Patents by Inventor E. Murray

E. Murray has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220293506
    Abstract: Package-on-package systems for packaging semiconductor devices. In one embodiment, a package-on-package system comprises a first semiconductor package device and a second semiconductor package device. The first package device includes a base substrate including a first side having a die-attach region and a peripheral region, a first semiconductor die attached to the base substrate at the die-attach region, wherein the first semiconductor die has a front side facing the first side of the base substrate and a backside spaced apart from the first side of the base substrate by a first distance, and a high density interconnect array in the perimeter region of the base substrate outside of the die-attach region. The interconnect array has a plurality of interconnects that extend from the first side of the base substrate by a second distance greater than the first distance. The second semiconductor device package is electrically coupled corresponding individual interconnects.
    Type: Application
    Filed: June 1, 2022
    Publication date: September 15, 2022
    Inventors: Owen R. Fay, Jack E. Murray
  • Patent number: 11440744
    Abstract: System and methods for estimating the number of packages in a measurement zone to gauge package flow. A linear array of distance-measuring sensors measures the height profile of a mass of packages conveyed past. The profile is differentiated, and steps in the differentiated profile are counted to detect package edges and to produce an estimate of the number of packages in the measurement zone. The estimate can be used to adjust the speed of the conveyor to provide a constant package flow.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: September 13, 2022
    Assignee: Laitram, L.L.C.
    Inventors: William S. Murray, Jeremiah E. Oertling
  • Publication number: 20220279717
    Abstract: An agricultural vehicle spreader system having a fixed frame, a pivot frame, a pivot joint connecting the pivot frame to the fixed frame for movement about a pivot axis between an operation position and a service position, a spreader assembly, and a power transmission. The pivot joint includes a pivot shaft extending along the pivot axis. The pivot shaft has a drive input and a drive output that is spaced along the pivot axis from the drive input. The spreader assembly has one or more spreaders mounted to the pivot frame and configured to rotate about a respective spreader axis that is offset radially from the pivot axis, and a respective spreader drive input drivingly connected to each of the one or more spreaders. The power transmission operatively connects the pivot shaft drive output to each respective spreader drive input.
    Type: Application
    Filed: March 4, 2022
    Publication date: September 8, 2022
    Inventors: William Sorenson, Travis Ohms, Craig E. Murray, James Seedorf, Kevin Hammer
  • Publication number: 20220272794
    Abstract: Aspects of the subject disclosure may include, for example, receiving network-related information associated with a first RAN that includes a first RIC, obtaining, from an artificial intelligence (AI) model synchronization system associated with a second RAN, data relating to an AI model deployed by a second RIC of the second RAN, determining, based on the data relating to the AI model and the network-related information associated with the first RAN, that the AI model can be leveraged by the first RAN to improve network performance of the first RAN, performing synchronization with the AI model synchronization system to obtain the AI model, responsive to the determining that the AI model can be leveraged by the first RAN to improve the network performance of the first RAN, and causing the first RIC to deploy the AI model in the first RAN after the performing the synchronization. Other embodiments are disclosed.
    Type: Application
    Filed: February 23, 2021
    Publication date: August 25, 2022
    Applicant: AT&T Intellectual Property I, L.P.
    Inventors: Syed Anwar Aftab, Manoop Talasila, Guy Jacobson, John F. Murray, Mazin E. Gilbert
  • Patent number: 11425752
    Abstract: Disclosed herein are new radio (NR) Data link architecture options including, for example, NR radio bearer models, NR logical channel models, and MAC and HARQ models. Further described are packet flows mapping to data radio bearers (DRBs), and a new flow encapsulation protocol in the user plane. In some embodiments, DRBs with different quality of service (QoS) are pre-established, but not activated. This allows a given user equipment (UE) to use these DRBs for packet data network (PDN) flows without a large overhead. Pre-established DRBs can be an extension to default bearer concept with the decision of pre-establishment of DRBs based on UE capability, subscription profile, operation policy, installed apps, etc.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: August 23, 2022
    Assignee: IPLA HOLDINGS INC.
    Inventors: Pascal M. Adjakple, Joseph M. Murray, Guodong Zhang, Lakshmi R. Iyer, Wei Chen, Stephen E. Terry
  • Patent number: 11406793
    Abstract: A catheter packing assembly that provides directions to the user on the proper procedure for contamination-free use of the catheter.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: August 9, 2022
    Assignee: Hollister Incorporated
    Inventors: Michael G. Murray, Mark Dillon, Patrick E. O'Dowd
  • Patent number: 11396153
    Abstract: Disclosed herein are methods, devices, and systems for manufacturing wind turbine blades which in some instances require using new blade joint designs. The blade joint designs described herein may allow for contact in places where welds will be made, which allows for existing manufacturing tolerances to be used while still enabling the use of thermal welding for wind turbine blades.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: July 26, 2022
    Assignee: Alliance for Sustainable Energy, LLC
    Inventors: Robynne E. Murray, Joseph Owen Roberts, Ryan Andrew Beach, Jason Markos Roadman
  • Publication number: 20220226604
    Abstract: Kits are provided for storing, transporting, and sterilizing reusable urinary catheters. A reusable urinary catheter stored within a housing of the kit may be sterilized between uses using a sterilization fluid or sterilizing light. If the reusable urinary catheter is sterilized using a sterilization fluid, the housing may include a manually actuated or electro-mechanical pump to circulate the sterilization fluid through the housing. The reusable urinary catheter may include a funnel secured to a catheter shaft, with a plurality of lateral openings defined in the funnel, which provide fluid communication between an interior of the funnel and an external surface of the catheter shaft. By allowing fluid communication between the interior of the funnel and the external surface of the catheter shaft, the lateral openings allow for fluid sterilization of both internal and external surfaces of the catheter shaft.
