Patents by Inventor Ehsanollah Fathi
Ehsanollah Fathi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240133940Abstract: This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.Type: ApplicationFiled: December 27, 2023Publication date: April 25, 2024Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20240136215Abstract: The present disclosure relates to transfer of a selected set of microdevices from a donor substrate to a receiver/system substrate while there can be already microdevices transferred in the system substrate. In particular the invention deals with pads with a hard base and soft shell. In addition, use of a stage to facilitate the microdevice transfer is detailed.Type: ApplicationFiled: February 22, 2022Publication date: April 25, 2024Applicant: VueReal Inc.Inventors: Gholamreza CHAJI, Ehsanollah FATHI, Hossein Zamani SIBONI, Dana Saud Yousef AYYASH
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Publication number: 20240124297Abstract: The present disclosure relates to transfer of a selected set of microdevices from a donor substrate to a receiver/system substrate while there can be already microdevices transferred in the system substrate. In particular the invention deals with methods to transfer microdevices to a system substrate that do not damage already transferred microdevices, by using donor substrate heights, cavities and use of sacrificial layers.Type: ApplicationFiled: February 22, 2022Publication date: April 18, 2024Applicant: VueReal Inc.Inventors: Gholamreza CHAJI, Ehsanollah FATHI, Hossein Zamani SIBONI, Dana Saud Yousef AYYASH
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Publication number: 20240120173Abstract: The present disclosure relates to integrating microdevices into a system substrate. In particular it relates to measuring microdevices using an electron beam method using one or several tips as Ebeam sources. The disclosure further outlines methods to target Ebeams effectively to produce an optimum result with minimal damage to adjacent microdevices and components.Type: ApplicationFiled: January 28, 2022Publication date: April 11, 2024Applicant: VueReal Inc.Inventors: Gholamreza CHAJI, Ehsanollah FATHI, Chang Ho PARK
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Patent number: 11929010Abstract: This disclosure is related to compensation of micro devices based on cartridge information.Type: GrantFiled: April 3, 2020Date of Patent: March 12, 2024Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Patent number: 11916096Abstract: An integrated optical display system includes a backplane with appropriate electronics, and an array of micro-devices. A touch sensing structure may be integrated into the system. In one embodiment, an integrated circuit and system is integrated on top of micro-devices transferred to a substrate. Openings in a planarization layer (or layers) may be provided to connect the micro-devices with electrodes and other circuitry. Light reflectors may be used to redirect the light, and color conversion layers or color filters may be integrated before the micro-devices or on the substrate surface opposite to the surface of micro-devices.Type: GrantFiled: August 25, 2020Date of Patent: February 27, 2024Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Yaser Azizi, Ehsanollah Fathi
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Publication number: 20240063209Abstract: Various embodiments include methods of fabricating an array of self-aligned vertical solid state devices and integrating the devices to a system substrate. The method of fabricating a self-aligned vertical solid state device comprising: providing a semiconductor substrate, depositing a plurality of device layers on the semiconductor substrate, depositing an ohmic contact layer on an upper surface of one of the plurality of device layers, wherein the device layers comprises an active layer and a doped conductive layer, forming a patterned thick conductive layer on the ohmic contact layer; and selectively etching down the doped conductive layer that does not substantially etch the active layer.Type: ApplicationFiled: October 27, 2023Publication date: February 22, 2024Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Patent number: 11892497Abstract: This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.Type: GrantFiled: March 7, 2023Date of Patent: February 6, 2024Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20240030195Abstract: The present disclosure relates to development of microdevices on a substrate that can be released and transferred to a system substrate. The disclosure further relates to methods to integrate anchors to hold a microdevice to a substrate. The microdevices are in different configurations with respect to anchors, release layers, buffers layers and substrate.Type: ApplicationFiled: November 12, 2021Publication date: January 25, 2024Applicant: VueReal Inc.Inventors: Gholamreza CHAJI, Hossein Zamani SIBONI, Ehsanollah FATHI
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Patent number: 11870006Abstract: The present invention provides light-emitting devices with improved quantum efficiency. The light emitting diode structure comprising: a p-doped layer an n-doped layer; and a multiple quantum well structure sandwiched between the p-doped layer and n-doped layer, wherein the multiple quantum well structure comprising a quantum well disposed between n-doped barrier layers.Type: GrantFiled: October 16, 2020Date of Patent: January 9, 2024Assignee: VueReal Inc.Inventors: Jian Yin, Dayan Ban, Ehsanollah Fathi, Gholamreza Chaji
