Patents by Inventor Eiichiro OKAHISA
Eiichiro OKAHISA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10267483Abstract: A light-emitting device includes a substrate; a lens array having a plurality of lens sections in a matrix pattern; and a plurality of semiconductor laser elements disposed on the substrate. Each of the semiconductor laser elements emits a respective laser beam, each laser beam having a beam shape with a greater width in a column direction than in a row direction on a light incident surface of each respective lens section. The lens sections have an inter-vertex distance in the row direction that is smaller than both (i) a maximum outer diameter of each of the lens sections, and (ii) an inter-vertex distance in the column direction. A curvature of the lens sections in the row direction is the same as a curvature of the lens sections in the column direction.Type: GrantFiled: May 18, 2016Date of Patent: April 23, 2019Assignee: NICHIA CORPORATIONInventors: Seiji Kiyota, Kazuma Kozuru, Eiichiro Okahisa
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Patent number: 10253933Abstract: A light emitting device includes: a base; a laser element disposed on an upper face of the base and adapted to laterally emit a laser beam; a phosphor member disposed on the upper face of the base; a first optical member disposed on the upper face of the base, the first optical member comprising an entry-side lateral face through which the laser beam enters during use and an exit-side lateral face through which the laser beam exits during use, and the first optical member being configured to change a traveling direction of the laser beam such that the laser beam transmitted through the first optical member irradiates an upper face of the phosphor member; and a cap comprising: a light shielding member, and a light transmissive member located over the through hole, the laser element, the phosphor member, and the first optical member.Type: GrantFiled: August 29, 2017Date of Patent: April 9, 2019Assignee: NICHIA CORPORATIONInventors: Seiji Kiyota, Eiichiro Okahisa
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Patent number: 10215362Abstract: A light source apparatus includes two or more light sources placed in one direction, and an array lens having two or more lenses, which corresponds to each of the light sources. In order to condense a light emitted from each of the lenses into one position, in a first lens in each of the lenses, an optical axis of the light source which corresponds to the first lens is shifted from an optical axis of said first lens in said one direction. The first lens is formed such that a length from the optical axis to one end of said first lens in the one direction is longer than a length from the optical axis to another end of the first lens in a direction which is opposite to the one direction.Type: GrantFiled: December 28, 2015Date of Patent: February 26, 2019Assignee: NICHIA CORPORATIONInventors: Seiji Nagahara, Eiichiro Okahisa
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Publication number: 20190052042Abstract: An electronic component package includes: a metal plate; a metal wall that is disposed on the metal plate; a metal frame that is disposed on the metal plate so as to be opposed to the metal wall; a through hole that is formed in the metal wall; an opening hole that is formed in the metal frame so as to be opposed to the through hole; and a lead that is hermetically sealed with a sealing portion provided in the through hole, and that is inserted into the opening hole and the through hole. The metal frame includes: a side plate that is opposed to the metal wall; a bent portion that is connected to the side plate and has a round shape; and a welding portion that is connected to the bent portion and to which a lid member is to be bonded.Type: ApplicationFiled: August 6, 2018Publication date: February 14, 2019Inventors: Shigeru Matsushita, Mikio Suyama, Eiichiro Okahisa, Kazuma Kozuru
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Publication number: 20180254604Abstract: A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.Type: ApplicationFiled: April 30, 2018Publication date: September 6, 2018Applicants: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Shigeru MATSUSHITA, Katsuya NAKAZAWA, Eiichiro OKAHISA, Kazuma KOZURU
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Publication number: 20180183205Abstract: A method of manufacturing a laser package includes: providing a plurality of laser devices, each including: a submount, and an edge-emitting semiconductor laser element disposed on the submount; providing one or more optical members; providing a substrate; disposing a first bonding material and a second bonding material on the substrate; placing the plurality of laser devices on the upper surface of the substrate via the first bonding material, and placing the one or more optical members on the upper surface of the substrate via the second bonding material; and collectively heating the plurality of laser devices and the one or more optical members on the substrate without pressing the plurality of laser devices and the one or more optical members onto the substrate, so as to bond the laser devices and the one or more optical members to the substrate via the first and second bonding materials.Type: ApplicationFiled: December 26, 2017Publication date: June 28, 2018Applicant: NICHIA CORPORATIONInventors: Masatoshi NAKAGAKI, Kazuma KOZURU, Eiichiro OKAHISA
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Patent number: 9985411Abstract: A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.Type: GrantFiled: May 17, 2017Date of Patent: May 29, 2018Assignees: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Shigeru Matsushita, Katsuya Nakazawa, Eiichiro Okahisa, Kazuma Kozuru
