkjet printhead includes a silicon on insulator (SOI) substrate including a lower silicon substrate, a middle insulating layer, an upper silicon substrate, and an ink feed hole, the ink feed hole penetrates the SOI substrate to supply ink, an insulating layer stacked on the upper silicon substrate of the SOI substrate, a chamber layer stacked on the insulating layer in which a plurality of ink chambers filled with ink supplied from the ink feed hole is formed, a nozzle layer stacked on the chamber layer in which a plurality of nozzles is formed to correspond to the ink chambers, a plurality of heaters formed on the insulating layer which heats ink in the ink chambers to generate bubbles and eject ink through the nozzles, and a driving circuit region on which a driving circuit is formed to drive the heaters.

Abstract: A method of fabricating an inkjet printhead.

Abstract: Provided are a method of manufacturing a photosensitive epoxy structure using a photolithograph process, and a method of manufacturing an inkjet printhead using the method of manufacturing a photosensitive epoxy structure. The method of manufacturing the photosensitive epoxy structure includes forming an epoxy material layer formed of photosensitive epoxy; forming a first exposure pattern in the epoxy material layer by performing a first exposure operation; forming a second exposure pattern in the non-exposed portions of the epoxy material layer by performing a second exposure operation; and developing the epoxy material layer, wherein the amount of first UV energy used in the first exposure operation is different from the amount of second UV energy used in the second exposure operation.

Abstract: A limiter for controlling an overvoltage and an RFID tag having the same are provided. The limiter includes a first limiter part and a second limiter part serially connected to the first limiter part. The second limiter part has at least one limit diode whose threshold voltage is lower than that of elements in the first limiter part. Accordingly, if an overvoltage is input, the limiter can maximize the input current drop so that the limiter can maximize the leakage voltage. As a result, the RFID tag can prevent the RFID driving part from being damaged due to the overvoltage. In addition, the RFID tag can normally operate regardless of the intensity of the driving voltage input from the RFID reader, so that the yields of products can improve.

Abstract: A method of manufacturing an inkjet printhead includes forming a chamber layer, in which a plurality of ink chambers is formed, on a substrate, forming trench to define an island surrounded by the trench on an upper part of the substrate by etching an upper surface of the substrate to a predetermined depth, forming a sacrifice layer on the chamber layer to fill the trenches and the ink chambers, forming a nozzle layer, in which a plurality of nozzles are formed, on the sacrifice layer and the chamber layer, forming an ink feed hole by etching a lower part of the substrate until the sacrifice layer that is filled in the trench is exposed, and removing the sacrifice layer and the island.

Abstract: An ink jet print head and a manufacturing method thereof that is improved so as to simplify a glue layer forming process including a glue layer of the ink jet print head is made of a silicone modified resin having a photosensitive property, such as a silicone modified polyimide resin. The glue layer can be formed by coating a silicone modified polyimide resin solution on a substrate, forming a silicone modified polyimide resin layer by vaporizing a solvent from the coated silicone modified polyimide resin solution, and patterning the silicone modified polyimide resin layer.

Abstract: An inkjet printhead includes a substrate in which an ink feed hole is formed, a plurality of ejection devices formed on the substrate at sides of the ink feed hole, a chamber layer stacked on the substrate and in which a plurality of ink chambers, which correspond to the ejection devices and in which ink supplied from the ink feed hole is filled, are formed, and a nozzle layer in which a plurality of nozzles corresponding to the ink chambers are formed, wherein the ink feed hole includes a plurality of through holes formed through the substrate in the thickness direction thereof.

Abstract: A MEMS (Micro Electro Mechanical System) device and a method of manufacturing the same, in which an detection indicator is formed on a chamber layer stacked on a substrate such that a user easily inspects whether the chamber layer has a required thickness. The MEMS device can include two detection indicators that are formed on the chamber layer and have different depth from each other, or an detection indicator which is formed on the chamber layer and has a tapered sectional shape in which an upper surface of the detection indicator is gradually narrowed in a downward direction such that a user can easily inspect whether the chamber layer has a required thickness. The user can precisely determine whether the chamber layer is planarized to a required thickness by planarizing the detection indicator formed on the chamber layer, and inspecting the detection indicator by using an optical microscope, thereby facilitating inspection for a thickness of the chamber layer.

Abstract: A method of fabricating inkjet print heads usable in an ink jet printer. The method of fabricating ink jet print heads includes preparing a plurality of ink jet print heads on a wafer while forming sub sidewalls around the ink jet print heads when the ink jet print heads are being prepared, attaching protection films onto the sub sidewalls of the wafer and the ink jet print heads, and dicing the ink jet print heads and detaching the individual ink jet print heads from the wafer. In the method, the ink jet print heads are diced in a wafer unit. Particularly, connect pads of the ink jet print heads can be prevented from being contaminated by the protection films.

Abstract: A method of manufacturing an inkjet printhead includes forming an insulating layer, heaters, and electrodes sequentially on a substrate, depositing a chamber layer having a plurality of ink chambers on the insulating layer, forming an ink feed hole in the substrate and the insulating layer to supply ink to the ink chambers, preparing a nozzle layer having a plurality of nozzles and an adhesive layer formed on a lower surface of the nozzle layer, and bonding the nozzle layer to the chamber layer.

Abstract: A low leakage Schottky diode and fabrication method thereof. The Schottky diode includes a n-type semiconductor; an anode having a circular periphery formed in a region above the n-type semiconductor; and a cathode formed in a region above the n-type semiconductor and having a pattern surrounding and set apart from the outer periphery of the anode. Because there are no edges at the anode and cathode interface, leakage current is minimized.

Abstract: A micro-machining method of manufacturing a micro fluxgate sensor manufactured having an amorphous magnetic core includes forming lower coils of an excitation coil and a magnetic field detecting coil on a wafer, depositing a first insulating layer on the lower coils and forming an amorphous magnetic core, depositing a second insulating layer on the amorphous magnetic core and forming upper coils connected to the lower coils to complete the excitation coil and the magnetic field detecting coil, and covering the excitation coil and the magnetic field detecting coil with a protective film, and etching the protective film to expose a portion of the excitation coil and magnetic field detecting coil, thereby forming a pad.

Abstract: A head chip usable in an image forming apparatus, the head chip includes a nozzle layer having a nozzle to discharge ink onto a recording medium, a substrate layer having an ink supplying slit provided to be parallel with the nozzle layer to supply the nozzle with the ink, and a reinforcing bridge provided along an extending direction of the ink supplying slit and blocks at least one region of the ink supplying slit.

Abstract: An inkjet print head includes a substrate in which an ink feed hole having an hourglass cross-section is formed, a chamber layer that is stacked on the substrate and has a plurality of ink chambers into which ink supplied from the ink feed hole is filled, and a nozzle layer that is stacked on the chamber layer and has a plurality of nozzles through which the ink is ejected.

Abstract: A thermal inkjet printhead includes a plurality of bonding pads to which an external voltage is applied, a plurality of common wires connected to the each of the bonding pads, respectively, a plurality of individual wires connected to each of the common wires, respectively, and heaters connected to each of the individual wires, respectively, to generate ink bubbles by heating ink, wherein each of the common wires includes a first metal layer and a first metal bump which are formed on the first metal layer.