Abstract: [Problem] To provide a learning device for performing more efficient machine learning. [Solution] A learning device unit according to one embodiment comprises at least one learning device and a connection device for connecting an intermediate learning device having an internal state shared by another learning device unit to the at least one learning device.

Abstract: The present invention provides a mask for production of an organic EL element, an apparatus for producing an organic EL element, and a method for producing an organic EL element which can give reduced luminance unevenness and eased restrictions in the production apparatus. The mask of the present invention includes first to fourth opening regions arranged in a staggered pattern, the first, second, third, and fourth opening regions arranged in the given order in a first direction, the first, second, third, and fourth opening regions respectively including first, second, third, and fourth mask openings in a second direction perpendicular to the first direction, the mask including no mask openings on the side of the first opening region opposite to the third opening region, the first and second mask openings each having a shorter length in the first direction than each of the third and fourth mask openings.

Abstract: In an organic EL element including a positive electrode, a negative electrode, and a light emitting layer (recombination layer) provided between the positive electrode and the negative electrode, an electron transport layer and an electron injection layer are provided between the light emitting layer and the negative electrode, and are sequentially arranged in the direction from the light emitting layer to the negative electrode. A hole injection layer and a hole transport layer are provided between the light emitting layer and the positive electrode, and are sequentially arranged in the direction from the positive electrode to the light emitting layer. A buffer layer for suppressing the electron trapping properties is provided between the light emitting layer and the hole transport layer.

Abstract: The vapor deposition apparatus employs scanning vapor deposition, and includes a limiting component including a first plate portion; a second plate portion provided with a space from the first plate portion; and a joint portion combining the first plate portion with the second plate portion, the first plate portion being provided with an first opening, the second plate portion being provided with an second opening that faces the first opening, the vapor deposition apparatus including a first space between the first opening and the second opening, the vapor deposition apparatus including a second space between the first plate portion and the second plate portion, the first space being connected to the second space, the vapor deposition apparatus including a third space that is in the outside of the limiting component, the second space being connected to the third space.

Abstract: A mask for a vapor deposition apparatus includes an outer frame; a first bar disposed on an inner side of the outer frame and fixed to the outer frame; and a pattern forming portion disposed on the outer frame and the first bar and fixed to the outer frame. The pattern forming portion includes a plurality of mask openings for pattern formation. Each of the plurality of mask openings is disposed along a first direction. The plurality of mask openings are disposed in a second direction orthogonal to the first direction. The first bar is positioned between adjacent two mask openings among the plurality of mask openings when viewed along a third direction orthogonal to the first direction and the second direction, and is in contact with the pattern forming portion.

Abstract: An electronic device includes a substrate, and a press-fit terminal. The substrate includes a first surface, a second surface opposite to the first surface in a thickness direction of the substrate, a through hole, and an electrode formed in the first surface, the second surface, and a wall of the through hole. The press-fit terminal is fit into the through hole from the first surface while being elastically deformed. The press-fit terminal is connected to the electrode by a reaction force due to the elastic deformation of the press-fit terminal. The substrate includes (i) a core layer that is overlapped, in the thickness direction, with a contact portion of the electrode with the press-fit terminal, and (ii) a flexible layer that is at a position closer to the first surface than the core layer is to. The flexible layer has a lower elastic modulus than the core layer.

Abstract: A circuit board has a through hole extending from a front surface to a rear surface. A press-fit terminal is press-fitted from the front surface into the through hole and is connected to a land, which is formed on a wall surface of the through hole. A support member supports the rear surface of the circuit board when the press-fit terminal is press-fitted into the through hole. A housing has a bottom portion and an opening, which is on the opposite side of the bottom portion. The circuit board is affixed to the housing to cover both the opening and the support member. The support member is held and interposed between the rear surface and an inner surface of the bottom portion.

Abstract: A machine learning device that learns an operation of a robot for picking up, by a hand unit, any of a plurality of workpieces placed in a random fashion, including a bulk-loaded state, includes a state variable observation unit that observes a state variable representing a state of the robot, including data output from a three-dimensional measuring device that obtains a three-dimensional map for each workpiece, an operation result obtaining unit that obtains a result of a picking operation of the robot for picking up the workpiece by the hand unit, and a learning unit that learns a manipulated variable including command data for commanding the robot to perform the picking operation of the workpiece, in association with the state variable of the robot and the result of the picking operation, upon receiving output from the state variable observation unit and output from the operation result obtaining unit.

Abstract: A fault prediction system includes a machine learning device that learns conditions associated with a fault of an industrial machine. The machine learning device includes a state observation unit that, while the industrial machine is in operation or at rest, observes a state variable including, e.g., data output from a sensor, internal data of control software, or computational data obtained based on these data, a determination data obtaining unit that obtains determination data used to determine whether a fault has occurred in the industrial machine or the degree of fault, and a learning unit that learns the conditions associated with the fault of the industrial machine in accordance with a training data set generated based on a combination of the state variable and the determination data.

Abstract: A machine learning device for a robot that allows a human and the robot to work cooperatively, the machine learning device including a state observation unit that observes a state variable representing a state of the robot during a period in that the human and the robot work cooperatively; a determination data obtaining unit that obtains determination data for at least one of a level of burden on the human and a working efficiency; and a learning unit that learns a training data set for setting an action of the robot, based on the state variable and the determination data.

Abstract: The present invention provides a vapor deposition apparatus, a vapor deposition method, and a method for producing an organic electroluminescent element which can control the vapor deposition rate on the substrate in the entire vapor deposition region with excellent precision. The vapor deposition apparatus of the present invention that forms a film on a substrate includes a first thickness monitor; and a vapor deposition unit including a vapor deposition source, the apparatus being configured to perform vapor deposition while controlling the distance between a portion of the vapor deposition source designed to eject a vaporized material and a surface of the substrate on which the vapor deposition is performed, based on a measurement result from the first thickness monitor.

Abstract: The present invention provides a method for producing an organic EL element capable of shortening the film formation time while suppressing an increase in the blur width; and an organic EL display device. The method is for producing an organic EL element by scanning vapor deposition, in which one or more vapor deposition sources each are provided with ejection orifices that face the respective openings of a limiting plate, and the ejection orifices facing the same opening are spaced from each other to give a sum of distributions.

Abstract: The present invention provides a vapor deposition apparatus capable of preventing abnormal film formation due to scattering in vapor deposition streams; and a method for producing an organic electroluminescent element which includes forming a patterned thin film with the vapor deposition apparatus. The present invention relates to a vapor deposition apparatus that includes a vapor deposition source equipped with a nozzle that ejects vapor deposition particles; an integrated limiting plate equipped with a first limiting plate including an opening that is in front of the nozzle, and with second limiting plates placed in the opening in the first limiting plate; and a mask including slits. The present invention also relates to a method for producing electroluminescent elements that includes a vapor deposition step of forming a patterned thin film with the vapor deposition apparatus.

Abstract: The present invention relates to a vapor deposition device for forming a film on a substrate, including: a vapor deposition chamber; a vapor deposition unit including a vapor deposition mask provided with an opening for pattern formation; and a transport mechanism that is configured to transfer at least one of the substrate and the vapor deposition unit relative to the other in a first direction perpendicular to the normal direction of the vapor deposition mask and that is configured to cause the substrate to rest temporarily at a resting position relative to the vapor deposition unit. The substrate includes a vapor-deposition-target region, and the region does not overlap the opening of the vapor deposition mask when the substrate is at the resting position. The vapor deposition chamber is provided with a first vent and a second vent.

Abstract: A circuit board has a through hole extending from a front surface to a rear surface. A press-fit terminal is press-fitted from the front surface into the through hole and is connected to a land, which is formed on a wall surface of the through hole. A support member supports the rear surface of the circuit board when the press-fit terminal is press-fitted into the through hole. A housing has a bottom portion and an opening, which is on the opposite side of the bottom portion. The circuit board is affixed to the housing to cover both the opening and the support member. The support member is held and interposed between the rear surface and an inner surface of the bottom portion.

Abstract: The present invention provides a display device which inhibits deterioration in display quality caused by color mixture of luminescent layers. In a case where vapor deposition particles are deposited onto a substrate, P+2Lc?{(Ts×M+0.96×G×Wn)/(Ts?G)}+2Dm and 3 ?m?Dm ?5 ?m are satisfied, where “M” is a width of a mask opening, “Wn” is a width of an injection hole, “G” is a distance between the TFT substrate and a vapor deposition mask, “Ts” is a distance between the TFT substrate and a vapor deposition source, “P” is a width of a first pixel opening, and “Lc” is a width of a non-display region.

Abstract: The vapor deposition device includes a plurality of vapor deposition masks whose lengths in Y axis and X axis directions are shorter than those of a film formation target substrate. Vapor deposition masks adjacent to each other in the Y axis direction is positionally displaced in the X axis direction. In an overlapping area in which mask opening group areas adjacent to each other in the Y axis direction overlap with each other in the X axis direction, opening lengths in the Y axis direction become shorter toward the outer side of each of the mask opening group areas in the plan view.

Abstract: The vapor deposition apparatus employs scanning vapor deposition, and includes a limiting component including a first plate portion; a second plate portion provided with a space from the first plate portion; and a joint portion combining the first plate portion with the second plate portion, the first plate portion being provided with an first opening, the second plate portion being provided with an second opening that faces the first opening, the vapor deposition apparatus including a first space between the first opening and the second opening, the vapor deposition apparatus including a second space between the first plate portion and the second plate portion, the first space being connected to the second space, the vapor deposition apparatus including a third space that is in the outside of the limiting component, the second space being connected to the third space.

Abstract: The present invention provides a method for producing an organic EL element capable of shortening the film formation time while suppressing an increase in the blur width; and an organic EL display device.

Abstract: A vapor deposition unit (1) includes a vapor deposition mask (50), a vapor deposition source (10), and a limiting plate unit (20). The limiting plate unit (20) includes (i) a plurality of first limiting plates (32) separated from each other in an X axis direction and (ii) a plurality of second limiting plates (42) disposed directly above the first limiting plates (32) in a plan view and separated from each other in the X axis direction. At least two second limiting plates (42) are arranged in the X axis direction for each first limiting plate (32).