Patents by Inventor Dongdong Wang

Dongdong Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD
    Publication number: 20100118502
    Abstract: Chip capacitors are provided in a printed circuit board. In this manner, the distance between an IC chip and each chip capacitor is shortened, and the loop inductance is reduced. In addition, the chip capacitors are accommodated in a core substrate having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
    Type: Application
    Filed: January 21, 2010
    Publication date: May 13, 2010
    Applicant: IBIDEN CO., LTD.
    Inventors: Yasushi INAGAKI, Motoo Asai, Dongdong Wang, Hideo Yabashi, Seiji Shirai
  • MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD
    Publication number: 20100031503
    Abstract: A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, removing a film on a surface of a die pad of said electronic component, forming a mediate layer to be connected to a via hole of a lowermost interlayer insulating layer, on said die pad, forming the interlayer insulating layers on said substrate, and forming the via holes connected to the conductor circuits and the mediate layers, in said interlayer resin insulating layers.
    Type: Application
    Filed: October 1, 2009
    Publication date: February 11, 2010
    Applicant: IBIDEN CO., LTD.
    Inventors: Hajime SAKAMOTO, Tadashi SUGIYAMA, Dongdong WANG, Takashi KARIYA
  • MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD
    Publication number: 20100018049
    Abstract: A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, forming a positioning mark on said substrate based on a positioning mark of said electronic component, and conducting working or formation based on the positioning mark of said substrate.
    Type: Application
    Filed: October 1, 2009
    Publication date: January 28, 2010
    Applicant: IBIDEN CO., LTD.
    Inventors: Hajime SAKAMOTO, Tadashi SUGIYAMA, Dongdong WANG, Takashi KARIYA
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
    Publication number: 20100014261
    Abstract: A printed circuit board includes a core substrate having an opening portion, an electronic component provided in the opening portion of the core substrate and including a dielectric body, a first electrode formed over the dielectric body, and a second electrode formed over the dielectric body such that the dielectric body is interposed between the first electrode and the second electrode, and a resin filling a gap between the core substrate and the electronic component in the opening portion of the core substrate. The resin filling the gap includes a filler.
    Type: Application
    Filed: September 25, 2009
    Publication date: January 21, 2010
    Applicant: IBIDEN CO., LTD.
    Inventors: Yasushi INAGAKI, Motoo ASAI, Dongdong WANG, Hideo YABASHI, Seiji SHIRAI
  • SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD
    Publication number: 20090263939
    Abstract: A transition layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on an aluminum pad 24, it is possible to prevent a resin residue on the pad 24 and to improve connection characteristics between the die pad 24 and a via hole 60 and reliability.
    Type: Application
    Filed: July 1, 2009
    Publication date: October 22, 2009
    Applicant: IBIDEN CO., LTD.
    Inventors: Hajime SAKAMOTO, Dongdong WANG
  • PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
    Publication number: 20090205857
    Abstract: A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulating layer has a via hole filled up with plating and is formed of a linear polyolefin resin formed by hot-pressing a film shaped resin.
    Type: Application
    Filed: April 8, 2009
    Publication date: August 20, 2009
    Applicant: IBIDEN CO., LTD
    Inventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
  • PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
    Publication number: 20090188708
    Abstract: A method of manufacturing a multilayer printed circuit board including preparing a substrate board having a conductor circuit formed over the substrate board, forming an interlayer resin insulating layer on the conductor circuit formed over the substrate board by press laminating on the conductor circuit a film comprising a cycloolefin resin under vacuum or reduced pressure, and forming a via hole connecting to the conductor circuit through the resin insulating layer, the forming of the via hole including plating the via hole to fill up.
    Type: Application
    Filed: March 24, 2009
    Publication date: July 30, 2009
    Applicant: IBIDEN CO., LTD
    Inventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
  • PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
    Publication number: 20090183904
    Abstract: A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.
    Type: Application
    Filed: March 24, 2009
    Publication date: July 23, 2009
    Applicant: IBIDEN CO., LTD.
    Inventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
  • Printed wiring board and method for producing the same
    Patent number: 7535095
    Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in fracture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
    Type: Grant
    Filed: September 28, 1999
    Date of Patent: May 19, 2009
    Assignee: Ibiden Co., Ltd.
    Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
  • PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
    Publication number: 20090090003
    Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
    Type: Application
    Filed: June 25, 2008
    Publication date: April 9, 2009
    Applicant: IBIDEN CO., LTD
    Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
  • SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD
    Publication number: 20090077796
    Abstract: A method of manufacturing a core substrate having an electronic component, including providing a core substrate having a first surface and a second surface on an opposite side of the first surface, forming a through hole extending from the first surface to the second surface in the core substrate, attaching an adhesive tape to the second surface of the core substrate such that the through hole formed in the core substrate is closed on the second surface, attaching an electronic component to the adhesive tape inside the through hole, filling the through hole with a filler, and removing the adhesive tape from the second surface of the core substrate.
    Type: Application
    Filed: November 19, 2008
    Publication date: March 26, 2009
    Applicant: IBIDEN CO., LTD.
    Inventors: Hajime Sakamoto, Dongdong Wang
  • PRINTED CIRCUIT BOARD MANUFACTURING METHOD
    Publication number: 20090070996
    Abstract: A method for manufacturing a printed circuit board, including providing a core substrate and an electronic component contained in the core substrate, the electronic component having a die pad, forming a positioning mark on the core substrate, forming an interlayer insulating layer over the core substrate and the electronic component, forming a via hole opening connecting to the die pad of the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate, and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the die pad.
    Type: Application
    Filed: November 19, 2008
    Publication date: March 19, 2009
    Applicant: IBIDEN CO., LTD.
    Inventors: Hajime SAKAMOTO, Tadashi Sugiyama, Dongdong Wang, Takashi Kariya
  • Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same
    Patent number: 7504719
    Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
    Type: Grant
    Filed: July 26, 2005
    Date of Patent: March 17, 2009
    Assignee: Ibiden Co., Ltd.
    Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
  • PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
    Publication number: 20080289176
    Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
    Type: Application
    Filed: June 25, 2008
    Publication date: November 27, 2008
    Applicant: IBIDEN CO., LTD
    Inventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
  • PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
    Publication number: 20080289864
    Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
    Type: Application
    Filed: June 25, 2008
    Publication date: November 27, 2008
    Applicant: IBIDEN CO., LTD
    Inventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
  • PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
    Publication number: 20080292852
    Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
    Type: Application
    Filed: June 25, 2008
    Publication date: November 27, 2008
    Applicant: IBIDEN CO., LTD
    Inventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
  • MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
    Publication number: 20080277148
    Abstract: A metal layer 18 is sandwiched between insulating layers 14 and 20 so that required strength is maintained. Hence it follows that the thickness of a core substrate 30 can be reduced and, therefore, the thickness of a multi-layer printed circuit board can be reduced. Formation of non-penetrating openings 22 which reach the metal layer 18 in the insulating layers 14 and 20 is simply required. Therefore, small non-penetrating openings 22 can easily be formed by applying laser beams. Thus, through holes 36 each having a small diameter can be formed.
    Type: Application
    Filed: July 11, 2008
    Publication date: November 13, 2008
    Applicant: IBIDEN CO., LTD
    Inventors: Motoo Asai, Dongdong Wang, Takahiro Mori
  • Multilayer printed circuit board
    Patent number: 7435910
    Abstract: A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.
    Type: Grant
    Filed: March 4, 2004
    Date of Patent: October 14, 2008
    Assignee: Ibiden Co., Ltd.
    Inventors: Hajime Sakamoto, Tadashi Sugiyama, Dongdong Wang, Takashi Kariya
  • SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD
    Publication number: 20080230914
    Abstract: A transition layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on an aluminum pad 24, it is possible to prevent a resin residue on the pad 24 and to improve connection characteristics between the die pad 24 and a via hole 60 and reliability.
    Type: Application
    Filed: April 22, 2008
    Publication date: September 25, 2008
    Applicant: IBIDEN CO., LTD.
    Inventors: Hajime Sakamoto, Dongdong Wang
  • MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD
    Publication number: 20080201944
    Abstract: A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.
    Type: Application
    Filed: April 15, 2008
    Publication date: August 28, 2008
    Applicant: IBIDEN CO., LTD.
    Inventors: Hajime SAKAMOTO, Tadashi Sugiyama, Dongdong Wang, Takashi Kariya