Abstract: A system for dynamically changing the graphical content on mechanical slot machine reels is disclosed herein. The system includes mechanical slot reels, flexible display panels, and data transmission techniques which provide for dynamically updating or changing the graphics on the spinning mechanical reels in a slot machine. In one system for dynamically changing graphical reel content, new image content is placed on the reels at any time, even while the reels are spinning. The system may even be used to give the appearance of rotation to a stationary reel.

Abstract: A method for dynamically changing the graphical content on mechanical slot machine reels is disclosed herein. The system includes mechanical slot reels, flexible display panels, and data transmission techniques which provide for dynamically updating or changing the graphics on the spinning mechanical reels in a slot machine. In one method for dynamically changing graphical reel content, new image content is placed on the reels at any time, even while the reels are spinning. The method may even be used to give the appearance of rotation to a stationary reel.

Abstract: The present invention discloses a transgenic zebrafish that express activated BRAF specifically in melanocytes and its uses in screening for agents that can be used to treat melanomas or screening for agents that aggravate or induce melanomas.

Abstract: An enhanced gaming system through which a variety of games of chance and/or games of skill can be made available to players. The gaming system separates game outcomes from game themes and game payout/buy-in information, thereby enhancing game flexibility. The gaming system also allows different games of chance and/or games of skill to be available to different subsets of player units, and gives a gaming hall operator the ability to dynamically control the size and distribution of such subsets. An “apparently random” permutation production technique is disclosed for use in certain games and regulatory environments. A PKI-based architecture is also disclosed.

Abstract: Methods and apparatus are provided for processing semiconductor wafers sequentially. Sequential processes employ multi-station processing modules, where particular encompassing wafer processes are divided into sub-processes, each optimized for increasing wafer to wafer uniformity, result quality, and overall wafer throughput. In one example, a copper electroplating module includes separate stations for wetting, initiation, seed layer repair, fill, overburden, reclaim, and rinse.

Abstract: Deployment of a workstation includes receiving data related to the computing environment of workstations, organizing the workstations into groups based on at least one selectable common attribute among the data, and producing a deployment schedule based on the groups.

Abstract: A system and method for determining one or more origin and destination (O&D) services for a travel itinerary. The method comprises the steps of inputting itinerary data into the processor, determining one or more O&D services for the itinerary by applying a multi-level test, and outputting the O&D services. The invention also includes a system for determining one or more O&D services for a travel itinerary. The system comprises a storage device, a processor, testing software that selectively applies a first and second test set, and determining software responsive to the testing software that determines the O&D services for the travel itinerary. The invention also includes a method for determining travel cost information for a travel itinerary.

Abstract: The orientation of a wafer with respect to the surface of an electrolyte is controlled during an electroplating process. The wafer is delivered to an electrolyte bath along a trajectory normal to the surface of the electrolyte. Along this trajectory, the wafer is angled before entry into the electrolyte for angled immersion. A wafer can be plated in an angled orientation or not, depending on what is optimal for a given situation. Also, in some designs, the wafer's orientation can be adjusted actively during immersion or during electroplating, providing flexibility in various electroplating scenarios.

Abstract: Liquid detection sensors are attached to both sides of a robotic arm end effector of a semiconductor wafer process system. The sensor mechanism or probe is situated on the front side and backside of the end effector, designed with electrical lines that are traced onto a polyester base material. The electrical lines are positioned in a serpentine formation. The high conductance of the sulfuric acid in the copper sulfate solution acts as the conductor between the traced lines. When the conductive liquid comes in contact with the traced lines, the lines short and the sensor activates or turns on.

Abstract: Certain mechanisms of a plating apparatus address problems associated with interaction between plating solutions or other processing solutions and the components of the plating apparatus (such as the electrical contacts). For example, a circumferential spray skirt around the interface of a “cup” and “cone” in the plating apparatus protects these features during plating. A shield mechanism contacts the cup and/or cone at the periphery of their interface to provide a fluid resistant seal. In some cases, the cone includes an outer circumferential lip that engages a complementary surface of the cup for this purpose. Further, a mechanism is provided for raising and lowering the work piece with the cone in order to allow in situ rinsing of the work piece and/or regions of the cup.

Abstract: The present invention provides apparatus and methods for controlling flow dynamics of a plating fluid during a plating process. The invention achieves this fluid control through use of a diffuser membrane. Plating fluid is pumped through the membrane; the design and characteristics of the membrane provide a uniform flow pattern to the plating fluid exiting the membrane. Thus a work piece, upon which a metal or other conductive material is to be deposited, is exposed to a uniform flow of plating fluid.

Abstract: Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plated with a seed layer into an electroplating solution. Also described are diffusion-controlled electroplating techniques to provide for bottom-up filling of trenches and vias, avoiding thereby sidewalls growing together to create seams/voids. A preliminary plating step is also described that plates a thin film of conductor on the interior surfaces of features leading to adequate electrical conductivity to the feature bottom, facilitating bottom-up filling.

Abstract: An electroplating apparatus prevents anode-mediated degradation of electrolyte additives by creating a mechanism for maintaining separate anolyte and catholyte and preventing mixing thereof within a plating chamber. The separation is accomplished by interposing a porous chemical transport barrier between the anode and cathode. The transport barrier limits the chemical transport (via diffusion and/or convection) of all species but allows migration of ionic species (and hence passage of current) during application of sufficiently large electric fields within electrolyte.

Abstract: A bar code reader missing link detection system for detection of missing, defective or misaligned chain links in assembled or in-process chains includes a light source for illuminating one or more chain links of a chain, a light sensitive diode array for detecting an image of a fixed scan line, produced by the light source, and a lens system for focusing incoming light produced by the light source onto the diode array, wherein the system is arranged such that the bar code reader reflects light from one or more of the chain links onto the diode array, and the diode array is continuously scanned, digitized, and the data obtained thereby interpreted to detect missing chain links.

Abstract: An apparatus for engaging a work piece during plating facilitates electrolyte flow during a plating operation. The apparatus helps to control the plating solution fluid dynamics and electric field shape to keep the wafer's local plating environment uniform and bubble free. The apparatus holding the work piece in a manner that facilitates electrolyte circulation patterns in which the electrolyte flows from the center of the work piece plating surface, outward toward the edge of the edge of the work piece. The apparatus holds the work piece near the work piece edges and provides a flow path for electrolyte to flow outward away from the edges of the work piece plating surface. That flow path has a “snorkel” shape in which the outlet is higher than the inlet. In addition, the flow path may have a slot shape that spans much or all of the circumference of holding apparatus. It may be made from a material that resists deformation and corrosion such as certain ceramics.

Abstract: A cleat is disclosed that can be inserted into and locked into a receptacle in a shoe bottom as locking members engage portions of the receptacle in the shoe bottom. The cleat can be easily removed from the receptacle with minimal force, by pushing a pin inward to disengage locking members, freeing the cleat from the locking engagement allowing for removal of the cleat from the shoe bottom.

Abstract: An enhanced gaming system through which a variety of games of chance and/or games of skill can be made available to players. The gaming system separates game outcomes from game themes and game payout/buy-in information, thereby enhancing game flexibility. The gaming system also allows different games of chance and/or games of skill to be available to different subsets of player units, and gives a gaming hall operator the ability to dynamically control the size and distribution of such subsets. An “apparently random” permutation production technique is disclosed for use in certain games and regulatory environments. A PKI-based architecture is also disclosed.

Abstract: A vibration control system for an engine or transmission cover on a motor vehicle to absorb and dissipate gear or chain-induced vibration uses a piezoelectric strain actuator with a passive resonant control system to absorb and dissipate vibration at a fixed resonance frequency of transmission and engine timing covers. Another embodiment uses an open-loop active control system, based on signals already existing on-board in the engine controller and a control map of phase, amplitude and frequency. Still another embodiment employs a hybrid system, combining open- and closed-loop control.

Abstract: The present invention pertains to methods and apparatus for electroplating a substantially uniform layer of a metal onto a work piece having a seed layer thereon. The total current of a plating cell is distributed among a plurality of anodes in the plating cell in order to tailor the current distribution in the plating electrolyte to compensate for resistance and voltage variation across a work piece due to the seed layer. Focusing elements are used to create “virtual anodes” in proximity to the plating surface of the work piece to further control the current distribution in the electrolyte during plating.