Patents by Inventor Eiji Osawa

Eiji Osawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240083704
    Abstract: An ultrasonic device includes: an ultrasonic element that has a transmission surface transmitting an ultrasonic wave and that transmits the ultrasonic wave in a direction intersecting the transmission surface; a wiring arranged at a transmission surface outer circumference of the transmission surface and coupled to the ultrasonic element; a shield covering the wiring; a holder arranged at a shield outer circumference of the shield and extending in the direction; and a protector facing the transmission surface and having a hole through which the ultrasonic wave passes. The shield is provided with a shield opening that faces the transmission surface. The holder is provided with a holder opening that faces the transmission surface. The protector is arranged at the holder opening.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 14, 2024
    Inventors: Masayoshi YAMADA, Eiji OSAWA
  • Patent number: 11910720
    Abstract: Provided is a piezoelectric device and an MEMS device whose size can be reduced. The piezoelectric device includes: a first substrate that includes a first surface on which a piezoelectric element and a first electrode coupled to the piezoelectric element are disposed; a second substrate that includes a second surface on which a second electrode configured to be coupled to a control circuit is disposed; and a third substrate that is disposed between the first substrate and the second substrate, and includes a third surface bonded to the first surface and a fourth surface facing the second surface, in which the third substrate has a through hole passing through from the third surface to the fourth surface, and a third electrode provided in the through hole and coupled to the first electrode, and the second electrode is coupled to the third electrode and is electrically coupled to the first electrode via the third electrode.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: February 20, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Eiji Osawa, Hikaru Iwai
  • Patent number: 11872592
    Abstract: An ultrasonic device includes a base material that has an opening, a vibration plate that is provided on the base material and closes the opening, and a piezoelectric element that is provided on the vibration plate, in which the vibration plate has a first layer provided on the base material, and a second layer that is disposed between the first layer and the piezoelectric element and that suppresses diffusion of a component contained in the piezoelectric element, and a bending rigidity of the second layer is equal to or larger than a bending rigidity of the first layer.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: January 16, 2024
    Inventors: Chikara Kojima, Koji Ohashi, Eiji Osawa
  • Patent number: 11856164
    Abstract: A transport apparatus includes a transport path on which a medium is transported; a transmitter configured to transmit an ultrasonic wave to the medium transported on the transport path; and a receiver configured to receive an ultrasonic wave from the medium, in which the transport path is provided between the transmitter and the receiver, and is provided in a long-distance sound field of an ultrasonic wave transmitted from the transmitter.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: December 26, 2023
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Eiji Osawa
  • Publication number: 20230158547
    Abstract: An electronic device includes a first substrate including a first face on which a common terminal to be coupled to the element is disposed, and a second substrate which has a second face and a third face, and which is arranged so that the second face faces to the first face, wherein the second substrate has a first through hole at a position corresponding to the common terminal, the first through hole penetrating from the second face to the third face, a first through electrode electrically coupled to the common terminal is disposed in the first through hole, and a void is disposed in a part of the first through electrode.
    Type: Application
    Filed: November 21, 2022
    Publication date: May 25, 2023
    Inventors: Eiji OSAWA, Hikaru IWAI, Masahiro KOMATSU
  • Publication number: 20230129454
    Abstract: An ultrasonic sensor is a sensor that transmits an ultrasonic wave to a target object and receives the ultrasonic wave reflected by the target object, the ultrasonic sensor including an ultrasonic array chip on which ultrasonic elements that transmit and receive the ultrasonic wave are arranged in an array shape. Each of the ultrasonic elements includes a vibrating section and a piezoelectric element provided in the vibrating section, vibrates the vibrating section to transmit the ultrasonic wave, and outputs a reception signal of the ultrasonic wave by the vibration of the vibrating section. A resonance frequency of the ultrasonic element is 2000 kHz or less.
    Type: Application
    Filed: October 26, 2022
    Publication date: April 27, 2023
    Inventors: Seiji IZUO, Eiji OSAWA, Mitsuru MIYASAKA
  • Patent number: 11594670
    Abstract: An MEMS device includes: a first member; a second member forming a sealed space with the first member therebetween; and a third member disposed between the first member and the second member and joined to the first member and the second member, in which the third member has lower rigidity than rigidity of the first member and the second member, and the third member is provided with a communication portion that establishes communication between the sealed space and an external space.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: February 28, 2023
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Chikara Kojima, Eiji Osawa, Koji Ohashi, Kanechika Kiyose, Tomohiro Sayama, Hironori Suzuki, Katsuhiro Imai, Yasuyuki Matsumoto, Takahiro Kamijo
  • Publication number: 20230041175
    Abstract: An ultrasonic device includes a first substrate including a first surface on which a first electrode coupled to a piezoelectric element is placed, a second substrate including a second surface on which a second electrode is placed, an intermediate substrate placed between the first substrate and the second substrate and including a third surface joined to the first surface and a fourth surface facing the second surface, and a bonding portion, wherein the intermediate substrate has a through hole penetrating from the third surface to the fourth surface and a third electrode provided in the through hole and coupled to the first electrode, the second electrode is coupled to the third electrode and electrically coupled to the first electrode via the third electrode, a plurality of the bonding portions are provided in island shapes apart from one another between the second substrate and the intermediate substrate, and at least one of the bonding portions is provided to surround the third electrode.
    Type: Application
    Filed: August 4, 2022
    Publication date: February 9, 2023
    Inventors: Eiji OSAWA, Hikaru IWAI
  • Patent number: 11529649
    Abstract: A piezoelectric film includes a substrate having flexibility, and at least two piezoelectric elements provided to the substrate so as to be arranged at intervals of a first dimension along a first direction, the piezoelectric elements are each configured by stacking a first electrode film, a piezoelectric film made of an inorganic material, and a second electrode film along a thickness direction of the substrate, and an area between the piezoelectric elements adjacent to each other along the first direction forms a vibrational region which can be displaced in the thickness direction.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: December 20, 2022
    Inventors: Chikara Kojima, Hironori Suzuki, Eiji Osawa, Koji Ohashi
  • Patent number: 11506772
    Abstract: An ultrasonic device includes: a substrate provided with a first opening and a second opening; a support film that is provided on the substrate and blocks the first opening and the second opening; a transmitting piezoelectric film that is provided at a position of the support film which overlaps the first opening when viewed in a thickness direction of the substrate, and that is interposed between a pair of electrodes in the thickness direction of the substrate; and a receiving piezoelectric film that is provided at a position of the support film which overlaps the second opening when viewed in the thickness direction of the substrate, and that is interposed between a pair of electrodes in the thickness direction of the substrate. In the thickness direction of the substrate, a thickness dimension of the transmitting piezoelectric film is larger than a thickness dimension of the receiving piezoelectric film.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: November 22, 2022
    Inventor: Eiji Osawa
  • Patent number: 11474220
    Abstract: An ultrasonic device includes: a vibration film provided with a vibration region that is vibratable by a vibration element; and a damper layer that is provided to cover the vibration region of the vibration film. The damper layer has a thickness dimension of 13 ?m or larger and 25 ?m or smaller.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: October 18, 2022
    Inventor: Eiji Osawa
  • Patent number: 11225090
    Abstract: An ultrasonic sensor includes a first base facing a conveying surface, a transmission section on a first axis tilted relative to the conveying surface and at a far side of the first base for transmitting an ultrasonic wave toward the first axis, and a reception section on the first axis and at a far side of the conveying surface for receiving the ultrasonic wave. The transmission section has a plurality of transmission elements for transmitting the ultrasonic wave arranged to cross the first axis. The first base has a first aperture through which the ultrasonic wave transmitted from the transmission section along the first axis passes. An area of the first aperture is smaller than an area of an ultrasonic wave transmission surface of the transmission section. The transmission section delays driving the transmission elements to converge the ultrasonic wave transmitted from the transmission section toward the first aperture.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: January 18, 2022
    Inventors: Eiji Osawa, Daisuke Honda
  • Patent number: 11117766
    Abstract: A multi-feed detection device includes a transmission circuit substrate to which an ultrasonic transmitter transmitting an ultrasonic wave is installed, and an ultrasonic receiver receiving the ultrasonic wave. The ultrasonic transmitter has arrayed ultrasonic transmission elements and transmits ultrasonic waves with different phases from the ultrasonic transmission elements to transmit the ultrasonic waves in a direction diagonally intersecting a thickness direction of the transmission circuit substrate.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: September 14, 2021
    Inventor: Eiji Osawa
  • Publication number: 20210203801
    Abstract: A transport apparatus includes a transport path on which a medium is transported; a transmitter configured to transmit an ultrasonic wave to the medium transported on the transport path; and a receiver configured to receive an ultrasonic wave from the medium, in which the transport path is provided between the transmitter and the receiver, and is provided in a long-distance sound field of an ultrasonic wave transmitted from the transmitter.
    Type: Application
    Filed: December 28, 2020
    Publication date: July 1, 2021
    Inventor: Eiji OSAWA
  • Publication number: 20210202823
    Abstract: Provided is a piezoelectric device and an MEMS device whose size can be reduced. The piezoelectric device includes: a first substrate that includes a first surface on which a piezoelectric element and a first electrode coupled to the piezoelectric element are disposed; a second substrate that includes a second surface on which a second electrode configured to be coupled to a control circuit is disposed; and a third substrate that is disposed between the first substrate and the second substrate, and includes a third surface bonded to the first surface and a fourth surface facing the second surface, in which the third substrate has a through hole passing through from the third surface to the fourth surface, and a third electrode provided in the through hole and coupled to the first electrode, and the second electrode is coupled to the third electrode and is electrically coupled to the first electrode via the third electrode.
    Type: Application
    Filed: December 28, 2020
    Publication date: July 1, 2021
    Inventors: Eiji OSAWA, Hikaru IWAI
  • Patent number: 11027934
    Abstract: A multi-feed detection device includes a transmission circuit substrate on which an ultrasonic transmitter transmitting an ultrasonic wave is installed, and an ultrasonic receiver receiving the ultrasonic wave. The ultrasonic transmitter transmits the ultrasonic wave in a direction intersecting a thickness direction of the transmission circuit substrate and at least one of the ultrasonic transmitter and the ultrasonic receiver has a plurality of ultrasonic elements.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: June 8, 2021
    Inventor: Eiji Osawa
  • Patent number: 10895502
    Abstract: A media type determination device includes: a light detector that detects light from a target object; a sensor that transmits an ultrasonic wave to the target object and performs an ultrasonic measurement for receiving the ultrasonic wave transmitted through the target object; and one or a plurality of processors. The one or plurality of processors are programmed to execute a method including: acquiring light information corresponding to the light from the target object, from the light detector; acquiring ultrasonic wave information corresponding to an ultrasonic wave via the target object from the sensor, and determining a type of target object based on the light information and the ultrasonic wave information.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: January 19, 2021
    Inventors: Masashi Kanai, Eiji Osawa, Ryoki Watanabe
  • Publication number: 20200303618
    Abstract: An MEMS device includes: a first member; a second member forming a sealed space with the first member therebetween; and a third member disposed between the first member and the second member and joined to the first member and the second member, in which the third member has lower rigidity than rigidity of the first member and the second member, and the third member is provided with a communication portion that establishes communication between the sealed space and an external space.
    Type: Application
    Filed: March 19, 2020
    Publication date: September 24, 2020
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Chikara KOJIMA, Eiji OSAWA, Koji OHASHI, Kanechika KIYOSE, Tomohiro SAYAMA, Hironori SUZUKI, Katsuhiro IMAI, Yasuyuki MATSUMOTO, Takahiro KAMIJO
  • Publication number: 20200298276
    Abstract: An ultrasonic device includes a base material that has an opening, a vibration plate that is provided on the base material and closes the opening, and a piezoelectric element that is provided on the vibration plate, in which the vibration plate has a first layer provided on the base material, and a second layer that is disposed between the first layer and the piezoelectric element and that suppresses diffusion of a component contained in the piezoelectric element, and a bending rigidity of the second layer is equal to or larger than a bending rigidity of the first layer.
    Type: Application
    Filed: March 20, 2020
    Publication date: September 24, 2020
    Inventors: Chikara KOJIMA, Koji OHASHI, Eiji OSAWA
  • Publication number: 20200240843
    Abstract: A media type determination device includes: a light detector that detects light from a target object; a sensor that transmits an ultrasonic wave to the target object and performs an ultrasonic measurement for receiving the ultrasonic wave transmitted through the target object; and one or a plurality of processors. The one or plurality of processors are programmed to execute a method including: acquiring light information corresponding to the light from the target object, from the light detector; acquiring ultrasonic wave information corresponding to an ultrasonic wave via the target object from the sensor, and determining a type of target object based on the light information and the ultrasonic wave information.
    Type: Application
    Filed: January 28, 2020
    Publication date: July 30, 2020
    Inventors: Masashi KANAI, Eiji OSAWA, Ryoki WATANABE