Abstract: A microelectronic device comprises a base structure, a memory array overlying the base structure, and a conductive pad tier overlying the memory array. The base structure comprises a logic region including logic devices. The memory array comprises vertically extending strings of memory cells within a horizontal area of the logic region of the base structure. The conductive pad tier comprises first conductive pads substantially outside of the horizontal area of the logic region of the base structure, and second conductive pads horizontally neighboring the first conductive pads and within the horizontal area of the logic region of the base structure. Memory devices and electronic systems are also described.

Abstract: Memory devices might include a first latch to store a first data bit; a second latch to store a second data bit; a data line selectively connected to the first latch, the second latch, and a string of series-connected memory cells; and a controller configured to bias the data line during a programing operation of a selected memory cell. The controller may with the first data bit equal to 0 and the second data bit equal to 0, bias the data line to a first voltage level; with the first data bit equal to 1 and the second data bit equal to 0, bias the data line to a second voltage level; with the first data bit equal to 0 and the second data bit equal to 1, bias the data line to a third voltage level; and with the first data bit equal to 1 and the second data bit equal to 1, bias the data line to a fourth voltage level.

Abstract: Memory devices might include a first latch to store a first data bit; a second latch to store a second data bit; a data line selectively connected to the first latch, the second latch, and a string of series-connected memory cells; and a controller configured to bias the data line during a programing operation of a selected memory cell. The controller may with the first data bit equal to 0 and the second data bit equal to 0, bias the data line to a first voltage level; with the first data bit equal to 1 and the second data bit equal to 0, bias the data line to a second voltage level; with the first data bit equal to 0 and the second data bit equal to 1, bias the data line to a third voltage level; and with the first data bit equal to 1 and the second data bit equal to 1, bias the data line to a fourth voltage level.

Abstract: Memory array structures providing for determination of resistive characteristics of access lines might include a first block of memory cells, a second block of memory cells, a first current path between a particular access line of the first block of memory cells and a particular access line of the second block of memory cells, and, optionally, a second current path between the particular access line of the second block of memory cells and a different access line of the first block of memory cells. Methods for determining resistive characteristics of access lines might include connecting the particular access line of the first block of memory cells to a driver, and determining the resistive characteristics in response to a current level through that access line and a voltage level of that access line.

Abstract: A device includes a memory array and a sense circuit coupled with the memory array. The sense circuit includes a sense node coupled with a data line of the memory array. A first sensing path includes a first transistor having a first gate coupled with the sense node. A second sensing path includes a second transistor having a second gate coupled with the sense node. A first threshold voltage of the first transistors differs from a second threshold voltage of the second transistor by a threshold voltage gap.

Abstract: Apparatus having an array of memory cells and a controller for access of the array of memory cells, wherein the controller is configured to cause the apparatus to apply a reference current to a selected access line, determine a time difference between a voltage level of a near end of the selected access line being deemed to exceed a first voltage level while applying the reference current and the voltage level of the near end of the selected access line being deemed to exceed a second voltage level while applying the reference current, and determine a capacitance value of the selected access line in response to a current level of the reference current, the time difference, and a voltage difference between the second voltage level and the first voltage level.

Abstract: A first programming pulse is caused to be applied to a wordline associated with a memory cell of the memory sub-system. In response to first programming pulse, causing a program verify operation to be performed to determine a measured threshold voltage associated with the memory cell. The measured threshold voltage associated with the memory cell is stored in a sensing node. A determination is made that the measured threshold voltage of the memory cell satisfies a condition and the measured threshold voltage stored in the sensing node is identified. A bitline voltage matching the measured threshold voltage is caused to be applied to a bitline associated with the memory cell.

Abstract: Apparatus having an array of memory cells and a controller for access of the array of memory cells, wherein the controller is configured to cause the apparatus to determine capacitance and/or resistance values of an access line in response to applying a reference current to the access line, wherein the access line is connected to control gates of memory cells of the array of memory cells.

Abstract: A processing device in a memory system receives an erase request to erase data stored at a data block of a memory device, the erase request identifying a selected sub-block of a plurality of sub-blocks of the data block for erase, each of the plurality of sub-blocks comprising select gate devices (SGDs) and data storage devices. For each sub-block of the plurality of sub-blocks not selected for erase, the processing device applies an input voltage at a bitline of the respective sub-block and applies a plurality of gate voltages to a plurality of wordlines of the respective sub-block, the plurality of wordlines are coupled to the SGDs and to the data storage devices, each voltage of the plurality of voltages applied to a successive wordline of the plurality of wordlines is less than a previous voltage applied to a previous wordline.

Abstract: A device includes a memory array and a sense circuit coupled with the memory array. The sense circuit includes a sense node coupled with a data line of the memory array. A first sensing path includes a first transistor having a first gate coupled with the sense node. A second sensing path includes a second transistor having a second gate coupled with the sense node. A first threshold voltage of the first transistors differs from a second threshold voltage of the second transistor by a threshold voltage gap.

Abstract: A first programming pulse is caused to be applied to a wordline associated with a memory cell of the memory sub-system. In response to first programming pulse, causing a program verify operation to be performed to determine a measured threshold voltage associated with the memory cell. The measured threshold voltage associated with the memory cell is stored in a sensing node. A determination is made that the measured threshold voltage of the memory cell satisfies a condition and the measured threshold voltage stored in the sensing node is identified. A bitline voltage matching the measured threshold voltage is caused to be applied to a bitline associated with the memory cell.

Abstract: A processing device in a memory system receives an erase request to erase data stored at a data block of a memory device, the erase request identifying a selected sub-block of a plurality of sub-blocks of the data block for erase, each of the plurality of sub-blocks comprising select gate devices (SGDs) and data storage devices. For each sub-block of the plurality of sub-blocks not selected for erase, the processing device applies an input voltage at a bitline of the respective sub-block and applies a plurality of gate voltages to a plurality of wordlines of the respective sub-block, the plurality of wordlines are coupled to the SGDs and to the data storage devices, each voltage of the plurality of voltages applied to a successive wordline of the plurality of wordlines is less than a previous voltage applied to a previous wordline by an amount equal to a step down interval.

Abstract: A system for liquid component fractionation includes a first container, a second container, a tunnel connecting member and a stopcock valve. The stopcock valve is a three-way valve disposed at the tunnel connecting member and is rotatable to align one of three ports of the stopcock valve to a collection outlet member of the tunnel connecting member, so as to facilitate collection of a fractionated layer from a liquid after the system is centrifuged.

Abstract: Memory array structures providing for determination of resistive characteristics of access lines might include a first block of memory cells, a second block of memory cells, a first current path between a particular access line of the first block of memory cells and a particular access line of the second block of memory cells, and, optionally, a second current path between the particular access line of the second block of memory cells and a different access line of the first block of memory cells. Methods for determining resistive characteristics of access lines might include connecting the particular access line of the first block of memory cells to a driver, and determining the resistive characteristics in response to a current level through that access line and a voltage level of that access line.

Abstract: A processing device in a memory system receives an erase request to erase data stored at a data block of a memory device, the erase request identifying a selected sub-block of a plurality of sub-blocks of the data block for erase, each of the plurality of sub-blocks comprising select gate devices (SGDs) and data storage devices. For each sub-block of the plurality of sub-blocks not selected for erase, the processing device applies an input voltage at a bitline of the respective sub-block and applies a plurality of gate voltages to a plurality of wordlines of the respective sub-block, the plurality of wordlines are coupled to the SGDs and to the data storage devices, each voltage of the plurality of voltages applied to a successive wordline of the plurality of wordlines is less than a previous voltage applied to a previous wordline by an amount equal to a step down interval.

Abstract: Apparatus having an array of memory cells and a controller for access of the array of memory cells, wherein the controller is configured to cause the apparatus to determine capacitance and/or resistance values of an access line in response to applying a reference current to the access line, wherein the access line is connected to control gates of memory cells of the array of memory cells.

Abstract: New and/or improved coatings, layers or treatments for porous substrates, including battery separators or separator membranes, and/or coated or treated porous substrates, including coated battery separators, and/or batteries or cells including such coatings or coated separators, and/or related methods including methods of manufacture and/or of use thereof are disclosed. Also, new or improved coatings for porous substrates, including battery separators, which comprise at least a matrix material or a polymeric binder, and heat-resistant particles with additional additives, materials or components, and/or to new or improved coated or treated porous substrates, including battery separators, where the coating comprises at least a matrix material or a polymeric binder, and heat-resistant particles with additional additives, materials or components are disclosed.

Abstract: Apparatus and methods to vary, in response to temperature, a precharge voltage level of a sense node during a sense operation, a sense node develop time during the sense operation, and/or a ratio of a deboost voltage level capacitively decoupled from the sense node to a boost voltage level capacitively coupled to the sense node during the sense operation.

Abstract: The invention provides a circuit structure sharing the same memory, where the circuit structure includes a first volatile memory, a system chip and a signal processing chip. The system chip is connected to the first volatile memory via a first connection interface. The signal processing chip is connected to the system chip via a second connection interface. A memory controller is disposed in the system chip and connected to the first connection interface and the second connection interface. The signal processing chip transmits a first access command to the memory controller via the second connection interface, and the memory controller accesses the first volatile memory via the first connection interface according to the first access command and transmits the access result of the first access command to the signal processing chip via the second connection interface.