Patents by Inventor Ehsanollah Fathi
Ehsanollah Fathi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11735623Abstract: This disclosure is related to post processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structure such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. In another example, dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with the transferred micro devices. In another example, color conversion layers are integrated into the system substrate to create different output from the micro devices.Type: GrantFiled: June 25, 2020Date of Patent: August 22, 2023Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20230260856Abstract: The present invention relates to the inspection process which includes providing access to the microdevice contacts, measuring the microdevice and analyzing the data to identify defects or performance of the micro device. The invention also relates to the forming of test electrodes on microdevices. The test electrodes may be connected to hidden contacts. The type of microdevices may be vertical, lateral or a flip chip.Type: ApplicationFiled: July 15, 2021Publication date: August 17, 2023Applicant: VueReal Inc.Inventors: Gholamreza CHAJI, Ehsanollah FATHI, Hossein Zamani SIBONI, David HWANG
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Publication number: 20230261146Abstract: The present invention discloses a different option electronic devices with their structure so layers that include doping, function, ohmic, conductive, planarization and passivation layer. The invention also discloses configuration of connections of top and bottom sides comprising isolated structures, related electrodes and height configuration of isolated structures.Type: ApplicationFiled: July 22, 2021Publication date: August 17, 2023Applicant: VueReal Inc.Inventors: Gholamreza CHAJI, Ehsanollah FATHI, Hossein Zamani SIBONI
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Patent number: 11728302Abstract: A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.Type: GrantFiled: July 16, 2020Date of Patent: August 15, 2023Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Patent number: 11728306Abstract: A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.Type: GrantFiled: January 6, 2022Date of Patent: August 15, 2023Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Patent number: 11721784Abstract: A micro device structure comprising at least part of an edge of a micro device is covered with a metal-insulator-semiconductor (MIS) structure, wherein the MIS structure comprises a MIS dielectric layer and a MIS gate conductive layer, at least one gate pad provided to the MIS gate conductive layer, and at least one micro device contact extended upwardly on a top surface of the micro device.Type: GrantFiled: June 28, 2022Date of Patent: August 8, 2023Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi, Hossein Zamani Siboni
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Publication number: 20230207611Abstract: This disclosure is related to post processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structure such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. In another example, dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with the transferred micro devices. In another example, color conversion layers are integrated into the system substrate to create different output from the micro devices.Type: ApplicationFiled: March 2, 2023Publication date: June 29, 2023Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20230178529Abstract: An integrated optical display system includes a backplane with appropriate electronics, and an array of micro-devices. A touch sensing structure may be integrated into the system. In one embodiment, an integrated circuit and system is integrated on top of micro-devices transferred to a substrate. Openings in a planarization layer (or layers) may be provided to connect the micro-devices with electrodes and other circuitry. Light reflectors may be used to redirect the light, and color conversion layers or color filters may be integrated before the micro-devices or on the substrate surface opposite to the surface of micro-devices.Type: ApplicationFiled: January 30, 2023Publication date: June 8, 2023Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi, Bahareh Sadeghimakki, Hossein Zamani Siboni
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Publication number: 20230178528Abstract: An integrated optical display system includes a backplane with appropriate electronics, and an array of micro-devices. A touch sensing structure may be integrated into the system. In one embodiment, an integrated circuit and system is integrated on top of micro-devices transferred to a substrate. Openings in a planarization layer (or layers) may be provided to connect the micro-devices with electrodes and other circuitry. Light reflectors may be used to redirect the light, and color conversion layers or color filters may be integrated before the micro-devices or on the substrate surface opposite to the surface of micro-devices.Type: ApplicationFiled: January 30, 2023Publication date: June 8, 2023Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi, Bahareh Sadeghimakki, Hossein Zamani Siboni
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Publication number: 20230170338Abstract: An integrated optical display system includes a backplane with appropriate electronics, and an array of micro-devices. A touch sensing structure may be integrated into the system. In one embodiment, an integrated circuit and system is integrated on top of micro-devices transferred to a substrate. Openings in a planarization layer (or layers) may be provided to connect the micro-devices with electrodes and other circuitry. Light reflectors may be used to redirect the light, and color conversion layers or color filters may be integrated before the micro-devices or on the substrate surface opposite to the surface of micro-devices.Type: ApplicationFiled: January 30, 2023Publication date: June 1, 2023Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi, Bahareh Sadeghimakki, Hossein Zamani Siboni
