Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a plurality of internal electrodes disposed inside the ceramic body and each exposed to first and second surfaces of the ceramic body and to one of the third and fourth surfaces, and a first side margin portion and a second side margin portion disposed on sides of the plurality of internal electrodes exposed to the first and second surfaces. The ceramic body includes an active portion including the plurality of internal electrodes disposed to overlap each other with the dielectric layer interposed therebetween to form capacitance, an upper cover portion disposed above the active portion, and a lower cover portion disposed below the active portion. The first and second side margin portions have a dielectric composition different from a dielectric composition of one of the upper cover portion and the lower cover portion.

Abstract: An electronic apparatus including: an electronic module; a display panel having a panel hole which overlaps the electronic module; and a window disposed on the display panel, wherein the window includes: a base substrate; a protective layer disposed on the base substrate and having an opening which overlaps the panel hole; and a cover glass disposed on the base substrate inside the opening.

Abstract: A quasi-coaxial transmission line, a semiconductor package including the same and a method of manufacturing the same are disclosed. The quasi-coaxial transmission line includes a core, which is formed through an upper surface and a lower surface of a base substrate so as to transmit an electrical signal, and a shield, which is spaced apart from the core and which coaxially surrounds a side surface of the core, at least a portion of the shield being removed so as to form an open portion. The quasi-coaxial transmission line is capable of preventing distortion of an electrical signal at a portion thereof that is connected to an external circuit board and to reduce an area of a semiconductor package including the quasi-coaxial transmission line.

Abstract: A waveguide package and a method for manufacturing the same are disclosed. The waveguide package includes a package structure including a waveguide opened toward one side surface of a substrate, a semiconductor chip mounted on one surface of the package structure and configured to output an electrical signal to the waveguide. Since an interior of the waveguide is filled with air, electrical loss of the waveguide is minimized The cavity is formed by processing the substrate made of photosensitive glass. Accordingly, the waveguide may be accurately formed. An electronic circuit may also be formed at the waveguide package. Accordingly, it may be possible to provide a waveguide package enhanced in degree of integration.

Abstract: A vertical field effect transistor according to an embodiment of the present invention does not require a spacer and, accordingly, remarkably alleviates the problem that electric charge is scattered at an interface, thereby having excellent electrical characteristics. The vertical field effect transistor includes a substrate, a source electrode positioned on the substrate, an active layer positioned on the source electrode and having vertically grown crystal grains, a drain electrode positioned on the active layer to be spaced by the active layer away from the source electrode, a gate insulating layer positioned on a lateral surface of the active layer, and a gate electrode positioned on the gate insulating layer.

Abstract: A semiconductor device is provided. The semiconductor device comprises an output terminal from which an output voltage is output, a switching converter configured to control the output voltage on the basis of a first reference voltage, a load capacitor configured to be charged with a voltage corresponding to the output voltage, a linear amplifier connected to one end of an alternating current (AC) coupling capacitor and configured to control a voltage of the AC coupling capacitor on the basis of a second reference voltage, and a switching circuit configured to control a charging speed of the load capacitor and control a connection between the output terminal and one end and another end of the AC coupling capacitor.

Abstract: Exemplary subpixel structures include a directional light-emitting diode structure characterized by a full-width-half-maximum (FWHM) of emitted light having a divergence angle of less than or about 10°. The subpixel structure further includes a lens positioned a first distance from the light-emitting diode structure, where the lens is shaped to focus the emitted light from the light-emitting diode structure. The subpixel structure still further includes a patterned light absorption barrier positioned a second distance from the lens. The patterned light absorption barrier defines an opening in the barrier, and the focal point of the light focused by the lens is positioned within the opening. The subpixels structures may be incorporated into a pixel structure, and pixel structures may be incorporated into a display that is free of a polarizer layer.

Abstract: A light-emitting pixel structure is described that may include a group of light-emitting diode structures, where each of the light-emitting diode structures is operable to emit light characterized by a different peak emission wavelength. The structures may also include a patterned light absorption barrier characterized by a group of openings in the barrier, where each of the openings permit a transmission of a portion of the light from one of the light-emitting diode structures through the barrier. The structures may further include a metasurface layer operable to change a direction of at least some of the light transmitted through the openings of the patterned light absorption barrier from the light-emitting diode structures.

Abstract: A semiconductor package including a semiconductor chip, and a package structure configured to accommodate the semiconductor chip, and a manufacturing method thereof are disclosed. The package structure includes a substrate having one surface and the other surface opposite to the one surface, at least one conductive via extending through one surface and the other surface of the substrate, a wiring layer formed at one surface of the substrate, to transmit an electrical signal, a chip accommodating portion formed through removal of a portion of the substrate from the other surface toward the one surface, and a contact pad connected to the wiring layer and formed to be exposed through the chip accommodating portion. The semiconductor chip is inserted into the chip accommodating portion and is connected to the contact pad. Since the semiconductor chip is mounted after formation of the package structure, yield of the semiconductor package increases.

