Patents by Inventor Edmund Riedl

Edmund Riedl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Diffusion solder position, and process for producing it
    Publication number: 20050048758
    Abstract: A diffusion solder position between two parts has intermetallic phases formed by two solder components. Nanoparticles of a filler material are three-dimensionally distributed in its diffusion region in addition to the intermetallic phases. Furthermore, a process for producing the diffusion solder position and for producing an electronic power component, which has a plurality of diffusion solder positions, is provided.
    Type: Application
    Filed: August 27, 2004
    Publication date: March 3, 2005
    Inventors: Khalil Hosseini, Edmund Riedl
  • Connection device and method for producing the same
    Patent number: 6727587
    Abstract: A connection device for a circuitry device connects a circuitry unit with a contact device to thermo-mechanically uncouple the circuitry unit and the contact device by forming the connection device as a metallic section and/or an alloy section having a buffer region, an intermediate region, and a connection region. The buffer region is of silver, the intermediate region (14) is of a silver-tin alloy region, and the connection region (16) is of an intermetallic substrate and, in particular, of an intermetallic tin-substrate.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: April 27, 2004
    Assignee: Infineon Technologies AG
    Inventor: Edmund Riedl
  • Connection device and method for producing the same
    Publication number: 20030201532
    Abstract: A connection device for a circuitry device connects a circuitry unit with a contact device to thermo-mechanically uncouple the circuitry unit and the contact device by forming the connection device as a metallic section and/or an alloy section having a buffer region, an intermediate region, and a connection region. The buffer region is of silver, the intermediate region (14) is of a silver-tin alloy region, and the connection region (16) is of an intermetallic substrate and, in particular, of an intermetallic tin-substrate.
    Type: Application
    Filed: April 30, 2002
    Publication date: October 30, 2003
    Inventor: Edmund Riedl