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Publication number: 20230154790Abstract: This disclosure relates to the process of etching and treatment of side walls while processing microdevices. One aspect is to fill the device wall indentation with a polymer. The disclosure relates to a method and device with its structure to the process of etching and treatment of sidewalls. The methods of etching, coating, and curing are used.Type: ApplicationFiled: March 23, 2021Publication date: May 18, 2023Applicant: VueReal Inc.Inventors: Gholamreza CHAJI, Ehsanollah FATHI
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Patent number: 11624770Abstract: This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.Type: GrantFiled: August 15, 2019Date of Patent: April 11, 2023Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20230104412Abstract: Methods and structures are disclosed for highly efficient vertical devices. The vertical device comprising a plurality of planar active layers formed on a substrate, at least one of a top layer of the plurality of the layers is formed as a plurality of nano-pillars and a passivation layer formed on a space between the plurality of the nanopillars.Type: ApplicationFiled: October 19, 2022Publication date: April 6, 2023Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi, Yunhan Li, Hossein Zamani Siboni
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Publication number: 20230078708Abstract: In a micro-device integration process, a donor substrate is provided on which to conduct the initial manufacturing and pixelation steps to define the micro devices, including functional, e.g. light emitting layers, sandwiched between top and bottom conductive layers. The microdevices are then transferred to a system substrate for finalizing and electronic control integration. The transfer may be facilitated by various means, including providing a continuous light emitting functional layer, breakable anchors on the donor substrates, temporary intermediate substrates enabling a thermal transfer technique, or temporary intermediate substrates with a breakable substrate bonding layer.Type: ApplicationFiled: November 9, 2022Publication date: March 16, 2023Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Patent number: 11600743Abstract: A microdevice structure comprising at least part of an edge of a microdevice is covered with a metal-insulator-semiconductor (MIS) structure, wherein the MIS structure comprises a MIS dielectric layer and a MIS gate conductive layer, at least one gate pad provided to the MIS gate conductive layer, and at least one micro device contact extended upwardly on a top surface of the micro device.Type: GrantFiled: May 31, 2019Date of Patent: March 7, 2023Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Hossein Zamani Siboni, Ehsanollah Fathi
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Publication number: 20230055752Abstract: Methods and structures are disclosed for highly efficient vertical devices. The vertical device comprising a plurality of planar active layers formed on a substrate, at least one of a top layer of the plurality of the layers is formed as a plurality of nano-pillars and a passivation layer formed on a space between the plurality of the nanopillars.Type: ApplicationFiled: October 19, 2022Publication date: February 23, 2023Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi, Yunhan Li, Hossein Zamani Siboni
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Patent number: 11552163Abstract: What is disclosed is structures and methods to integrate microdevices into system or receiver substrates. The integration of microdevices is facilitated by adding staging pads to microdevices before or after transferring. Creating stages after the transfer of a first microdevice to a substrate for the subsequent microdevice transfer to the first (or the second) microdevice transfer. The stage improves the surface profile of the substrate so that next microdevice can be transferred without the first microdevice on the substrate get damaged by or interfere with the surface of the donor or transfer head. Some embodiments further relate to tiled display device and more particularly, to stacking tiles to a backplane to form the tiled display device.Type: GrantFiled: August 21, 2019Date of Patent: January 10, 2023Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Won Kyu Ha, Aaron Daniel Trent Wiersma, Ehsanollah Fathi
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Publication number: 20220416116Abstract: The present disclosure deals with a method of integrating microdevices on a backplane using bonded pads. The process has a substrate having microdevices with bonding of selective microdevices through connecting pads on the microdevices and corresponding pads on the backplane, forming anchors and leaving the bonded selective set of microdevices on the backplane by separating the micro device substrate.Type: ApplicationFiled: December 18, 2020Publication date: December 29, 2022Applicant: VueReal Inc.Inventors: Gholamreza CHAJI, Ehsanollah FATHI
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Publication number: 20220416119Abstract: The present disclosure relates to a solid state micro device structure that has a microdevice formed on a substrate, with p and n doped layers, active layers between at least the two doped layers, pads coupled to each doped layer, and wherein the n-doped layer is modulated to have a lower conductivity towards an edge of the device. The invention further involves, dielectric layer, conductive layer, passivation layer and MIS structure.Type: ApplicationFiled: December 3, 2020Publication date: December 29, 2022Applicant: VueReal Inc.Inventors: Gholamreza CHAJI, Ehsanollah FATHI, Hossein Zamani SIBONI
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Patent number: 11476216Abstract: A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.Type: GrantFiled: July 1, 2021Date of Patent: October 18, 2022Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi