Patents by Inventor Duy-Phach Vu

Duy-Phach Vu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10923617
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: February 16, 2021
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
  • Publication number: 20110318866
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film compound solar cell before it is separated from the substrate. To separate the thin film compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film compound solar cell.
    Type: Application
    Filed: June 21, 2011
    Publication date: December 29, 2011
    Applicant: MICROLINK DEVICES, INC.
    Inventors: Noren PAN, Glen HILLIER, Duy Phach VU, Rao TATAVARTI, Christopher YOUTSEY, David MCCALLUM, Genevieve MARTIN
  • Patent number: 7994419
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: August 9, 2011
    Assignee: MicroLink Devices, Inc.
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
  • Patent number: 7867812
    Abstract: The invention relates to the formation of thin-film crystalline silicon using a zone-melting recrystallization process in which the substrate is a ceramic material. Integrated circuits and solar cells are fabricated in the recrystallized silicon thin film and lifted off the substrate. Following lift-off, these circuits and devices are self-sustained, lightweight and flexible and the released ceramic substrate can be reused making the device fabrication process cost effective.
    Type: Grant
    Filed: July 10, 2009
    Date of Patent: January 11, 2011
    Inventors: Duy-Phach Vu, Quoc-Bao Vu
  • Publication number: 20100009492
    Abstract: The invention relates to the formation of thin-film crystalline silicon using a zone-melting recrystallization process in which the substrate is a ceramic material. Integrated circuits and solar cells are fabricated in the recrystallized silicon thin film and lifted off the substrate. Following lift-off, these circuits and devices are self-sustained, lightweight and flexible and the released ceramic substrate can be reused making the device fabrication process cost effective.
    Type: Application
    Filed: July 10, 2009
    Publication date: January 14, 2010
    Inventors: Duy-Phach Vu, Quoc-Bao Vu
  • Publication number: 20090044860
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Application
    Filed: July 3, 2008
    Publication date: February 19, 2009
    Applicant: MicroLink Devices, Inc.
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum
  • Publication number: 20090038678
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Application
    Filed: July 3, 2008
    Publication date: February 12, 2009
    Applicant: MicroLink Devices, Inc.
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum
  • Publication number: 20070018919
    Abstract: An active matrix color crystal display has an active matrix circuit, a counterelectrode panel and an interposed layer of liquid crystal. The active matrix display is located in a portable microdisplay system. The image is written to the the display therein causing the liquid crystal to move to a specific image position. A light source is flashed to illuminate the display. The pixel electrodes are set to a specific value to cause the liquid crystal to move towards a desired position. The process of writing, flashing, and setting the electrode intensity value to reorient the liquid crystal to produce an image is repeated.
    Type: Application
    Filed: June 26, 2006
    Publication date: January 25, 2007
    Inventors: Matthew Zavracky, Frederick Herrmann, Wen-Foo Chern, Alan Richard, Ronald Gale, Jason Lo, David Ellertson, Kuojinng Tsai, John Fan, Bor-Yeu Tsaur, Stephen Pombo, Rodney Bumgardner, Duy-Phach Vu
  • Patent number: 6919935
    Abstract: The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred.
    Type: Grant
    Filed: July 15, 2003
    Date of Patent: July 19, 2005
    Assignee: Kopin Corporation
    Inventors: Duy-Phach Vu, Brenda D. Dingle, Jason E. Dingle, Ngwe Cheong
  • Publication number: 20040070697
    Abstract: The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred.
    Type: Application
    Filed: July 15, 2003
    Publication date: April 15, 2004
    Applicant: Kopin Corporation
    Inventors: Duy-Phach Vu, Brenda D. Dingle, Jason E. Dingle, Ngwe Cheong
  • Patent number: 6627953
    Abstract: The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.