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Publication number: 20230395560Abstract: This disclosure is related to integrating microdevices into a system substrate. In particular the microdevices are transferred from a donor substrate into a system backplane where the microdevices connection pads are adhered to a pads on the system substrate at a temperature that is below the melting point of the materials on the pads of the system substrate and microdevice pads. The present disclosure also relates to integrating vertical microdevices into a system substrate. The system substrate can have a backplane circuit as well. The integration covers the microdevices with dielectrics and couples the backplane through a VIA. The disclosure further relates to a method and structure of microdevice or optoelectronic devices that allows for misalignment adjustment. The microdevices comprise a stack of semiconductor layers that in configuration with electrodes, substrate, VIA's and size factors minimize misalignment.Type: ApplicationFiled: September 2, 2021Publication date: December 7, 2023Applicant: VueReal Inc.Inventors: Gholamreza CHAJI, Ehsanollah FATHI, Hossein Zamani SIBONI, Lauren LESERGENT, David HWANG, Pranav GAVIRNENI
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Patent number: 11830868Abstract: Various embodiments include methods of fabricating an array of self-aligned vertical solid state devices and integrating the devices to a system substrate. The method of fabricating a self-aligned vertical solid state device comprising: providing a semiconductor substrate, depositing a plurality of device layers on the semiconductor substrate, depositing an ohmic contact layer on an upper surface of one of the plurality of device layers, wherein the device layers comprises an active layer and a doped conductive layer, forming a patterned thick conductive layer on the ohmic contact layer; and selectively etching down the doped conductive layer that does not substantially etch the active layer.Type: GrantFiled: March 25, 2022Date of Patent: November 28, 2023Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20230361239Abstract: A micro device structure comprising at least part of an edge of a micro device is covered with a metal-insulator-semiconductor (MIS) structure, wherein the MIS structure comprises a MIS dielectric layer and a MIS gate conductive layer, at least one gate pad provided to the MIS gate conductive layer, and at least one micro device contact extended upwardly on a top surface of the micro device.Type: ApplicationFiled: July 21, 2023Publication date: November 9, 2023Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi, Hossein Zamani Siboni
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Publication number: 20230341456Abstract: This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.Type: ApplicationFiled: March 7, 2023Publication date: October 26, 2023Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20230327050Abstract: What is disclosed is various aspects of the structure of flip chip or lateral micro devices having protection of connections. The various aspects comprise a structural combination of functional layers such as doped or blocking layers or quantum well structure, as well as dielectric layers, VIA's, optical enhancements layers, connection pads, protective layers, masks and additional layers. In addition, methods of fabrication of microdevices have also been disclosed where in patterning has been used. The present disclosure further relates to integrating vertical microdevices into a system substrate. The system substrate can have a backplane circuit as well. The integration covers the microdevices with dielectrics and couples the backplane through a VIA.Type: ApplicationFiled: September 2, 2021Publication date: October 12, 2023Applicant: VueReal Inc.Inventors: Gholamreza CHAJI, Ehsanollah FATHI, Hossein Zamani SIBONI
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Publication number: 20230326937Abstract: In a micro-device integration process, a donor substrate is provided on which to conduct the initial manufacturing and pixelation steps to define the micro devices, including functional, e.g. light emitting layers, sandwiched between top and bottom conductive layers. The micro-devices are then transferred to a system substrate for finalizing and electronic control integration. The transfer may be facilitated by various means, including providing a continuous light emitting functional layer, breakable anchors on the donor substrates, temporary intermediate substrates enabling a thermal transfer technique, or temporary intermediate substrates with a breakable substrate bonding layer.Type: ApplicationFiled: June 13, 2023Publication date: October 12, 2023Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Patent number: 11764199Abstract: Various embodiments include methods of fabricating an array of self-aligned vertical solid state devices and integrating the devices to a system substrate. The method of fabricating a self-aligned vertical solid state device comprising: providing a semiconductor substrate, depositing a plurality of device layers on the semiconductor substrate, depositing an ohmic contact layer on an upper surface of one of the plurality of device layers, wherein the device layers comprises an active layer and a doped conductive layer, forming a patterned thick conductive layer on the ohmic contact layer; and selectively etching down the doped conductive layer that does not substantially etch the active layer.Type: GrantFiled: August 21, 2019Date of Patent: September 19, 2023Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Patent number: 11735545Abstract: A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.Type: GrantFiled: July 1, 2021Date of Patent: August 22, 2023Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Patent number: 11735546Abstract: A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.Type: GrantFiled: January 6, 2022Date of Patent: August 22, 2023Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Patent number: 11735547Abstract: A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.Type: GrantFiled: January 6, 2022Date of Patent: August 22, 2023Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi