Abstract: An agricultural harvester includes a grain processing section having a sieve assembly. The sieve assembly includes right and left frames interconnected by a cross member. The cross member has end castings securable to the right and left frame members. An elongated U-shaped sheet metal member extends between the castings. An elongated slot at each of the U-shaped sheet metal member terminates in a circular hole. The slot and circular hole accommodate variations in forming tolerances for the U-shaped sheet member and dissipate stresses.

Abstract: An agricultural vehicle includes a chassis; a header carried by the chassis and configured to cut crop material; a chopper carried by the chassis downstream of the header; and a windrow assembly carried by the chassis downstream of the chopper. The windrow assembly includes a windrow chute defining a leading edge downstream from the chopper and a trailing edge downstream from the leading edge; and a roller associated with the leading edge to form an active leading edge of the windrow chute during rotation.

Abstract: An agricultural vehicle includes: a chassis; a header carried by the chassis and configured to cut crop material; a chopper carried by the chassis downstream of the header; a spreader assembly carried by the chassis downstream of the chopper; and a windrow assembly carried by the chassis downstream of the chopper. The windrow assembly includes: a windrow chute defining a chute surface and a leading edge downstream from the chopper; and a rotatable conveyor associated with the leading edge and having a surface with at least one conveyor projection extending from the surface, the at least one conveyor projection being configured to convey crop material toward at least one of the chute surface and the spreader assembly during rotation.

Abstract: Package-on-package systems for packaging semiconductor devices. In one embodiment, a package-on-package system comprises a first semiconductor package device and a second semiconductor package device. The first package device includes a base substrate including a first side having a die-attach region and a peripheral region, a first semiconductor die attached to the base substrate at the die-attach region, wherein the first semiconductor die has a front side facing the first side of the base substrate and a backside spaced apart from the first side of the base substrate by a first distance, and a high density interconnect array in the perimeter region of the base substrate outside of the die-attach region. The interconnect array has a plurality of interconnects that extend from the first side of the base substrate by a second distance greater than the first distance. The second semiconductor device package is electrically coupled corresponding individual interconnects.

Abstract: Methods are devices are provided in which interconnection structures are formed using metal reflow techniques. For example, a method to fabricate a semiconductor device includes forming an opening in an ILD (inter-level dielectric) layer. The opening includes a via hole and a trench. A layer of diffusion barrier material is deposited to cover the ILD layer and to line the opening with the diffusion barrier material. A layer of first metallic material is deposited on the layer of diffusion barrier material to cover the ILD layer and to line the opening with the first metallic material. A reflow process is performed to allow the layer of first metallic material to reflow into the opening and at least partially fill the via hole with the first metallic material. A layer of second metallic material is deposited to at least partially fill a remaining portion of the opening in the ILD layer.

Abstract: An agricultural harvester includes a grain processing section having a sieve. The sieve is driven in fore and aft oscillation while permitting side to side movement by a pair of cast members interconnected each having three mounting points. Two of the mounting points of the members are interconnected by flexible rubber bushings and the third mounting point of one of the members receives fore and aft oscillating movement and the third mounting point on the second of the members pivotally interconnects to the sieve to drive it into fore and aft oscillation while permitting side to side movement.

Abstract: An agricultural harvester includes a grain processing section having a sieve assembly. The sieve assembly is connected to mechanism for producing a side to side oscillation by a single cast structural link having an input through slotted openings to the drive mechanism to accommodate misalignment. The link has vertical and horizontal flanges connected to a main body for interconnection between the right and left frames and structural supports interconnecting the right and left frames. The main body of the link extends through a slot in a rubber wall to accommodate the movement and seal against loss of grain.

Abstract: An agricultural vehicle includes a chassis; a threshing and separating assembly carried by the chassis; and a cleaning system carried by the chassis and configured to receive crop material that has passed through the threshing and separating assembly. The cleaning system includes a pan configured to receive crop material from the threshing and separating assembly on a pan surface and to shake in a fore-to-aft direction; at least one sieve located below the pan and configured to shake in fore-to-aft and lateral directions, the sieve including a sieve surface configured to receive crop material from the pan; and at least one divider associated with and extending at least 3 centimeters above at least one of the pan surface and the sieve surface.

Abstract: A cleaning system for an agricultural combine harvester includes a sieve having a periphery and an interference member located at the periphery. A chaffer frame carries the sieve, and includes a clamp with a pair of spring fingers positioned on either side of the interference member, thereby retaining the sieve within the chaffer frame.

Abstract: A sieve arrangement for an agricultural combine harvester includes a sieve frame for carrying a sieve, a side shaker arm, and a plurality of elongate structural members. The sieve frame includes a first side frame member and a second side frame member. The side shaker arm is connected with the first side frame member. Each structural member has a first end connected to the side shaker arm, and a second end connected with the second side frame member.

Abstract: Disclosed is the use of a metal catalyst or catalyst precursor that catalyzes the isomerization of an unsaturated fatty acid, unsaturated fatty acid derivative, or an unsaturated triglyceride. Also disclosed is the use of a metal catalyst or catalyst precursor that catalyzes the decarboxylation of an unsaturated organic compound. Also disclosed is the use of a catalyst or catalyst precursor for the dual function isomerization and decarboxylation of an unsaturated fatty acid to an unsaturated organic compound.

Abstract: Package-on-package systems for packaging semiconductor devices. In one embodiment, a package-on-package system comprises a first semiconductor package device and a second semiconductor package device. The first package device includes a base substrate including a first side having a die-attach region and a peripheral region, a first semiconductor die attached to the base substrate at the die-attach region, wherein the first semiconductor die has a front side facing the first side of the base substrate and a backside spaced apart from the first side of the base substrate by a first distance, and a high density interconnect array in the perimeter region of the base substrate outside of the die-attach region. The interconnect array has a plurality of interconnects that extend from the first side of the base substrate by a second distance greater than the first distance. The second semiconductor device package is electrically coupled corresponding individual interconnects.

Abstract: Disclosed is an awning which is specifically designed to attach, in a horizontal orientation, above the heads of passengers in a convertible automobile. The occupants may travel with the convertible top down and enjoy a relative cooler temperature and protection from ultraviolet rays. Generally, the screen material used to comprise the awning is of a mesh design, sized and fitted to be usable for providing overhead coverage of the passenger seats on a specific convertible. Varying lengths and widths of the screen material are fabricated for different size automobiles. The awning is supported at the windshield header of the convertible and by two vertically-oriented posts behind the rearmost seats of the convertible. The awning is readily installed on the automobile and may, when not in use, be rolled up and stored within the trunk of the subject convertible.

Abstract: A method includes measuring a difference between a primary X-ray diffraction peak and a secondary X-ray diffraction peak, the primary X-ray diffraction peak corresponds to an unstrained portion of a semiconductor substrate and the secondary X-ray diffraction peak corresponds to a strained portion of the semiconductor substrate, the difference between the primary X-ray diffraction peak and the secondary X-ray diffraction peak includes a delta shift peak that corresponds to changes in a crystal lattice caused by a stress applied to the strained portion of the semiconductor substrate, the delta shift peak includes variations in a deep trench capacitance.

Abstract: A method of fabricating a semiconductor interconnect structure by providing a semiconductor structure with a dielectric layer with and an embedded electrically conductive structure. A dielectric capping layer and a metal capping layer separating a second dielectric layer located above the first dielectric layer. The segment of metal capping layer covers at least a portion of a top surface of the first electrically conductive structure. Exposing parts of both the first electrically conductive structure and the dielectric capping layer by forming an opening in the second dielectric layer and the metal capping layer. Forming a second electrically conductive structure in the opening, such that (i) the second electrically conductive structure is located over part of the dielectric capping layer, and (ii) the second electrically conductive structure is in electrical contact with the first electrically conductive structure.

Abstract: A slat for use within a material moving system of an agricultural combine may include a connector web extending in a lengthwise direction of the slat between a first end and a second end and in a widthwise direction of the slat between a front side and a rear side of the slat. The connector web may also define an outer surface and an inner surface. The slat may also include a front wall extending outwardly from the outer surface of the connector web along the front side of the slat and a rear wall extending outwardly from the outer surface of the connector web along the rear side of the slat. Additionally, the slat may include one or more additional features for increasing the structural integrity of the slat and/or for enhancing the crop grabbing/gripping capabilities of the slat.

Abstract: Disclosed herein is an interconnect structure, including: a dielectric material layer having a cavity having a height, width and length within a dielectric material layer wherein the width is less than or equal to about 100 nanometers and the height to width ratio is less than or equal to about 2.5; a diffusion barrier liner layer disposed in the cavity on the dielectric material; an optional crystallization seed layer disposed on the diffusion barrier liner layer; and a conductive material disposed on the crystallization seed layer when present and filling the opening. When the crystallization seed layer is not present the conductive material is disposed on the diffusion barrier liner.

Abstract: Embodiments of the present invention provide integrated circuits and methods for activating reactions in integrated circuits. In one embodiment, an integrated circuit is provided having reactive material capable of being activated by electrical discharge, without requiring a battery or similar external power source, to produce an exothermic reaction that erases and/or destroys one or more semiconductor devices on the integrated circuit.

Abstract: A chopper assembly for a crop residue distribution system of an agricultural combine may include a rotor shaft extending lengthwise along a rotational axis between a first end and a second end. The chopper assembly may also include a plurality of flail blades pivotally coupled to the rotor shaft. Each flail blade may be configured to pivot relative to the rotor shaft about a pivot axis, with the flail blades being spaced apart axially from one another between the first and second ends of the rotor shaft. In addition, the chopper assembly may include a plurality of spring tines coupled to the rotor shaft, with the spring tines being spaced apart from one another between the first and second ends of the rotor shaft.

Abstract: A chopper assembly for a crop residue distribution system of an agricultural combine may include a rotor shaft extending lengthwise along a rotational axis between a first end and a second end. The chopper assembly may also include a plurality of flail blades pivotally coupled to the rotor shaft. Each flail blade may be configured to pivot relative to the rotor shaft about a pivot axis, with the flail blades being spaced apart axially from one another between the first and second ends of the rotor shaft. In addition, the chopper assembly may include one or more features configured to improve the performance of the chopper assembly during low speed operation. For example, the feature(s) may correspond to one or more fixed blades coupled to the rotor shaft and/or one or more torsional springs provided in operative association with one or more of the flail blades.