Patents by Inventor Douglas R. Dykaar

Douglas R. Dykaar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated electronic assembly comprising a transmission line
    Patent number: 5012319
    Abstract: Integrated electronic assemblies according to the invention, typically semiconductor IC chips, comprise an air gap transmission line. The line has high propagation speed and low dispersion, and can be readily manufactured. Various embodiments of the inventive transmission line are disclosed. In all cases the semiconductor substrate is etched so as to remove at least a substantial portion of the semiconductor material under and/or adjacent to the conductor line or lines. Insulator material (e.g., SiO.sub.2) serves, inter alia, to support the conductor.
    Type: Grant
    Filed: May 14, 1990
    Date of Patent: April 30, 1991
    Assignee: AT&T Bell Laboratories
    Inventors: Douglas R. Dykaar, Anthony F. J. Levi