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Publication number: 20180058645Abstract: A light emitting device includes: a base; a laser element disposed on an upper face of the base and adapted to laterally emit a laser beam; a phosphor member disposed on the upper face of the base; a first optical member disposed on the upper face of the base, the first optical member comprising an entry-side lateral face through which the laser beam enters during use and an exit-side lateral face through which the laser beam exits during use, and the first optical member being configured to change a traveling direction of the laser beam such that the laser beam transmitted through the first optical member irradiates an upper face of the phosphor member; and a cap comprising: a light shielding member, and a light transmissive member located over the through hole, the laser element, the phosphor member, and the first optical member.Type: ApplicationFiled: August 29, 2017Publication date: March 1, 2018Applicant: NICHIA CORPORATIONInventors: Seiji KIYOTA, Eiichiro OKAHISA
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Patent number: 9835297Abstract: A light emitting device includes a base defining a recess opening upward, a semiconductor laser element, a light reflecting member to reflect light from the semiconductor laser element, a wavelength converting member to convert wavelength of light from the light reflecting member, and a cover including a light-transmissive member and covering the opening of the recess. The recess is defined in the base by first inner lateral surfaces extending downward from a periphery of the opening of the recess defined in the upper surface of the base, a bottom surface connected to the first inner lateral surfaces, a mounting surface connected to the first inner lateral surfaces and located higher than the bottom surface in a region different from the bottom surface when viewed from above, and second inner lateral surfaces connecting the bottom surface and the mounting surface. The wavelength converting member is fixed on the mounting surface.Type: GrantFiled: October 28, 2016Date of Patent: December 5, 2017Assignee: NICHIA CORPORATIONInventors: Seiji Kiyota, Kazuma Kozuru, Eiichiro Okahisa
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Publication number: 20170338628Abstract: A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.Type: ApplicationFiled: May 17, 2017Publication date: November 23, 2017Applicants: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Shigeru MATSUSHITA, Katsuya NAKAZAWA, Eiichiro OKAHISA, Kazuma KOZURU
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Publication number: 20170314768Abstract: A method for manufacturing a light-emitting device includes: providing a base including a first depressed portion and a second depressed portion both upwardly opening; and positioning and mounting at least one semiconductor laser element on or above the base based on a predetermined point on a line connecting the first depressed portion and the second depressed portion in a plan view.Type: ApplicationFiled: April 24, 2017Publication date: November 2, 2017Inventors: Seiji KIYOTA, Eiichiro OKAHISA
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Publication number: 20170317467Abstract: A method of manufacturing a light-emitting device includes providing a base body including a base section; fixing a plurality of semiconductor laser elements on an upper surface of the base section; and fixing an optical member to the base body, the optical member including a plurality of lens sections, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view. In the step of fixing the optical member: the optical member is arranged above the base body; (i) an inclination and a height of the optical member are adjusted after interposing an adhesive between the base body and the non-lens section, or (ii) an adhesive is interposed between the base body and the non-lens section after adjusting the inclination and the height of the optical member; and subsequently, the adhesive is cured to fix the optical member to the base body.Type: ApplicationFiled: April 25, 2017Publication date: November 2, 2017Applicant: NICHIA CORPORATIONInventors: Soichiro MIURA, Seiji KIYOTA, Eiichiro OKAHISA
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Patent number: 9746160Abstract: A light emitting device includes a base having a supporting part and a frame part disposed on an upper surface of the supporting part; a light emitting element mounted on the upper surface of the supporting part at a location interior of the frame part; a cover body fixed to an upper surface of the frame part and defining an opening at a location interior of the frame part in a top view; and a light-transmissive body covering the at least one opening. The cover body includes: a first portion disposed on the upper surface of the frame part, a second portion extending inward from the first portion and then bending and extending upward or downward so as to be spaced from an inner lateral surface of the frame part or a plane that includes an inner lateral surface of the frame part, and a third portion connected to the second portion and defining the opening.Type: GrantFiled: July 27, 2016Date of Patent: August 29, 2017Assignee: NICHIA CORPORATIONInventors: Kazuma Kozuru, Eiichiro Okahisa
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Patent number: 9748733Abstract: The semiconductor laser device includes a base member having a recess that opens upward, a semiconductor laser element disposed on a bottom surface of the recess, and a light reflecting member being disposed forward of a light emitting surface of the semiconductor laser element and including a light reflecting surface to reflect laser light emitted from the semiconductor laser element. The semiconductor laser element and the light reflecting member are arranged such that a direction of an optical axis of light that is reflected by the light reflecting member is different from a direction that is perpendicular to a lower surface of the base member.Type: GrantFiled: March 25, 2016Date of Patent: August 29, 2017Assignee: NICHIA CORPORATIONInventor: Eiichiro Okahisa
