Patents by Inventor Eiichiro OKAHISA
Eiichiro OKAHISA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11118754Abstract: A light-emitting device includes a substrate; a lens array having a plurality of lens sections in a matrix pattern; and a plurality of semiconductor laser elements disposed on the substrate. Each of the semiconductor laser elements emits a respective laser beam, each laser beam having a beam shape with a greater width in a column direction than in a row direction on a light incident surface of each respective lens section. The lens sections have an inter-vertex distance in the row direction that is smaller than both (i) a maximum outer diameter of each of the lens sections, and (ii) an inter-vertex distance in the column direction. A curvature of the lens sections in the row direction is the same as a curvature of the lens sections in the column direction.Type: GrantFiled: March 8, 2019Date of Patent: September 14, 2021Assignee: NICHIA CORPORATIONInventors: Seiji Kiyota, Kazuma Kozuru, Eiichiro Okahisa
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Publication number: 20210265808Abstract: A semiconductor device includes: a package including: a lower surface, at least one first metal surface at an outer periphery of the lower surface, and at least one second metal surface at the lower surface at a location different from the at least one first metal surface; a mounting substrate disposed below the package and including: an upper surface, at least one first metal pattern disposed at the upper surface below the at least one first metal surface, and at least one second metal pattern disposed at the upper surface below the at least one second metal surface; a first bonding member containing a metal material and bonding the at least one first metal surface and the at least one first metal pattern; and a second bonding member containing a metal material and bonding the at least one second metal surface and the at least one second metal pattern.Type: ApplicationFiled: May 13, 2021Publication date: August 26, 2021Applicant: NICHIA CORPORATIONInventors: Shohei Itonaga, Eiichiro Okahisa
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Publication number: 20210180766Abstract: A light-emitting device includes: a substrate including a base and a side wall; a plurality of semiconductor laser elements disposed in a row direction and in a column direction on an upper surface of the base; a plurality of pairs of wires that penetrate the side wall in the row direction; and a lens array fixed to the substrate, the lens array comprising a plurality of lens sections disposed in the row direction and in the column direction above the plurality of semiconductor laser elements. Each laser beam that is emitted from the semiconductor laser elements and is incident on a light incident surface of the lens array has a beam shape with a greater width in the column direction than in the row direction.Type: ApplicationFiled: February 25, 2021Publication date: June 17, 2021Applicant: NICHIA CORPORATIONInventors: Seiji KIYOTA, Kazuma KOZURU, Eiichiro OKAHISA
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Patent number: 11038317Abstract: A method of manufacturing a semiconductor device includes: providing a package; providing a mounting substrate; providing at least one first bonding member disposed at a position connecting at least one first metal surface of the package and at least one first metal pattern of the mounting substrate; providing a second bonding member connecting at least one second metal surface of the package and at least one second metal pattern of the mounting substrate; and heating the at least one first bonding member and the at least one second bonding member at a temperature equal to or higher than both a bonding temperature of the at least one first bonding member and a bonding temperature of the at least one second bonding member, to bond the package and the mounting substrate together.Type: GrantFiled: June 13, 2019Date of Patent: June 15, 2021Assignee: NICHIA CORPORATIONInventors: Shohei Itonaga, Eiichiro Okahisa
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Publication number: 20210159665Abstract: A light emitting device includes: a base including: a main body, and a frame disposed on an upper surface of the main body; one or more laser elements disposed on the upper surface of the main body and positioned inward of the frame; and a cover including: a support member that is fixed to an upper surface of the frame and that has an opening inside the frame, and a light transmissive portion that is fixed to the support member and that is disposed so as to close the opening. A first interface, between the light transmissive portion and the support member, is located inward of and lower than a second interface, between the support member and the frame. A portion of the support member that extends at least from an outermost end of the first interface to an innermost end of the second interface has a constant thickness.Type: ApplicationFiled: February 5, 2021Publication date: May 27, 2021Applicant: NICHIA CORPORATIONInventors: Takuya HASHIMOTO, Eiichiro OKAHISA
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Patent number: 10965097Abstract: A light emitting device includes: a base including: a main body, and a frame disposed on an upper surface of the main body; one or more laser elements disposed on the upper surface of the main body and positioned inward of the frame; a cover including: a support member that is fixed on an upper surface of the frame and has an opening inside the frame, and a light transmissive portion disposed so as to close the opening; and a lens body disposed on the support member and above the light transmissive portion. A difference between a thermal expansion coefficient of the light transmissive portion and a thermal expansion coefficient of the lens body is smaller than a difference between a thermal expansion coefficient of the light transmissive portion and a thermal expansion coefficient of the main body.Type: GrantFiled: February 19, 2020Date of Patent: March 30, 2021Assignee: NICHIA CORPORATIONInventors: Takuya Hashimoto, Eiichiro Okahisa
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Publication number: 20210021097Abstract: A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.Type: ApplicationFiled: October 5, 2020Publication date: January 21, 2021Applicants: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takuya Hashimoto, Eiichiro Okahisa, Katsuya Nakazawa, Shigeru Matsushita, Sumio Uehara, Suguru Kobayashi, Kazuhito Yumoto
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Patent number: 10833473Abstract: A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.Type: GrantFiled: March 26, 2019Date of Patent: November 10, 2020Assignees: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takuya Hashimoto, Eiichiro Okahisa, Katsuya Nakazawa, Shigeru Matsushita, Sumio Uehara, Suguru Kobayashi, Kazuhito Yumoto
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Publication number: 20200185881Abstract: A light emitting device includes: a base including: a main body, and a frame disposed on an upper surface of the main body; one or more laser elements disposed on the upper surface of the main body and positioned inward of the frame; a cover including: a support member that is fixed on an upper surface of the frame and has an opening inside the frame, and a light transmissive portion disposed so as to close the opening; and a lens body disposed on the support member and above the light transmissive portion. A difference between a thermal expansion coefficient of the light transmissive portion and a thermal expansion coefficient of the lens body is smaller than a difference between a thermal expansion coefficient of the light transmissive portion and a thermal expansion coefficient of the main body.Type: ApplicationFiled: February 19, 2020Publication date: June 11, 2020Applicant: NICHIA CORPORATIONInventors: Takuya HASHIMOTO, Eiichiro OKAHISA
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Patent number: 10612754Abstract: A method for manufacturing a light-emitting device includes: providing a base including a first depressed portion and a second depressed portion both upwardly opening; and positioning and mounting at least one semiconductor laser element on or above the base based on a predetermined point on a line connecting the first depressed portion and the second depressed portion in a plan view.Type: GrantFiled: April 24, 2017Date of Patent: April 7, 2020Assignee: NICHIA CORPORATIONInventors: Seiji Kiyota, Eiichiro Okahisa
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Patent number: 10608406Abstract: A light emitting device includes: a base including: a main body, and a frame disposed on an upper surface of the main body; one or more laser elements disposed on the upper surface of the main body inward of the frame; a cover comprising: a support member that is fixed on an upper surface of the frame and has an opening inside the frame, and a light transmissive portion disposed so as to close the opening; and a lens body disposed above the light transmissive portion. The support member includes; a first portion fixed on the upper surface of the frame, a second portion on which the lens body is disposed, the second portion being positioned inward of and lower than the first portion, and a third portion on which the light transmissive portion is disposed, the third portion being disposed inward of and lower than the second portion.Type: GrantFiled: November 28, 2018Date of Patent: March 31, 2020Assignee: NICHIA CORPORATIONInventors: Takuya Hashimoto, Eiichiro Okahisa
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Patent number: 10535972Abstract: An electronic component package includes: a metal plate; a metal wall that is disposed on the metal plate; a metal frame that is disposed on the metal plate so as to be opposed to the metal wall; a through hole that is formed in the metal wall; an opening hole that is formed in the metal frame so as to be opposed to the through hole; and a lead that is hermetically sealed with a sealing portion provided in the through hole, and that is inserted into the opening hole and the through hole. The metal frame includes: a side plate that is opposed to the metal wall; a bent portion that is connected to the side plate and has a round shape; and a welding portion that is connected to the bent portion and to which a lid member is to be bonded.Type: GrantFiled: August 6, 2018Date of Patent: January 14, 2020Assignees: SHINKO ELECTRIC INDUSTRIES CO., LTD., NICHIA CORPORATIONInventors: Shigeru Matsushita, Mikio Suyama, Eiichiro Okahisa, Kazuma Kozuru
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Patent number: 10522969Abstract: A light-emitting device includes: a package body; a lid body connected to the package body, wherein the package body and the lid body together form a sealed space; and a plurality of light-emitting elements disposed in the sealed space. The lid body includes: a non-transmissive member including an outer frame, and one or more inner frames connected to the outer frame, wherein the outer frame and the one or more inner frames define a plurality of openings, a transmissive member integrally covering the plurality of openings and configured to allow light emitted from the plurality of light-emitting elements to be transmitted through the plurality of openings, and an adhesive member fixing the transmissive member to the non-transmissive member. The adhesive member is located on the outer frame and is not located on the one or more inner frames.Type: GrantFiled: October 18, 2018Date of Patent: December 31, 2019Assignees: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takuya Hashimoto, Kazuma Kozuru, Eiichiro Okahisa, Katsuya Nakazawa, Makoto Kubota
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Publication number: 20190386456Abstract: A method of manufacturing a semiconductor device includes: providing a package; providing a mounting substrate; providing at least one first bonding member disposed at a position connecting at least one first metal surface of the package and at least one first metal pattern of the mounting substrate; providing a second bonding member connecting at least one second metal surface of the package and at least one second metal pattern of the mounting substrate; and heating the at least one first bonding member and the at least one second bonding member at a temperature equal to or higher than both a bonding temperature of the at least one first bonding member and a bonding temperature of the at least one second bonding member, to bond the package and the mounting substrate together.Type: ApplicationFiled: June 13, 2019Publication date: December 19, 2019Applicant: NICHIA CORPORATIONInventors: Shohei Itonaga, Eiichiro Okahisa
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Patent number: 10439358Abstract: A method of manufacturing a light-emitting device includes providing a base body including a base section; fixing a plurality of semiconductor laser elements on an upper surface of the base section; and fixing an optical member to the base body, the optical member including a plurality of lens sections, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view. In the step of fixing the optical member: the optical member is arranged above the base body; (i) an inclination and a height of the optical member are adjusted after interposing an adhesive between the base body and the non-lens section, or (ii) an adhesive is interposed between the base body and the non-lens section after adjusting the inclination and the height of the optical member; and subsequently, the adhesive is cured to fix the optical member to the base body.Type: GrantFiled: April 25, 2017Date of Patent: October 8, 2019Assignee: NICHIA CORPORATIONInventors: Soichiro Miura, Seiji Kiyota, Eiichiro Okahisa
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Publication number: 20190305511Abstract: A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.Type: ApplicationFiled: March 26, 2019Publication date: October 3, 2019Applicants: NICHIA CORPORATION, SHINKO ELECTONIC INDUSTRIES CO., LTD.Inventors: Takuya Hashimoto, Eiichiro Okahisa, Katsuya Nakazawa, Shigeru Matsushita, Sumio Uehara, Suguru Kobayashi, Kazuhito Yumoto
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Patent number: 10404033Abstract: A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.Type: GrantFiled: April 30, 2018Date of Patent: September 3, 2019Assignees: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Shigeru Matsushita, Katsuya Nakazawa, Eiichiro Okahisa, Kazuma Kozuru
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Publication number: 20190203908Abstract: A light-emitting device includes a substrate; a lens array having a plurality of lens sections in a matrix pattern; and a plurality of semiconductor laser elements disposed on the substrate. Each of the semiconductor laser elements emits a respective laser beam, each laser beam having a beam shape with a greater width in a column direction than in a row direction on a light incident surface of each respective lens section. The lens sections have an inter-vertex distance in the row direction that is smaller than both (i) a maximum outer diameter of each of the lens sections, and (ii) an inter-vertex distance in the column direction. A curvature of the lens sections in the row direction is the same as a curvature of the lens sections in the column direction.Type: ApplicationFiled: March 8, 2019Publication date: July 4, 2019Applicant: NICHIA CORPORATIONInventors: Seiji KIYOTA, Kazuma KOZURU, Eiichiro OKAHISA
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Publication number: 20190165542Abstract: A light emitting device includes: a base including: a main body, and a frame disposed on an upper surface of the main body; one or more laser elements disposed on the upper surface of the main body inward of the frame; a cover comprising: a support member that is fixed on an upper surface of the frame and has an opening inside the frame, and a light transmissive portion disposed so as to close the opening; and a lens body disposed above the light transmissive portion. The support member includes; a first portion fixed on the upper surface of the frame, a second portion on which the lens body is disposed, the second portion being positioned inward of and lower than the first portion, and a third portion on which the light transmissive portion is disposed, the third portion being disposed inward of and lower than the second portion.Type: ApplicationFiled: November 28, 2018Publication date: May 30, 2019Applicant: NICHIA CORPORATIONInventors: Takuya HASHIMOTO, Eiichiro OKAHISA
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Publication number: 20190123509Abstract: A light-emitting device includes: a package body; a lid body connected to the package body, wherein the package body and the lid body together form a sealed space; and a plurality of light-emitting elements disposed in the sealed space. The lid body includes: a non-transmissive member including an outer frame, and one or more inner frames connected to the outer frame, wherein the outer frame and the one or more inner frames define a plurality of openings, a transmissive member integrally covering the plurality of openings and configured to allow light emitted from the plurality of light-emitting elements to be transmitted through the plurality of openings, and an adhesive member fixing the transmissive member to the non-transmissive member. The adhesive member is located on the outer frame and is not located on the one or more inner frames.Type: ApplicationFiled: October 18, 2018Publication date: April 25, 2019Applicants: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takuya HASHIMOTO, Kazuma KOZURU, Eiichiro OKAHISA, Katsuya NAKAZAWA, Makoto KUBOTA