Abstract: A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

Abstract: Provided are an organic light emitting device including a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode, wherein the organic layer includes a first layer including an organic-metal complex represented by Formula 1 below, and a method of preparing the same: wherein Formula 1 is described in the description of the invention.

Abstract: A method for manufacturing a capacitor in a semiconductor device for securing capacitance without a merging phenomenon during a MPS grain growth process. The manufacturing step begins with a preparation of a substrate. The interlayer dielectric (ILD) layer is formed on the substrate and is etched to form conductive plug. Then, an etch barrier layer and a sacrifice insulating layer are formed on entire surface subsequently. A cylinder typed first electrode is formed over the conductive plug using the sacrifice insulating layer. Thereafter, first meta-stable poly silicon (MPS) grains are formed on inner wall of the first electrode except a bottom region thereof. However, second MPS grains with small sizes can be formed in the bottom region for increasing a storage area of the first electrode. Finally, a dielectric layer and a second electrode are formed on the first electrode subsequently.

Abstract: Provided are an aromatic heterocyclic compound represented by Formula 1 below, an organic light emitting diode including the same, and a method of manufacturing the organic light emitting diode: wherein descriptions of Formula 1 are the same as defined in the detailed description of the invention.

Abstract: Provided are a compound represented by Formula 1 and an organic light emitting device including the same: X—Ar1—Ar2—Y ??(1) where Ar1, Ar2, X, and Y are the same as in the detailed description. The organic light emitting device including the compound has low driving voltage, high brightness, high efficiency, and high color purity.

Abstract: Provided is an indeno indene-based compound represented by Formula 1: where R1, R2, R3, R4, R5 and R6 are the same as in the detailed description. An organic light emitting device including the indeno indene-based compound has low driving voltage, high efficiency, and high color purity.

Abstract: Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

Abstract: In a method of forming a pattern of an organic light emitting device (OLED), an organic material is evaporated in a predetermined pattern by using a pre-patterned heating element, and the evaporated organic material is transferred to a substrate where the OLED is formed. The method includes preparing a template having a heating element in a pattern corresponding to a multilayered structure of an OLED including a plurality of functional layers; forming an organic layer on the heating element; drawing a substrate for the OLED near to the heating element of the template; and transferring the organic layer on the heating element to the substrate by evaporating the organic layer using the heating element.

Abstract: The present invention provides an aromatic heterocyclic compound represented by Formula 1 below, an organic light-emitting diode including an organic layer comprising the aromatic heterocyclic compound, and a method of manufacturing the organic light-emitting diode: wherein A, Ar1, Ar2, n, m, and k are as described in the detailed description of the present invention.

Abstract: A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat source. The second base plate includes a penetrating hole spaced apart from an edge portion to hold the support unit and a second dissipating unit to dissipate the heat from the heat source. A coupling member is positioned on an upper surface of the support member and applies a force to the first and second base plates to thereby combine the first and second base plates to the heat source. The base plates are combined to the memory module without any loss of the surface area of the dissipating fin, to thereby improve the dissipation efficiency of the heat sink.

Abstract: Provided are an indene derivative compound represented by Formula 1 below and an organic light emitting device including the same: X—Ar1—Ar2—Y ??Formula 1 wherein Ar1, Ar2 and X are described in the detailed description, and Y is represented by one of Formulae 2a to 2d: wherein R1 to R4 and Z are described in the detailed description. An organic light emitting device having improved driving voltage properties, brightness, efficiency and color purity can be prepared by including the indene derivative compound.

Abstract: A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.

Abstract: An aromatic compound represented by Formula 1 below and an organic light-emitting diode including the same: M1-(B)n-M2 ??(1) The aromatic compound has excellent thermal stability and emission characteristics. Thus, the organic light-emitting diode employing the aromatic compound can exhibit a low driving voltage, high efficiency, and high brightness.

Abstract: A multicomponent carbon nanotube-polymer complex, a composition for forming the same, and a preparation method thereof are disclosed herein. A multicomponent carbon nanotube-polymer complex may include carbon nanotubes surface-modified with double bond-containing functional groups or carbon nanotubes surface-modified with oxirane groups and/or carbon nanotubes surface-modified with anhydride groups; a polymer binder; and/or acid-treated carbon nanotubes and/or pristine carbon nanotubes. The multicomponent carbon nanotube-polymer complex may exhibit remarkably improved mechanical and hardening properties, compared with conventional complexes using only carbon nanotubes and a polymer binder, and thus may be advantageously used as an electromagnetic wave shielding material and a conductive material.

Abstract: The present invention relates to a method for fabricating a capacitor of a semiconductor device. The method includes the steps of: forming a first amorphous silicon layer doped with an impurity in a predetermined first doping concentration suppressing dopants from locally agglomerating; forming an impurity undoped second amorphous silicon layer on the first amorphous silicon layer in an in-situ condition; forming a storage node by patterning the first amorphous silicon layer and the second amorphous silicon layer; forming silicon grains on a surface of the storage node; and doping the impurity to the storage node and the silicon grains until reaching a second predetermined concentration for providing conductivity required by the storage node.

Abstract: Example embodiments of the present invention include a printed circuit board (PCB) capable of controlling the size and position of voids during a surface mounting process. To this end, the PCB includes: an insulating plate made of an insulating material; printed circuit patterns formed on the insulating plate; a plurality of lands to support a plurality of solder joints, each land coupled to one end of each of the printed circuit patterns; and anti-wetting layers mounted on a surface of each of the lands for solder joint therein. The anti-wetting layers allow a void produced during a surface mounting process to move to a central surface on a pad, so that the solder joint reliability between the solder ball and the land is increased. As a result, the reliability of a semiconductor device is enhanced.

Abstract: An electronic device with a reworkable electronic component, a method of manufacturing the electronic device, and a method of reworking the electronic component are disclosed. The electronic device includes a first cavity provided in a board body. A first metal pattern is provided on the board body and adjacent to the first cavity. A first electronic component is provided in the first cavity. A first connection pattern is provided adjacent to an upper edge portion of the first electronic component and extends to the first metal pattern so that the first metal pattern is electrically connected to the first electronic component.

Abstract: Provided are an organic light emitting compound represented by Formula 1 below, an organic light emitting device comprising the same, and a method of manufacturing the light emitting device: wherein CY1, CY2, Ar1, R1 and R2 are described in the detailed description of the invention. An organic light emitting device comprising the organic light emitting compound has low turn-on voltage, high efficiency, high color purity and high luminance.

Abstract: Provided are an organic light emitting compound represented by Formula 1 below, an organic light emitting device comprising the same, and a method of manufacturing the organic light emitting device: where CY1 and CY2 are each independently a fused C6-C50 aromatic ring, Ar1 is a substituted or unsubstituted C6-C50 arylene group, Ar2, Ar3, Ar4, and Ar5 are each independently a substituted or unsubstituted C6-C50 aryl group, m and n are independently 0-3, and R1 and R2 are substituent groups. An organic light emitting device comprising the organic light emitting compound has low turn-on voltage, high efficiency, high color purity and high luminance.

Abstract: Provided are an anthracene derivative compound represented by Formula 1 below and an organic light-emitting device using the same: wherein Ar1 and Ar2 are each independently aromatic groups, R1 and R2 are each independently substituent groups, and X is a heteroatom or substituted heteroatom. The use of the anthracene derivative compound enables to produce an organic light-emitting device with better driving voltage, brightness, efficiency, and color purity.