Abstract: A micro-mirror array that is useful, for example, in a reflective spatial light modulator. In one embodiment, the micro mirror array includes spacer support walls, a vertical torsion hinge, and a mirror plate, all being fabricated from a single wafer. The micro-mirror array has a large fill ratio.

Abstract: A micro-mirror array that is useful, for example, in a reflective spatial light modulator. In one embodiment, the micro mirror array includes spacer support walls, a vertical torsion hinge, and a mirror plate, all being fabricated from a single wafer. The micro-mirror array has a large fill ratio.

Abstract: A system for hermetically sealing devices includes a substrate, which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The system also includes a transparent member of a predetermined thickness, which includes a plurality of recessed regions arranged in a spatial manner as a second array and each of the recessed regions are bordered by a standoff region. The substrate and the transparent member are aligned in a manner to couple each of the plurality of recessed regions to a respective one of said plurality of chips. Each of the chips within one of the respective recessed regions is hermetically sealed by contacting the standoff region of the transparent member to the plurality of first street regions and second street regions using at least a bonding process to isolate each of the chips within one of the recessed regions.

Abstract: A method of fabricating an integrated spatial light modulator. The method includes providing a first substrate including a bonding surface and processing a device substrate to form at least an electrode layer. The method also includes depositing a first portion of a multi-layer standoff layer on the electrode layer, depositing a second portion of the multi-layer standoff layer on the first portion of the multi-layer standoff layer, and forming electrically insulating standoff structures from the multi-layer standoff layer. The method further includes joining the bonding surface of the first substrate to the standoff structures on the device substrate, thinning the first substrate, patterning the first substrate to form a mask, and forming a plurality of moveable structures from the first substrate. The moveable structures are aligned with at least one of the plurality of electrodes and adapted to rotate with respect to the standoff structures.

Abstract: Embodiments of the present invention generally relate to a process of forming a device that has an improved usable lifetime due to the addition of a gas-phase lubricant that reduces the likelihood of stiction occurring between the various moving parts in an electromechanical device. One advantage of the disclosed device is that a gas-phase lubricant has a high diffusion rate and, therefore, is self-replenishing, meaning that it can quickly move back into a contact region after being physically displaced from the region by the contacting surfaces of the device during operation. Consequently, the gas-phase lubricant is more reliable than conventional solid or liquid lubricants in preventing stiction-related device failures.

Abstract: Embodiments of the present invention generally relate to a device that has an improved usable lifetime due to the presence of a lubricant that reduces the likelihood of stiction occurring between the various moving parts in an electromechanical device. Embodiments of the present invention also generally include a device, and a method of forming a device, that has one or more surfaces or regions that have a volume of lubricant disposed thereon that acts as a ready supply of “fresh” lubricant to prevent stiction occurring between interacting components found within the device. In one aspect, components within the volume of lubricant form a gas or vapor phase that reduces the chances of stiction-related failure in the formed device. In one example, aspects of this invention may be especially useful for fabricating and using micromechanical devices, such as MEMS devices, NEMS devices, or other similar thermal or fluidic devices.

Abstract: One embodiment of an micromechanical device includes a first contact surface, a moveable component having a second contact surface, where the second contact surface interacts with the first contact surface during device operation, and a gas-phase lubricant disposed between the first contact surface and the second contact surface, where the gas-phase lubricant is adapted to reduce stiction-related forces between the first contact surface and the second contact surface. One advantage of the disclosed device is that a gas-phase lubricant has a high diffusion rate and, therefore, is self-replenishing, meaning that it can quickly move back into a contact region after being physically displaced from the region by the contacting surfaces of the device during operation. Consequently, the gas-phase lubricant is more reliable than conventional solid or liquid lubricants in preventing stiction-related device failures.

Abstract: One embodiment of an micromechanical device includes a first contact surface, a moveable component having a second contact surface, where the second contact surface interacts with the first contact surface during device operation, and a gas-phase lubricant disposed between the first contact surface and the second contact surface, where the gas-phase lubricant is adapted to reduce stiction-related forces between the first contact surface and the second contact surface. One advantage of the disclosed device is that a gas-phase lubricant has a high diffusion rate and, therefore, is self-replenishing, meaning that it can quickly move back into a contact region after being physically displaced from the region by the contacting surfaces of the device during operation. Consequently, the gas-phase lubricant is more reliable than conventional solid or liquid lubricants in preventing stiction-related device failures.

Abstract: Embodiments of the present invention generally relate to a device that has an improved usable lifetime due to the presence of a lubricant that reduces the likelihood of stiction occurring between the various moving parts in an electromechanical device. Embodiments of the present invention also generally include a device, and a method of forming a device, that has one or more surfaces or regions that have a volume of lubricant disposed thereon that acts as a ready supply of “fresh” lubricant to prevent stiction occurring between interacting components found within the device. In one aspect, components within the volume of lubricant form a gas or vapor phase that reduces the chances of stiction-related failure in the formed device. In one example, aspects of this invention may be especially useful for fabricating and using micromechanical devices, such as MEMS devices, NEMS devices, or other similar thermal or fluidic devices.

