Abstract: Provided are a compound represented by Formula 1 below and an organic light-emitting device including the same: wherein X is a C, Si, or Ge atom disubstituted with H or C1-60 organic groups, Ra-Rj are C1-60 organic groups, CY1 is a substituted or unsubstituted C5-C60 aromatic ring or a substituted or unsubstituted C2-C60 heteroaromatic ring, and n is 0 or 1. The use of the compound provides an organic light-emitting device having a low operating voltage and good efficiency and brightness.

Abstract: The present invention relates to a method for fabricating a capacitor of a semiconductor device. The method includes the steps of: forming a first amorphous silicon layer doped with an impurity in a predetermined first doping concentration suppressing dopants from locally agglomerating; forming an impurity undoped second amorphous silicon layer on the first amorphous silicon layer in an in-situ condition; forming a storage node by patterning the first amorphous silicon layer and the second amorphous silicon layer; forming silicon grains on a surface of the storage node; and doping the impurity to the storage node and the silicon grains until reaching a second predetermined concentration for providing conductivity required by the storage node.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed that are capable of preventing a short of lower electrodes caused by a leaning or lifting phenomenon while forming the lower electrodes and securing enough capacitance of a capacitor by widening an effective capacitor area. The inventive semiconductor device includes: a plurality of capacitor plugs disposed in an orderly separation distance; and a plurality of lower electrodes used for a capacitor and disposed in an orderly separation distance to be respectively connected with the capacitor plugs.

Abstract: A metal nanoparticle which is prepared by forming a self-assembled monolayer including a terminal reactive group on the surface thereof, and introducing a functional group capable of being removed by the action of an acid or an base into the terminal reactive group wherein the self-assembled monolayer is built up of a thiol, an isocyanide, an amine, a carboxylate or a phosphate compound having the terminal reactive group, or built up of a thiol, an isocyanide, an amine, a carboxylate or a phosphate compound having no terminal reactive group followed by introducing the terminal reactive group thereto; and a method for forming a conductive pattern using the same are provided.

Abstract: A printable metal nanoparticle having a self-assembled monolayer (SAM) composed of a compound containing a thiol (—SH), isocyanide (—CN), amino (—NH2), carboxylate (—COO) or phosphate group, as a linker, formed on the surface thereof, and a method for formation of a conductive pattern using the same are provided. The metal nanoparticles of an exemplary embodiment can be easily formed into a conductive film or pattern by a printing method, and the resulting film or pattern exhibits excellent conductivity which optimally may be adjusted if desired. Therefore, the resulting metal nanoparticles of can be used to advantage in the fields such as antistatic washable sticky mats, antistatic shoes, conductive polyurethane printer rollers, electromagnetic interference shielding materials, etc.

Abstract: Provided are an organic light-emitting compound that is a diarylethene derivative represented by Formula 1, and an organic electroluminescent (EL) device using the organic light-emitting compound, and a method of manufacturing the organic EL device: where R1, Ar1, Ar2, Ar3, Ar4, Ar5, Ar6, k, l, m, and n are the same as defined in the specification. The organic light-emitting compound contains a cis-diarylethene group linked with an aliphatic ring, and thus crystallization of the organic light-emitting compound is unlikely to occur and the compound is highly soluble to organic solvents and easily provides liquid formulation with organic solvents. Thus, the organic light-emitting compound can easily be used in organic EL devices. An organic EL device manufactured using the compound can have a thermostable layer and thus has improved light-emitting properties in term of superior turn-on voltage, efficiency, color purity, etc.

Abstract: Provided are an organic light-emitting compound represented by Formula 1 and an organic electroluminescent (EL) device using the same: The organic light-emitting compound has thermostability and photochemical stability in addition to superior electrical features. The organic EL device using the organic light-emitting compound has low driving voltage, high efficiency, and superior color purity.

Abstract: Provided are a dimethylenecyclohexane compound represented by Formula 1 below, a method of preparing the same and an organic light emitting device comprising the dimethylenecyclohexane compound: The organic light emitting device comprising the dimethylenecyclohexane compound represented by Formula 1 has a low driving voltage, excellent efficiency and improved color purity.

Abstract: Disclosed herein is a torsion beam axle-type rear suspension, which simplifies and minimizes the shape and size of a rubber bush that prevents oversteer due to lateral force generated during a turning movement of a vehicle, by causing toe-in.

Abstract: In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

Abstract: Provided is an arylene derivative including a polar functional group represented by Formula 1: An arylene derivative including a polar functional group has excellent solubility in an organic solvent. A soluble compound of the arylene derivative can be used to form a thermally stable organic layer which can be used to form an organic light emitting device having low operating voltage, high efficiency, and excellent brightness.

Abstract: Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

Abstract: In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed that are capable of preventing a short of lower electrodes caused by a leaning or lifting phenomenon while forming the lower electrodes and securing enough capacitance of a capacitor by widening an effective capacitor area. The inventive semiconductor device includes: a plurality of capacitor plugs disposed in an orderly separation distance; and a plurality of lower electrodes used for a capacitor and disposed in an orderly separation distance to be respectively connected with the capacitor plugs.

Abstract: In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

Abstract: Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.

Abstract: Disclosed herein is an SRAM-compatible memory for correcting invalid output data using parity and a method of driving the same. In the SRAM-compatible memory, input data and a parity value obtained from the input data are written in data banks and parity bank, respectively. When invalid data is output from a specific memory bank due to the performance of a refresh operation or other factors, the invalid data are corrected by a data corrector using the parity value written in the parity bank, thus generating output data having the same logic value as the input data. The SRAM-compatible memory prevents a reduction in operation speed due to an internal operation, such as a refresh operation.

Abstract: A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.

Abstract: An electronic component mounting apparatus that includes a demagnetizer used to demagnetize a head nozzle, and a method for demagnetizing an electronic component apparatus. The method may include setting conditions, mounting electronic components, and demagnetizing a head nozzle of the electronic component mounting apparatus based on the conditions.

Abstract: A donor substrate and a method of forming an organic semiconductor layer pattern using the donor substrate, whereby a donor substrate is formed using an organic semiconductor precursor having a thermally decomposable substituent through a wet process, the organic semiconductor precursor substrate in the donor substrate is transferred to a receptor substrate as a pattern and heated, and thus is changed into an organic semiconductor. As a result, an organic semiconductor layer pattern is obtained. The method can be used in the manufacture of various devices such as organic light emitting diode and organic thin film transistor. A low-molecular weight organic semiconductor layer pattern can be formed through a wet process, not through deposition. Thus, using the method, a flat display device can be conveniently manufactured at low cost.