Abstract: The present disclosure relates to a composition that includes a structure that includes where R1 includes at least one of a carbon atom and/or an oxygen atom, R2 includes at least one of a carbon atom and/or an oxygen atom, and represents a covalent bond. In some embodiments of the present disclosure, the composition may be bioderived.

Abstract: The present disclosure provides a method of treating a central nervous system disorder in a patient in need thereof. The method comprises orally administering between 75 mg and 300 mg xanomeline salt and between 20 mg and 200 mg trospium chloride to the patient during a 24-hour period, the central nervous system disorder being selected from schizophrenia, Alzheimer's disease, Huntington's disease, Parkinson's disease, and Lewy Body dementia, wherein use of the trospium chloride alleviates a side effect associated with use of the xanomeline salt.

Abstract: In one aspect, a system for detecting crop levels within an agricultural harvester may include an elevator extending between a proximal end and a distal end, with the elevator being configured to carry harvested crops between the proximal end of the elevator and the distal end of the elevator. The system may also include a crop level sensor provided in operative association with the elevator. The crop level sensor may include a sensor body and a paddle pivotably coupled to the sensor body such that the paddle is configured to pivot relative to the sensor body when a crop level of the harvested crops conveyed by the elevator exceeds a threshold crop.

Abstract: Package-on-package systems for packaging semiconductor devices. In one embodiment, a package-on-package system comprises a first semiconductor package device and a second semiconductor package device. The first package device includes a base substrate including a first side having a die-attach region and a peripheral region, a first semiconductor die attached to the base substrate at the die-attach region, wherein the first semiconductor die has a front side facing the first side of the base substrate and a backside spaced apart from the first side of the base substrate by a first distance, and a high density interconnect array in the perimeter region of the base substrate outside of the die-attach region. The interconnect array has a plurality of interconnects that extend from the first side of the base substrate by a second distance greater than the first distance. The second semiconductor device package is electrically coupled corresponding individual interconnects.

Abstract: According to one example, a CNC machine tool system may perform error compensation for improving the accuracy of the geometry (or form) of a machined workpiece to, for example, better than 2 micrometers. To do so, a first machined workpiece may be created using the CNC machine tool system. The CNC machine tool system may create the machined workpiece by jig grinding. Following the creation of the first machined workpiece, metrology of the workpiece error may then be performed on the machined workpiece. The metrology of the workpiece error may be used to create a corrected toolpath trajectory for re-machining. This corrected toolpath trajectory may then be utilized by the CNC machine tool system to machine a second machined workpiece having a geometry (or form) with an accuracy of, for example, better than 2 micrometers.

Abstract: An agricultural harvester includes: a chassis; and a threshing and separating system coupled with the chassis, the threshing and separating system including a rotor including at least one brush device including a plurality of fingers which are flexible, the plurality of fingers being configured for engaging a crop material.

Abstract: A system for prioritizing trim requests can include an image processor that identifies a location associated with a customer trim request that includes an image of vegetation and industrial equipment and marks the vegetation and the industrial equipment visible in the image associated with the customer trim request. The system can also include a vegetation maintenance analyzer that searches for a match between the identified location associated with the customer trim request with a location associated with one of a past executed service ticket and a pending service ticket. The maintenance analyzer generates a maintenance profile for the customer trim request based on the results of the search and data in the customer trim request. The system can further include a priority engine that assigns priority to the customer trim request based on the maintenance profile for the customer trim request.

Abstract: In one aspect, a system for detecting crop levels within an agricultural harvester may include an elevator extending between a proximal end and a distal end, with the elevator being configured to carry harvested crops between the proximal end of the elevator and the distal end of the elevator. The system may also include a crop level sensor provided in operative association with the elevator. The crop level sensor may include a sensor body and a paddle pivotably coupled to the sensor body such that the paddle is configured to pivot relative to the sensor body when a crop level of the harvested crops conveyed by the elevator exceeds a threshold crop.

Abstract: A system for operating a harvester may include an elevator extending between a proximal end and a distal end, with the elevator being configured to carry harvested crops between its proximal and distal ends. The system may also include a storage hopper positioned adjacent to the distal end of the elevator, with the storage hopper defining a volume configured to receive the harvested crops discharged from the distal end of the elevator. In addition, the system may include a rotary spreader positioned within the storage hopper. The rotary spreader may be configured to be rotated within the storage hopper to disperse the harvested crops received from the elevator across at least a portion of the volume.

Abstract: The present invention provides systems and methods for rapid screening of individuals who may have been exposed to and carrying biological agents potentially contagious or otherwise harmful to the general public.

Abstract: A semiconductor interconnect structure having a first electrically conductive structure having a plurality of bottom portions; a dielectric capping layer, at least a portion of the dielectric capping layer being in contact with a first bottom portion of the plurality of bottom portions; and a second electrically conductive structure in electrical contact with a second bottom portion of the plurality of bottom portions. A method of forming the interconnect structure is also provided.

Abstract: A semiconductor interconnect structure having a first electrically conductive structure having a plurality of bottom portions; a dielectric capping layer, at least a portion of the dielectric capping layer being in contact with a first bottom portion of the plurality of bottom portions; and a second electrically conductive structure in electrical contact with a second bottom portion of the plurality of bottom portions. A method of forming the interconnect structure is also provided.

Abstract: Package-on-package systems for packaging semiconductor devices. In one embodiment, a package-on-package system comprises a first semiconductor package device and a second semiconductor package device. The first package device includes a base substrate including a first side having a die-attach region and a peripheral region, a first semiconductor die attached to the base substrate at the die-attach region, wherein the first semiconductor die has a front side facing the first side of the base substrate and a backside spaced apart from the first side of the base substrate by a first distance, and a high density interconnect array in the perimeter region of the base substrate outside of the die-attach region. The interconnect array has a plurality of interconnects that extend from the first side of the base substrate by a second distance greater than the first distance. The second semiconductor device package is electrically coupled corresponding individual interconnects.

Abstract: An agricultural vehicle spreader system having a fixed frame, a pivot frame, a pivot joint connecting the pivot frame to the fixed frame for movement about a pivot axis between an operation position and a service position, a spreader assembly, and a power transmission. The pivot joint includes a pivot shaft extending along the pivot axis. The pivot shaft has a drive input and a drive output that is spaced along the pivot axis from the drive input. The spreader assembly has one or more spreaders mounted to the pivot frame and configured to rotate about a respective spreader axis that is offset radially from the pivot axis, and a respective spreader drive input drivingly connected to each of the one or more spreaders. The power transmission operatively connects the pivot shaft drive output to each respective spreader drive input.

Abstract: Disclosed herein are methods, devices, and systems for manufacturing wind turbine blades which in some instances require using new blade joint designs. The blade joint designs described herein may allow for contact in places where welds will be made, which allows for existing manufacturing tolerances to be used while still enabling the use of thermal welding for wind turbine blades.

Abstract: The present disclosure relates to a composition that includes a structure that includes where R1 includes at least one of a carbon atom and/or an oxygen atom, R2 includes at least one of a carbon atom and/or an oxygen atom, and represents a covalent bond. In some embodiments of the present disclosure, the composition may be bioderived.

Abstract: A system for prioritizing trim requests can include an image processor that identifies a location associated with a customer trim request that includes an image of vegetation and industrial equipment and marks the vegetation and the industrial equipment visible in the image associated with the customer trim request. The system can also include a vegetation maintenance analyzer that searches for a match between the identified location associated with the customer trim request with a location associated with one of a past executed service ticket and a pending service ticket. The maintenance analyzer generates a maintenance profile for the customer trim request based on the results of the search and data in the customer trim request. The system can further include a priority engine that assigns priority to the customer trim request based on the maintenance profile for the customer trim request.

Abstract: Package-on-package systems for packaging semiconductor devices. In one embodiment, a package-on-package system comprises a first semiconductor package device and a second semiconductor package device. The first package device includes a base substrate including a first side having a die-attach region and a peripheral region, a first semiconductor die attached to the base substrate at the die-attach region, wherein the first semiconductor die has a front side facing the first side of the base substrate and a backside spaced apart from the first side of the base substrate by a first distance, and a high density interconnect array in the perimeter region of the base substrate outside of the die-attach region. The interconnect array has a plurality of interconnects that extend from the first side of the base substrate by a second distance greater than the first distance. The second semiconductor device package is electrically coupled corresponding individual interconnects.

Abstract: A semiconductor interconnect structure having a first electrically conductive structure having a plurality of bottom portions; a dielectric capping layer, at least a portion of the dielectric capping layer being in contact with a first bottom portion of the plurality of bottom portions; and a second electrically conductive structure in electrical contact with a second bottom portion of the plurality of bottom portions. A method of forming the interconnect structure is also provided.

Abstract: An elevator assembly for a harvester may include an elevator extending within between proximal and distal ends. The elevator may be configured to carry harvested crops between its proximal and distal ends. The elevator assembly may also include a storage hopper at a location adjacent to the distal end of the elevator. The storage hopper may include a rear deflector and a hopper gate. The hopper gate may be movable between a discharge position, at which the hopper gate exposes a discharge opening of the storage hopper, and a storage position, at which the hopper gate covers the discharge opening to prevent harvested crops from being discharged from the elevator assembly. Additionally, when the hopper gate is moved to the storage position, the hopper gate and the rear deflector may at least partially define a storage volume adjacent to the distal end of the elevator for storing the harvested crop.