Patents by Inventor Eiji Isobe

Eiji Isobe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sintered metal bonded diamond abrasive articles
    Patent number: 4362535
    Abstract: This invention provides a metal bonded diamond abrasive article of nickel-copper basis. The sintered metal bond, which consists essentially of 2 to 30% by weight of copper, 1 to 40% by weight of tin, 0.2 to 3% by weight of phosphorous, and at least 50% by weight of the remainder nickel, well disperses and retains diamond grits and minimizes the clogging and the variation in rate of stock removal.
    Type: Grant
    Filed: June 9, 1981
    Date of Patent: December 7, 1982
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Eiji Isobe, Izumi Hayakawa, Akira Emura