    Type: Grant
    Filed: June 13, 2000
    Date of Patent: September 30, 2003
    Assignee: Kopin Corporation
    Inventors: Duy-Phach Vu, Brenda Dingle, Ngwe Cheong
  • Patent number: 6624046
    Abstract: A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.
    Type: Grant
    Filed: November 1, 1999
    Date of Patent: September 23, 2003
    Assignee: Kopin Corporation
    Inventors: Paul M. Zavracky, Matthew Zavracky, Duy-Phach Vu, Brenda Dingle
  • Patent number: 6608654
    Abstract: The present invention relates to methods of fabricating pixel electrodes (44) for active matrix displays including the formation of arrays of transistor circuits in thin film silicon (10) on an insulating substrate and transfer of this active matrix circuit onto an optically transmissive substrate (24). An array of color filter elements can be formed prior to transfer of the active matrix circuit that are aligned between a light source for the display and the array of pixel electrodes to provide a color display.
    Type: Grant
    Filed: March 17, 1997
    Date of Patent: August 19, 2003
    Assignee: Kopin Corporation
    Inventors: Paul M. Zavracky, Duy-Phach Vu, Brenda Dingle, Matthew Zavracky, Mark B. Spitzer
  • Patent number: 6593978
    Abstract: The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred.
    Type: Grant
    Filed: December 16, 1999
    Date of Patent: July 15, 2003
    Assignee: Kopin Corporation
    Inventors: Duy-Phach Vu, Brenda D. Dingle, Jason E. Dingle, Ngwe Cheong
  • Patent number: 6521940
    Abstract: The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.
    Type: Grant
    Filed: August 30, 2000
    Date of Patent: February 18, 2003
    Assignee: Kopin Corporation
    Inventors: Duy-Phach Vu, Brenda Dingle, Ngwe Cheong
  • Patent number: 6486929
    Abstract: The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred.
    Type: Grant
    Filed: May 21, 1998
    Date of Patent: November 26, 2002
    Assignee: Kopin Corporation
    Inventors: Duy-Phach Vu, Brenda D. Dingle, Jason E. Dingle, Ngwe Cheong
  • Publication number: 20020030767
    Abstract: The present invention relates to methods of fabricating pixel electrodes (44) for active matrix displays including the formation of arrays of transistor circuits in thin film silicon (10) on an insulating substrate and transfer of this active matrix circuit onto an optically transmissive substrate (24). An array of color filter elements can be formed prior to transfer of the active matrix circuit that are aligned between a light source for the display and the array of pixel electrodes to provide a color display.
    Type: Application
    Filed: March 17, 1997
    Publication date: March 14, 2002
    Inventors: PAUL M. ZAVRACKY, DUY-PHACH VU, BRENDA DINGLE, MATTHEW ZAVRACKY, MARK B. SPITZER
  • Publication number: 20010040644
    Abstract: The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred.
    Type: Application
    Filed: December 16, 1999
    Publication date: November 15, 2001
    Inventors: DUY-PHACH VU, BRENDA D. DINGLE, JASON E. DINGLE, NGWE CHEONG
  • Patent number: 6143582
    Abstract: The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.
    Type: Grant
    Filed: February 12, 1999
    Date of Patent: November 7, 2000
    Assignee: Kopin Corporation
    Inventors: Duy-Phach Vu, Brenda Dingle, Ngwe Cheong
  • Patent number: 6027958
    Abstract: Integrated circuits for use in electronic devices requiring high density packaging are fabricated to provide highly flexible and ultra-thin devices having a variety of applications. The flexible circuits have dimensions up to several centimeters in surface area and thicknesses of a few microns. These circuits are fabricated using transfer techniques which include the removal of VLSI circuits from silicon wafers and mounting of the circuits on application specific substrates.
    Type: Grant
    Filed: July 11, 1996
    Date of Patent: February 22, 2000
    Assignee: Kopin Corporation
    Inventors: Duy-Phach Vu, Brenda Dingle, Ngwe K. Cheong