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Publication number: 20170122505Abstract: A light emitting device includes a base defining a recess opening upward, a semiconductor laser element, a light reflecting member to reflect light from the semiconductor laser element, a wavelength converting member to convert wavelength of light from the light reflecting member, and a cover including a light-transmissive member and covering the opening of the recess. The recess is defined in the base by first inner lateral surfaces extending downward from a periphery of the opening of the recess defined in the upper surface of the base, a bottom surface connected to the first inner lateral surfaces, a mounting surface connected to the first inner lateral surfaces and located higher than the bottom surface in a region different from the bottom surface when viewed from above, and second inner lateral surfaces connecting the bottom surface and the mounting surface. The wavelength converting member is fixed on the mounting surface.Type: ApplicationFiled: October 28, 2016Publication date: May 4, 2017Applicant: NICHIA CORPORATIONInventors: Seiji KIYOTA, Kazuma KOZURU, Eiichiro OKAHISA
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Publication number: 20170030559Abstract: A light emitting device includes a base having a supporting part and a frame part disposed on an upper surface of the supporting part; a light emitting element mounted on the upper surface of the supporting part at a location interior of the frame part; a cover body fixed to an upper surface of the frame part and defining an opening at a location interior of the frame part in a top view; and a light-transmissive body covering the at least one opening. The cover body includes: a first portion disposed on the upper surface of the frame part, a second portion extending inward from the first portion and then bending and extending upward or downward so as to be spaced from an inner lateral surface of the frame part or a plane that includes an inner lateral surface of the frame part, and a third portion connected to the second portion and defining the opening.Type: ApplicationFiled: July 27, 2016Publication date: February 2, 2017Applicant: NICHIA CORPORATIONInventors: Kazuma KOZURU, Eiichiro OKAHISA
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Patent number: 9559489Abstract: A semiconductor laser device includes a semiconductor laser element; a mounting body on which the semiconductor laser element is mounted; a base having a recess in which the mounting body is mounted and a through hole that penetrates a part of a bottom of the recess; and an embedded member disposed within the through hole. An uppermost surface of the embedded member is joined to a lowermost surface of the mounting body and a lowermost surface of the embedded member is positioned higher than a lowermost surface of the base.Type: GrantFiled: December 22, 2015Date of Patent: January 31, 2017Assignee: NICHIA CORPORATIONInventor: Eiichiro Okahisa
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Publication number: 20160341395Abstract: A light-emitting device includes a substrate; a lens array having a plurality of lens sections in a matrix pattern; and a plurality of semiconductor laser elements disposed on the substrate. Each of the semiconductor laser elements emits a respective laser beam, each laser beam having a beam shape with a greater width in a column direction than in a row direction on a light incident surface of each respective lens section. The lens sections have an inter-vertex distance in the row direction that is smaller than both (i) a maximum outer diameter of each of the lens sections, and (ii) an inter-vertex distance in the column direction. A curvature of the lens sections in the row direction is the same as a curvature of the lens sections in the column direction.Type: ApplicationFiled: May 18, 2016Publication date: November 24, 2016Applicant: NICHIA CORPORATIONInventors: Seiji KIYOTA, Kazuma KOZURU, Eiichiro OKAHISA
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Patent number: 9496680Abstract: A semiconductor laser device can include an insulating single crystal SiC having a first surface, a second surface, and micropipes having openings in the first surface and the second surface. A conductive base can be provided on a side of the first surface of the single crystal SiC, and a semiconductor laser element can be provided on a side of the second surface of the single crystal SiC. An insulating member can be formed in the micropipes.Type: GrantFiled: March 1, 2016Date of Patent: November 15, 2016Assignee: NICHIA CORPORATIONInventors: Hiroki Sakata, Hiroaki Yuto, Eiichiro Okahisa, Kazuma Kozuru
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Patent number: 9459520Abstract: Provided is a light source unit that includes: one or more kinds of phosphor; a substrate, on which the one or more kinds of phosphor is applied; a plurality of semiconductor laser elements arrayed at a predetermined interval in a package, wherein each of the semiconductor laser elements emits a laser light beam through a light emission region; and a first optical system that comprises a first lens system, a multiplexing optical member having a light entering surface and a light exiting surface, and a second lens system, wherein the first optical system directs the laser light beams emitted from the respective semiconductor laser elements toward the substrate, the first lens system receives the laser light beams emitted from the respective semiconductor laser elements directly without substantial parallelization of the respective received laser light beams, and condenses the received laser light beams on the light entering surface of the multiplexing optical member, the multiplexing optical member multiplexesType: GrantFiled: July 31, 2014Date of Patent: October 4, 2016Assignee: NICHIA CORPORATIONInventors: Seiji Nagahara, Takashi Sasamuro, Eiichiro Okahisa