    Type: Application
    Filed: June 10, 2020
    Publication date: July 21, 2022
    Inventors: Michael G. Murray, Horacio Montes De Oca, Gary W. Inglese, Rebecca M. Leece, Vincent Naughton, Daniel E. O'Brien, David J. Farrell, David Hannon, Martin Bruggeman
  • Publication number: 20220226605
    Abstract: Reusable catheter products (10) are provided for storing, transporting, and sterilizing reusable urinary catheters. The products include a case (12) comprising a proximal section (30), a middle section (40), and a distal section (32). The case includes a cavity (16) configured to receive a catheter (14); the cavity includes a hydration fluid (18). The catheter comprises a distal end, a proximal end and a tubular section therebetween and includes a hydrophilic coating. When the catheter is inserted into the case, the hydration fluid sterilizes and lubricates the catheter.
    Type: Application
    Filed: June 23, 2020
    Publication date: July 21, 2022
    Inventors: Michael G. Murray, Horacio Montes de Oca, Malford E. Cullum, Gary W. Inglese, Rory Grogan
  • Patent number: 11388045
    Abstract: A wireless communication network comprises network circuitry which hosts a Virtual Network Function (VNF). A VNF controller instantiates the VNF in the network circuitry and transfers instantiation information for the VNF to provisioning circuitry. The provisioning circuitry receives the instantiation information for the VNF and establishes a provisioning data link to the VNF. The provisioning circuitry transfers network provisioning data to the VNF over the provisioning data link. The VNF controller de-instantiates the VNF in the network circuitry and responsively transfers de-instantiation information for the VNF to the provisioning circuitry. The provisioning circuitry receives the de-instantiation information for the VNF and terminates the provisioning data link to the VNF. The VNF controller may comprise a Network Function Virtualization Management and Orchestration (NFV MANO) computer.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: July 12, 2022
    Assignee: Sprint Communications Company LP
    Inventors: Anthony E. Johnson, Joseph M. Murray
  • Publication number: 20220106442
    Abstract: The present disclosure relates to a composition that includes a structure that includes where R1 includes at least one of a carbon atom and/or an oxygen atom, R2 includes at least one of a carbon atom and/or an oxygen atom, and represents a covalent bond. In some embodiments of the present disclosure, the composition may be bioderived.
    Type: Application
    Filed: October 5, 2021
    Publication date: April 7, 2022
    Inventors: Chen WANG, Robynne E. MURRAY, Gregg Tyler BECKHAM, Scott MAUGER, Nicholas A. RORRER
  • Publication number: 20220044167
    Abstract: A system for prioritizing trim requests can include an image processor that identifies a location associated with a customer trim request that includes an image of vegetation and industrial equipment and marks the vegetation and the industrial equipment visible in the image associated with the customer trim request. The system can also include a vegetation maintenance analyzer that searches for a match between the identified location associated with the customer trim request with a location associated with one of a past executed service ticket and a pending service ticket. The maintenance analyzer generates a maintenance profile for the customer trim request based on the results of the search and data in the customer trim request. The system can further include a priority engine that assigns priority to the customer trim request based on the maintenance profile for the customer trim request.
    Type: Application
    Filed: August 4, 2020
    Publication date: February 10, 2022
    Inventors: Iliana M. Rentz, Jeffrey D. Dubs, Roberto J. Rivera, Corinne E. Murray, Steve T. Jolly
  • Publication number: 20220028771
    Abstract: Package-on-package systems for packaging semiconductor devices. In one embodiment, a package-on-package system comprises a first semiconductor package device and a second semiconductor package device. The first package device includes a base substrate including a first side having a die-attach region and a peripheral region, a first semiconductor die attached to the base substrate at the die-attach region, wherein the first semiconductor die has a front side facing the first side of the base substrate and a backside spaced apart from the first side of the base substrate by a first distance, and a high density interconnect array in the perimeter region of the base substrate outside of the die-attach region. The interconnect array has a plurality of interconnects that extend from the first side of the base substrate by a second distance greater than the first distance. The second semiconductor device package is electrically coupled corresponding individual interconnects.
    Type: Application
    Filed: October 4, 2021
    Publication date: January 27, 2022
    Inventors: Owen R. Fay, Jack E. Murray
  • Patent number: 11222815
    Abstract: A semiconductor interconnect structure having a first electrically conductive structure having a plurality of bottom portions; a dielectric capping layer, at least a portion of the dielectric capping layer being in contact with a first bottom portion of the plurality of bottom portions; and a second electrically conductive structure in electrical contact with a second bottom portion of the plurality of bottom portions. A method of forming the interconnect structure is also provided.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: January 11, 2022
    Assignee: Tessera, Inc.
    Inventors: Conal E. Murray, Chih-Chao Yang
  • Publication number: 20210400876
    Abstract: An elevator assembly for a harvester may include an elevator extending within between proximal and distal ends. The elevator may be configured to carry harvested crops between its proximal and distal ends. The elevator assembly may also include a storage hopper at a location adjacent to the distal end of the elevator. The storage hopper may include a rear deflector and a hopper gate. The hopper gate may be movable between a discharge position, at which the hopper gate exposes a discharge opening of the storage hopper, and a storage position, at which the hopper gate covers the discharge opening to prevent harvested crops from being discharged from the elevator assembly. Additionally, when the hopper gate is moved to the storage position, the hopper gate and the rear deflector may at least partially define a storage volume adjacent to the distal end of the elevator for storing the harvested crop.
    Type: Application
    Filed: September 14, 2021
    Publication date: December 30, 2021
    Inventors: Craig E. Murray, Francisco Mezzomo, Michael J. Matway, William Lawson, Carlos Visconti
  • Patent number: 11172615
    Abstract: An elevator assembly for a harvester may include an elevator extending within between proximal and distal ends. The elevator may be configured to carry harvested crops between its proximal and distal ends. The elevator assembly may also include a storage hopper at a location adjacent to the distal end of the elevator. The storage hopper may include a rear deflector and a hopper gate. The hopper gate may be movable between a discharge position, at which the hopper gate exposes a discharge opening of the storage hopper, and a storage position, at which the hopper gate covers the discharge opening to prevent harvested crops from being discharged from the elevator assembly. Additionally, when the hopper gate is moved to the storage position, the hopper gate and the rear deflector may at least partially define a storage volume adjacent to the distal end of the elevator for storing the harvested crop.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: November 16, 2021
    Assignee: CNH Industrial America LLC
    Inventors: Craig E. Murray, Francisco Mezzomo, Michael J. Matway, William Lawson, Carlos Visconti
  • Patent number: 11139229
    Abstract: Package-on-package systems for packaging semiconductor devices. In one embodiment, a package-on-package system comprises a first semiconductor package device and a second semiconductor package device. The first package device includes a base substrate including a first side having a die-attach region and a peripheral region, a first semiconductor die attached to the base substrate at the die-attach region, wherein the first semiconductor die has a front side facing the first side of the base substrate and a backside spaced apart from the first side of the base substrate by a first distance, and a high density interconnect array in the perimeter region of the base substrate outside of the die-attach region. The interconnect array has a plurality of interconnects that extend from the first side of the base substrate by a second distance greater than the first distance. The second semiconductor device package is electrically coupled corresponding individual interconnects.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: October 5, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Owen R. Fay, Jack E. Murray
  • Publication number: 20210183699
    Abstract: A semiconductor interconnect structure having a first electrically conductive structure having a plurality of bottom portions; a dielectric capping layer, at least a portion of the dielectric capping layer being in contact with a first bottom portion of the plurality of bottom portions; and a second electrically conductive structure in electrical contact with a second bottom portion of the plurality of bottom portions. A method of forming the interconnect structure is also provided.
    Type: Application
    Filed: February 26, 2021
    Publication date: June 17, 2021
    Inventors: Conal E. Murray, Chih-Chao Yang
  • Publication number: 20210170298
    Abstract: Embodiments may include methods and systems for purifying a product and recovering a solvent. In a first stage, a raw feed comprising an initial solvent fraction and an initial product fraction may be heated using a first heat exchanger, and an intermediate vapor fraction of the initial solvent fraction may be vaporized using a first vapor liquid separator to yield an intermediate product comprising intermediate solvent and intermediate product fractions. The intermediate vapor fraction may be condensed to a first solvent condensate using a first condenser. In a second stage, the intermediate product may be heated using a second heat exchanger, and a final vapor fraction of the intermediate solvent fraction may be vaporized using a second vapor liquid separator to yield a purified product comprising final solvent and final product fractions. The final vapor fraction may be condensed to a second solvent condensate using a second condenser.
    Type: Application
    Filed: November 24, 2020
    Publication date: June 10, 2021
    Inventors: Todd E. MURRAY, Maliek F. LIKELY, Kelly M. CARMINA
  • Publication number: 20210112714
    Abstract: A system for operating a harvester may include an elevator extending between a proximal end and a distal end, with the elevator being configured to carry harvested crops between its proximal and distal ends. The system may also include a storage hopper positioned adjacent to the distal end of the elevator, with the storage hopper defining a volume configured to receive the harvested crops discharged from the distal end of the elevator. In addition, the system may include a rotary spreader positioned within the storage hopper. The rotary spreader may be configured to be rotated within the storage hopper to disperse the harvested crops received from the elevator across at least a portion of the volume.
    Type: Application
    Filed: March 5, 2019
    Publication date: April 22, 2021
    Inventors: Craig E. Murray, Carlos Visconti