Abstract: Embodiments of the present invention generally relate to a device that has an improved usable lifetime due to the presence of a lubricant that reduces the likelihood of stiction occurring between the various moving parts in an electromechanical device. Embodiments of the present invention also generally include a device, and a method of forming a device, that has one or more surfaces or regions that have a volume of lubricant disposed thereon that acts as a ready supply of “fresh” lubricant to prevent stiction occurring between interacting components found within the device. In one aspect, components within the volume of lubricant form a gas or vapor phase that reduces the chances of stiction-related failure in the formed device. In one example, aspects of this invention may be especially useful for fabricating and using micromechanical devices, such as MEMS devices, NEMS devices, or other similar thermal or fluidic devices.

Abstract: An optical deflection device for a display application. The optical deflection device includes a semiconductor substrate including an upper surface region and one or more electrode devices provided overlying the upper surface region. The optical deflection device also includes a hinge device including a silicon material and coupled to the upper surface region. The optical deflection device further includes a spacing defined between the upper surface region and the hinge device and a mirror structure including a post portion coupled to the hinge device and a mirror plate portion coupled to the post portion and overlying the hinge device.

Abstract: A display system includes a light source and a first optical system coupled to the light source and adapted to provide an illumination beam along an illumination path. The display system also includes a spatial light modulator positioned in the illumination path. The spatial light modulator includes a semiconductor substrate including a plurality of electrode devices and a hinge structure coupled to the semiconductor substrate. The hinge structure includes silicon material. The spatial light modulator also includes a mirror post coupled to the hinge structure and extending to a predetermined distance from the semiconductor substrate and a mirror plate coupled to the mirror post and overlying the plurality of electrode devices. The display system further includes a second optical system coupled to the spatial light modulator and adapted to project an image onto a projection surface.

Abstract: A system for hermetically sealing devices. The system includes a substrate, which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The system also includes a transparent member of a predetermined thickness, which includes a plurality of recessed regions arranged in a spatial manner as a second array and each of the recessed regions are bordered by a standoff region. The substrate and the transparent member are aligned in a manner to couple each of the plurality of recessed regions to a respective one of said plurality of chips. Each of the chips within one of the respective recessed regions is hermetically sealed by contacting the standoff region of the transparent member to the plurality of first street regions and second street regions using at least a bonding process to isolate each of the chips within one of the recessed regions.

Abstract: A method of fabricating an integrated spatial light modulator. The method includes providing a first substrate including a bonding surface, processing a device substrate to form at least an electrode layer, the electrode layer including a plurality of electrodes, and depositing a standoff layer on the electrode layer. The method further includes forming standoff structures from the standoff layer and joining the bonding surface of the first substrate to the standoff structures on the device substrate. In a particular embodiment, the method further includes, after the step of depositing a standoff layer, performing chemical mechanical polishing of the standoff layer to planarize an upper surface of the standoff layer.

Abstract: A micro-mirror array that is useful, for example, in a reflective spatial light modulator. In one embodiment, the micro mirror array includes spacer support walls, a vertical torsion hinge, and a mirror plate, all being fabricated from a single wafer. The micro-mirror array has a large fill ratio.

Abstract: A micro-mirror array fabricated on one substrate is bonded to a second substrate that includes addressing electrodes and control circuitry. In one embodiment, the micro mirror array is fabricated from a substrate that is a single crystal material. There is enough area beneath the micro mirror array for electrodes and control circuitry, including memory buffers and a pulse width modulation array to be fabricated on the second substrate.

Abstract: Fabrication of a reflective spatial light modulator including a micro-mirror array. In one embodiment, the micro-mirror array is fabricated from a substrate that is a single crystal material by only two main etching steps. A first etch forms cavities in a first side of the material. A second etch forms support post, a vertical hinge, and a mirror plate. Between the first and second etches, the substrate can be bonded to addressing and control circuitry.

Abstract: A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member.

Abstract: An electro-mechanical system, the system comprising a first surface with an electrically activated electrode coupled to the first surface and to an electrical source to receive a first signal. The system further comprising a moveable structure suspended at a first height over the first surface, the moveable structure being attracted toward the electrode based upon the first signal, and the moveable structure being attracted toward the first surface through an interaction with one or more parasitic forces. The systems also provides a landing post coupled to the moveable structure, the landing post being adapted to contact the base of the landing post against the first surface when the electrically activated electrode receives a predetermined voltage bias associated with the first signal, thereby maintaining an outer portion of the moveable structure free from physical contact with the first surface and reducing a magnitude of one or more parasitic forces.

Abstract: Fabrication of a reflective spatial light modulator including a micro-mirror array. In one embodiment, the micro mirror array is fabricated from a substrate that is a single crystal material by only two main etching steps. A first etch forms cavities in a first side of the material. A second etch forms support posts, a vertical hinge, and a mirror plate. Between the first and second etches, the substrate can be bonded to addressing and control circuitry.