Abstract: Provided is an equipment front end module (EFEM) including a base configured to communicate with a processor, a tray port on the base, the tray port being configured to load a tray including a stub and a grid holder, a working robot configured to move in a direction on the base, and grasp and convey the stub in the tray and the grid holder in the tray, and a shuttle port on the base, the shuttle port including a first groove configured to fix the stub, and a second groove configured to fix the grid holder, wherein the working robot is further configured to convey the stub to the first groove and convey the grid holder to the second groove.

Abstract: Provided are a slurry of graphene oxides with different degrees of oxidation, a composite film of graphene oxides, and a graphene heat-conducting film. The slurry of the graphene oxides comprises the graphene oxides and a solvent, and the graphene oxides include a strong graphene oxide and a weak graphene oxide, wherein the slurry comprises two graphene oxides with different degrees of oxidation, which can increase a carbon content in the graphene oxide per unit mass, so that the finally obtained graphene heat-conducting film has more carbon.

Abstract: An apparatus and method of controlling heat of an engine compartment when stopped are provided. The apparatus and method of controlling heat of an engine compartment improve fuel efficiency by managing heat of the engine compartment when a vehicle is stopped after driving.

Abstract: Provided is a tray including a plate including a first region and a second region, a first groove on the first region of the plate and to which a stub is fixed, and a second groove on the second region of the plate and to which a grid holder is fixed, wherein the stub is configured to store test wafer pieces, and wherein the grid holder is configured to store a test sample.

Abstract: A financial product information collecting platform system includes: a data collecting module configured to collect description data of one or more financial products from one or more financial institutions; a data processing module including a financial product database configured to store one or more normalized words and benefit structure information pre-designated in relation to financial products, and a data structurer configured to generate structured financial product information by matching the description data to the one or more normalized words and the benefit structure information; and a data providing module configured to provide the financial product information to a user.

Abstract: An embodiment of the present disclosure provides a resistive switching memory device including: a lower electrode; an amorphous metal oxide-based first active layer positioned on the lower electrode; an amorphous metal oxide-based second active layer positioned on the first active layer; and an upper electrode positioned on the second active layer, wherein the first active layer and the second active layer are made of the same substance but are different in electrical characteristic, thereby having a voluntary compliance current characteristic and a voluntary current rectification characteristic as a single device having a stable electrical characteristic, a method of manufacturing the resistive switching memory device, and an array including the resistive switching memory device.

Abstract: In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.

Abstract: Disclosed is a device and a method for measuring stream water depth in real-time through positioning data filtering to ensure the reliability of the measured water depth data even when the stream water depth measurement data is filtered and applied to a small stream having a small basin area and a steep slope. The device for measuring stream water depth in real-time through positioning data filtering includes: a measuring part for measuring the water depth of a stream to be measured; a positioning data filtering part for filtering the water depth data measured by the measuring means by a local linear regression-based bivariate scatterplot smoothing technique through elastic bandwidth application; and a water depth calculating part for calculating a water depth of the stream to be measured by using the positioning data filtered by the positioning data filtering part, and minimizing the uncertainty of the water depth measurement.

Abstract: A hybrid vehicle includes active air flaps provided on a front-end module and a controller that controls the active air flaps based on a coolant temperature according to an outdoor air temperature, an inverter temperature of a drive motor according to an outdoor air temperature, an inverter temperature of an starter-generator according to an outdoor air temperature, a temperature of a low DC converter according to an outdoor air temperature, a transmission oil temperature according to an outdoor air temperature, or an engine oil temperature according to an outdoor air temperature, controls the active air flaps based on a refrigerant pressure according to an outdoor air temperature, controls the active air flaps based on an operation mode of a cooling fan, or controls the active air flaps based on an intake temperature according to an outdoor air temperature for each of driving modes of the vehicle.

Abstract: A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.

Abstract: Provided is a recording medium for a nail sticker and a method of manufacturing the same, and more particularly, to a recording medium and a method of manufacturing the same, which show that an ink reception layer is formed on a base of a polyurethane material so that a nail sticker can be printed using a sublimation printer. The recording medium for a nail sticker comprises: a release paper; an adhesion layer formed on the release paper; a base of a polyurethane material attached onto the adhesion layer; an undercoating layer formed on the base; and an ink reception layer formed on the undercoating layer.