Abstract: Systems and methods are described including a page buffer to reduce a threshold voltage distribution skew of memory cells and improve programming performance. The page buffer includes a first circuit element connected to a first terminal for supplying a first bitline voltage, a second circuit element connected to a second terminal for supplying a second bitline voltage, and a latch configured to control the first and second circuit elements.

Abstract: A three-dimensional (3D) semiconductor memory device includes a peripheral logic structure on a substrate and including a peripheral circuits, horizontal semiconductor layers on the peripheral logic structure, a stack structures in which mold layers and electrode pads are alternately stacked in a first direction on the horizontal semiconductor layers, electrode isolation regions separating the stack structures and extending in the first direction and a second direction, the electrode isolation regions being connected to the horizontal semiconductor layers, and through-via structures in the peripheral logic structure. The through-via structures penetrate the stack structures in the first direction. Each of the through-via structures have one side connected to a corresponding one of the through channel contacts. Capacitors are formed by electrode pads respectively with at least one of the electrode isolation regions or with at least one of the through-via structures.

Abstract: A three-dimensional (3D) semiconductor memory device includes a peripheral logic structure disposed on a first substrate, a horizontal semiconductor layer disposed on a second substrate, a plurality of stack structures on the horizontal semiconductor layer in a first direction, wherein the plurality of stack structures include a memory cell region and a capacitor region, a plurality of electrode isolation regions extending in the first direction and a second direction and configured to separate the plurality of stack structures to be connected to the horizontal semiconductor layer and a plurality of through-via structures having a first side connected to a through channel contact through at least one metal pad, wherein a capacitor is formed between each of electrode pads and at least one of electrode isolation regions in the plurality of stack structures or at least one of the plurality of through-via structures.

Abstract: Systems and methods are described including a page buffer to reduce a threshold voltage distribution skew of memory cells and improve programming performance. The page buffer includes a first circuit element connected to a first terminal for supplying a first bitline voltage, a second circuit element connected to a second terminal for supplying a second bitline voltage, and a latch configured to control the first and second circuit elements.

Abstract: Systems and methods are described including a page buffer to reduce a threshold voltage distribution skew of memory cells and improve programming performance. The page buffer includes a first circuit element connected to a first terminal for supplying a first bitline voltage, a second circuit element connected to a second terminal for supplying a second bitline voltage, and a latch configured to control the first and second circuit elements.

Abstract: A three-dimensional (3D) semiconductor memory device includes a peripheral logic structure disposed on a first substrate, a horizontal semiconductor layer disposed on a second substrate, a plurality of stack structures on the horizontal semiconductor layer in a first direction, wherein the plurality of stack structures include a memory cell region and a capacitor region, a plurality of electrode isolation regions extending in the first direction and a second direction and configured to separate the plurality of stack structures to be connected to the horizontal semiconductor layer and a plurality of through-via structures having a first side connected to a through channel contact through at least one metal pad, wherein a capacitor is formed between each of electrode pads and at least one of electrode isolation regions in the plurality of stack structures or at least one of the plurality of through-via structures.

Abstract: A three-dimensional (3D) semiconductor memory device includes a peripheral logic structure on a substrate and including a peripheral circuits, horizontal semiconductor layers on the peripheral logic structure, a stack structures in which mold layers and electrode pads are alternately stacked in a first direction on the horizontal semiconductor layers, electrode isolation regions separating the stack structures and extending in the first direction and a second direction, the electrode isolation regions being connected to the horizontal semiconductor layers, and through-via structures in the peripheral logic structure. The through-via structures penetrate the stack structures in the first direction. Each of the through-via structures have one side connected to a corresponding one of the through channel contacts. Capacitors are formed by electrode pads respectively with at least one of the electrode isolation regions or with at least one of the through-via structures.

Abstract: Systems and methods are described including a page buffer to reduce a threshold voltage distribution skew of memory cells and improve programming performance. The page buffer includes a first circuit element connected to a first terminal for supplying a first bitline voltage, a second circuit element connected to a second terminal for supplying a second bitline voltage, and a latch configured to control the first and second circuit elements.

Abstract: In alternative embodiments, provided are high-throughput, multiplexed systems or methods for detecting a chemical, biological, a physiological or a pathological analyte, or a single molecule or a single cell in droplets using the floating droplet array system, whereby droplets are trapped in an array of trapping structures. In alternative embodiments, high-throughput, multiplexed systems as provided herein are integrated with portable imaging systems such as CCD, CMOS, digital camera, or cell phone-based imaging.

Abstract: In one embodiment, the data storage apparatus includes a control unit configured to decode at least one input command and configured to generate at least one of a read signal and a start signal in response to the input command. The start signal indicates to start an internal mode determination process. The data storage apparatus also includes a memory unit configured to output data in response to the read signal, and a coding unit configured to start and perform the internal mode determination process in response to the start signal. The internal mode determination process includes autonomously determining a coding mode, and the coding unit is configured to code the output data based on the determined coding mode to produce coded data.

Abstract: A memory device may include an input/output control unit for receiving input signals through an input/output bus, and a control logic unit for receiving control signals, and when the control signals satisfy first through fourth conditions, the control logic unit identifies a command, an address, data and an identifier of the memory device in the input signals, and latches the input signals. The fourth condition is different from the first through third conditions.

Abstract: A non-volatile memory device and a method of programming a non-volatile memory device including a plurality of memory cells that are stacked in a vertical direction over a substrate and connected to n word lines, wherein n is an integer greater than or equal to 3. The method includes programming memory cells of second to n?1-th word lines, from among first to n-th word lines that are sequentially disposed in the vertical direction over the substrate, to a multi-level state, wherein a multi-level program operation is sequentially performed from the second to n?1-th word lines in an order in which the word lines are disposed; and programming memory cells of the first word line to a single level state after the programming memory cells of the second to n?1-th word lines to a multi-level state.

Abstract: A method of operating a nonvolatile memory device includes performing a first memory operation on a first memory block of a plurality of memory blocks and a curing operation on a portion of the first memory block when a status signal indicates a ready state of the nonvolatile memory device during an interval equal to or greater than a reference interval after the first memory operation is completed. The nonvolatile memory device includes the plurality of memory blocks, each memory block including a plurality of vertical strings extending in a vertical direction with respect to a substrate.

Abstract: A non-volatile memory device and a method of programming a non-volatile memory device including a plurality of memory cells that are stacked in a vertical direction over a substrate and connected to n word lines, wherein n is an integer greater than or equal to 3. The method includes programming memory cells of second to n?1-th word lines, from among first to n-th word lines that are sequentially disposed in the vertical direction over the substrate, to a multi-level state, wherein a multi-level program operation is sequentially performed from the second to n?1-th word lines in an order in which the word lines are disposed; and programming memory cells of the first word line to a single level state after the programming memory cells of the second to n?1-th word lines to a multi-level state.

Abstract: A non-volatile memory device and a method of programming a non-volatile memory device including a plurality of memory cells that are stacked in a vertical direction over a substrate and connected to n word lines, wherein n is an integer greater than or equal to 3. The method includes programming memory cells of second to n?1-th word lines, from among first to n-th word lines that are sequentially disposed in the vertical direction over the substrate, to a multi-level state, wherein a multi-level program operation is sequentially performed from the second to n?1-th word lines in an order in which the word lines are disposed; and programming memory cells of the first word line to a single level state after the programming memory cells of the second to n?1-th word lines to a multi-level state.

Abstract: A method of operating a nonvolatile memory device includes performing a first memory operation on a first memory block of a plurality of memory blocks and a curing operation on a portion of the first memory block when a status signal indicates a ready state of the nonvolatile memory device during an interval equal to or greater than a reference interval after the first memory operation is completed. The nonvolatile memory device includes the plurality of memory blocks, each memory block including a plurality of vertical strings extending in a vertical direction with respect to a substrate.

Abstract: A memory device may include an input/output control unit for receiving input signals through an input/output bus, and a control logic unit for receiving control signals, and when the control signals satisfy first through fourth conditions, the control logic unit identifies a command, an address, data and an identifier of the memory device in the input signals, and latches the input signals. The fourth condition is different from the first through third conditions.

Abstract: In one embodiment, the data storage apparatus includes a control unit configured to decode at least one input command and configured to generate at least one of a read signal and a start signal in response to the input command. The start signal indicates to start an internal mode determination process. The data storage apparatus also includes a memory unit configured to output data in response to the read signal, and a coding unit configured to start and perform the internal mode determination process in response to the start signal. The internal mode determination process includes autonomously determining a coding mode, and the coding unit is configured to code the output data based on the determined coding mode to produce coded data.

Abstract: A semiconductor memory device is configured to perform a first verification operation by setting an initial voltage level of a verification voltage to a first voltage level and boosting the verification voltage during a first period. The semiconductor memory device includes a memory cell array that stores program data, a sensor generating sensing data, and a condition determination unit comparing the program data and the sensing data.

Abstract: A non-volatile memory device and a method of programming a non-volatile memory device including a plurality of memory cells that are stacked in a vertical direction over a substrate and connected to n word lines, wherein n is an integer greater than or equal to 3. The method includes programming memory cells of second to n?1-th word lines, from among first to n-th word lines that are sequentially disposed in the vertical direction over the substrate, to a multi-level state, wherein a multi-level program operation is sequentially performed from the second to n?1-th word lines in an order in which the word lines are disposed; and programming memory cells of the first word line to a single level state after the programming memory cells of the second to n?1-th word lines to a multi-level state.