Patents by Inventor Ehsanollah Fathi
Ehsanollah Fathi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210098562Abstract: What is disclosed is structures and methods to integrate microdevices into system or receiver substrates. The integration of microdevices is facilitated by adding staging pads to microdevices before or after transferring. Creating stages after the transfer of a first microdevice to a substrate for the subsequent microdevice transfer to the first (or the second) microdevice transfer. The stage improves the surface profile of the substrate so that next microdevice can be transferred without the first microdevice on the substrate get damaged by or interfere with the surface of the donor or transfer head. Some embodiments further relate to tiled display device and more particularly, to stacking tiles to a backplane to form the tiled display device.Type: ApplicationFiled: December 14, 2020Publication date: April 1, 2021Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Won Kyu Ha, Aaron Daniel Trent Wiersma, Ehsanollah Fathi
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Publication number: 20210074573Abstract: In a micro-device integration process, a donor substrate is provided on which to conduct the initial manufacturing and pixelation steps to define the micro devices, including functional, e.g. light emitting layers, sandwiched between top and bottom conductive layers. The microdevices are then transferred to a system substrate for finalizing and electronic control integration. The transfer may be facilitated by various means, including providing a continuous light emitting functional layer, breakable anchors on the donor substrates, temporary intermediate substrates enabling a thermal transfer technique, or temporary intermediate substrates with a breakable substrate bonding layer.Type: ApplicationFiled: October 29, 2020Publication date: March 11, 2021Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20210050477Abstract: The present invention provides light-emitting devices with improved quantum efficiency. The light emitting diode structure comprising: a p-doped layer an n-doped layer; and a multiple quantum well structure sandwiched between the p-doped layer and n-doped layer, wherein the multiple quantum well structure comprising a quantum well disposed between n-doped barrier layers.Type: ApplicationFiled: October 16, 2020Publication date: February 18, 2021Applicant: VueReal Inc.Inventors: Jian Yin, Dayan Ban, Ehsanollah Fathi, Gholamreza Chaji
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Publication number: 20200388597Abstract: An integrated optical display system includes a backplane with appropriate electronics, and an array of micro-devices. A touch sensing structure may be integrated into the system. In one embodiment, an integrated circuit and system is integrated on top of micro-devices transferred to a substrate. Openings in a planarization layer (or layers) may be provided to connect the micro-devices with electrodes and other circuitry. Light reflectors may be used to redirect the light, and color conversion layers or color filters may be integrated before the micro-devices or on the substrate surface opposite to the surface of micro-devices.Type: ApplicationFiled: August 25, 2020Publication date: December 10, 2020Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Yaser Azizi, EHSANOLLAH FATHI
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Publication number: 20200381584Abstract: The present invention provides light-emitting devices with improved quantum efficiency. The light emitting diode structure comprising: a p-doped layer an n-doped layer; and a multiple quantum well structure sandwiched between the p-doped layer and n-doped layer, wherein the multiple quantum well structure comprising a quantum well disposed between n-doped barrier layers.Type: ApplicationFiled: May 28, 2019Publication date: December 3, 2020Applicant: VueReal Inc.Inventors: Jian Yin, Dayan Ban, Ehsanollah Fathi, Gholamreza Chaji
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Publication number: 20200381582Abstract: A vertical current mode solid state device comprising a connection pad and side walls comprising a metal-insulator-semiconductor (MIS) structure, wherein leakage current effect of the vertical device is limited through the side walls by biasing the MIS structure.Type: ApplicationFiled: August 20, 2020Publication date: December 3, 2020Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi, Hossein Zamani Siboni
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Patent number: 10847571Abstract: Post-processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structures such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. Dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with transferred micro devices. Color conversion layers may be integrated into the system substrate to create different outputs from the micro devices.Type: GrantFiled: August 21, 2018Date of Patent: November 24, 2020Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Patent number: 10840408Abstract: The present invention provides light-emitting devices with improved quantum efficiency. The light emitting diode structure comprising: a p-doped layer, an n-doped layer; and a multiple quantum well structure sandwiched between the p-doped layer and n-doped layer, wherein the multiple quantum well structure comprising a quantum well disposed between n-doped barrier layers.Type: GrantFiled: May 28, 2019Date of Patent: November 17, 2020Assignee: VueReal Inc.Inventors: Jian Yin, Dayan Ban, Ehsanollah Fathi, Gholamreza Chaji
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Publication number: 20200350281Abstract: A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.Type: ApplicationFiled: July 16, 2020Publication date: November 5, 2020Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20200328249Abstract: This disclosure is related to post processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structure such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. In another example, dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with the transferred micro devices. In another example, color conversion layers are integrated into the system substrate to create different output from the micro devices.Type: ApplicationFiled: June 25, 2020Publication date: October 15, 2020Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Patent number: 10784398Abstract: A vertical current mode solid state device comprising a connection pad and side walls comprising a metal-insulator-semiconductor (MIS) structure, wherein leakage current effect of the vertical device is limited through the side walls by biasing the MIS structure.Type: GrantFiled: December 23, 2016Date of Patent: September 22, 2020Assignee: VUEREAL INC.Inventors: Gholamreza Chaji, Ehsanollah Fathi, Hossein Zamani Siboni
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Publication number: 20200273945Abstract: What is disclosed is structures and methods to integrate microdevices into system or receiver substrates. The integration of microdevices is facilitated by adding staging pads to microdevices before or after transferring. Creating stages after the transfer of a first microdevice to a substrate for the subsequent microdevice transfer to the first (or the second) microdevice transfer. The stage improves the surface profile of the substrate so that next microdevice can be transferred without the first microdevice on the substrate get damaged by or interfere with the surface of the donor or transfer head. Some embodiments further relate to tiled display device and more particularly, to stacking tiles to a backplane to form the tiled display device.Type: ApplicationFiled: August 21, 2019Publication date: August 27, 2020Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Won Kyu Ha, Aaron Daniel Trent Wiersma, Ehsanollah Fathi
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Patent number: 10700120Abstract: This disclosure is related to post processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structure such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. In another example, dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with the transferred micro devices. In another example, color conversion layers are integrated into the system substrate to create different output from the micro devices.Type: GrantFiled: July 18, 2017Date of Patent: June 30, 2020Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20200161290Abstract: Various embodiments include methods of fabricating an array of self-aligned vertical solid state devices and integrating the devices to a system substrate. The method of fabricating a self-aligned vertical solid state device comprising: providing a semiconductor substrate, depositing a plurality of device layers on the semiconductor substrate, depositing an ohmic contact layer on an upper surface of one of the plurality of device layers, wherein the device layers comprises an active layer and a doped conductive layer, forming a patterned thick conductive layer on the ohmic contact layer; and selectively etching down the doped conductive layer that does not substantially etch the active layer.Type: ApplicationFiled: August 21, 2019Publication date: May 21, 2020Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20200091388Abstract: Methods and structures are disclosed for highly efficient vertical devices. The vertical device comprising a plurality of planar active layers formed on a substrate, at least one of a top layer of the plurality of the layers is formed as a plurality of nano-pillars and a passivation layer formed on a space between the plurality of the nanopillars.Type: ApplicationFiled: August 8, 2019Publication date: March 19, 2020Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi, Yunhan Li, Hossein Zamani Siboni
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Publication number: 20200025818Abstract: This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.Type: ApplicationFiled: August 15, 2019Publication date: January 23, 2020Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20200013761Abstract: An integrated optical display system includes a backplane with appropriate electronics, and an array of micro-devices. A touch sensing structure may be integrated into the system. In one embodiment, an integrated circuit and system is integrated on top of micro-devices transferred to a substrate. Openings in a planarization layer (or layers) may be provided to connect the micro-devices with electrodes and other circuitry. Light reflectors may be used to redirect the light, and color conversion layers or color filters may be integrated before the micro-devices or on the substrate surface opposite to the surface of micro-devices.Type: ApplicationFiled: August 15, 2019Publication date: January 9, 2020Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi, Bahareh Sadeghimakki, Hossein Zamani Siboni
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Publication number: 20200013662Abstract: In a micro-device integration process, a donor substrate is provided on which to conduct the initial manufacturing and pixelation steps to define the micro devices, including functional, e.g. light emitting layers, sandwiched between top and bottom conductive layers. The microdevices are then transferred to a system substrate for finalizing and electronic control integration. The transfer may be facilitated by various means, including providing a continuous light emitting functional layer, breakable anchors on the donor substrates, temporary intermediate substrates enabling a thermal transfer technique, or temporary intermediate substrates with a breakable substrate bonding layer.Type: ApplicationFiled: August 15, 2019Publication date: January 9, 2020Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20190371868Abstract: A method of manufacturing a pixelated structure may be provided. The method may comprising providing a donor substrate comprising the plurality of pixelated microdevices, bonding a selective set of the pixelated microdevices from the donor substrate to a system substrate; and patterning a bottom conductive layer of the pixelated microdevices after separating the donor substrate from the system substrate. The patterning may be done by fully isolating the layers or leaving some thin layers between the patterns.Type: ApplicationFiled: August 15, 2019Publication date: December 5, 2019Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Patent number: 10488455Abstract: This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.Type: GrantFiled: October 4, 2017Date of Patent: November 26, 2019Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi