Patents by Inventor Eiji Watanabe

Eiji Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8403662
    Abstract: A combustion air supply apparatus 9 of alternating heat exchange type supplies combustion air and discharges combustion exhaust gas at a flow velocity of 80 to 200 m/sec. A burner assembly 4 is configured in such a manner that low-caloric fuel gas is pre-heated with heat of pre-combusting high-caloric fuel gas before the low-caloric fuel gas reaches a mixing starting space CA in the combustion chamber where the pre-combusting high-caloric fuel gas and the low-caloric fuel gas come to burn together in a full scale in the mixing starting space CA. When an air amount of the combustion air supplied through the high-temperature air supply ports of the plurality of fuel gas combustion apparatuses is defined as Q1 and an air amount of the pre-combustion air to be mixed with the high-caloric fuel gas, supplied from the fuel gas combustion apparatuses, is defined as Q2, a total air amount (Q1+Q2) is 1.02 to 1.10 times more than a theoretical air amount QS required for combustion, and a ratio of Q2/(Q1+Q2) is 0.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: March 26, 2013
    Assignees: Chiyoda Corporation, Nippon Furnace Co., Ltd.
    Inventors: Tomoyuki Mikuriya, Toshiaki Yoshioka, Ryoichi Kawabata, Eiji Watanabe, Nobuhiro Onda, Takeo Nikkuni, Shuhei Wakamatsu, Susumu Mochida, Tadahiro Araake, Hiroyuki Nakamura
  • Patent number: 8243482
    Abstract: A control device for a matrix converter includes an input voltage detector, an output current detector, a pulse width modulator, and an input voltage command calculator. The input voltage detector is configured to detect an input voltage of the matrix converter. The output current detector is configured to detect an output current of the matrix converter. The pulse width modulator is configured to generate a PWM pulse command signal by using the input voltage, the output current, and an output line voltage command. The input voltage command calculator is configured to calculate an input voltage command of the matrix converter.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: August 14, 2012
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Yozo Ueda, Ryuji Suenaga, Eiji Watanabe
  • Publication number: 20120006298
    Abstract: To provide a high-pressure fuel injection pipe preventing like a generation crack of a pocket portion during formation of a connection head portion, and being robust against fatigue, wherein the connection head portion is configured such that cylindrical face has contours in a section along the axial direction of the pipe from an end portion of a fillet portion of an annular flange portion toward the seat face formed such that an opening angle ? to an axis of the pipe in the section in the axial direction of the pipe satisfies 0°<??20° and a ratio of the length h of the cylindrical face in the axial direction of the pipe and the length H from a terminal of the connection head portion to an end portion of the cylindrical face on the side of the fillet portion satisfies 0.33?h/H?0.85.
    Type: Application
    Filed: March 24, 2010
    Publication date: January 12, 2012
    Applicant: USUI KOKUSAI SANGYO KAISHA LIMITED
    Inventor: Eiji Watanabe
  • Publication number: 20110227181
    Abstract: There are provided a circuit board; a semiconductor substrate bonded to a light-incidence-side surface of the circuit board; a photoelectric conversion film stacked on a layer that is disposed on the light incidence side of the semiconductor substrate; an imaging device chip having signal reading means which is formed in a surface portion of the semiconductor substrate, for reading out, as shot image signals, signals corresponding to signal charge amounts detected by the photoelectric conversion film according to incident light quantities; a transparent substrate bonded to a layer that is disposed on the light incidence side of the photoelectric conversion film with a transparent resin adhesive; and bonding wires which connect connection pads formed on a peripheral portion, not covered with the transparent substrate, of the semiconductor substrate to connection terminals on the circuit board.
    Type: Application
    Filed: March 16, 2011
    Publication date: September 22, 2011
    Applicant: FUJIFILM CORPORATION
    Inventors: Hiroshi INOMATA, Eiji WATANABE
  • Publication number: 20110228151
    Abstract: There are provided a semiconductor substrate; a photoelectric conversion film stacked on a layer that is disposed on the light incidence side of the semiconductor substrate; signal reading unit formed in a surface portion of the semiconductor substrate, for reading out, as shot image signals, signals corresponding to signal charge amounts detected by the photoelectric conversion film according to incident light quantities; a transparent substrate bonded to a layer that is disposed on the light incidence side of the photoelectric conversion film with a transparent resin as an adhesive; and electric connection terminals which are connected to the signal reading unit by interconnections and which penetrate through the semiconductor substrate and are exposed in a surface, located on the opposite side to the side where the photoelectric conversion film is provided, of the semiconductor substrate.
    Type: Application
    Filed: March 16, 2011
    Publication date: September 22, 2011
    Applicant: FUJIFILM CORPORATION
    Inventors: Hiroshi INOMATA, Eiji WATANABE
  • Publication number: 20110116295
    Abstract: A control device for a matrix converter includes an input voltage detector, an output current detector, a pulse width modulator, and an input voltage command calculator. The input voltage detector is configured to detect an input voltage of the matrix converter. The output current detector is configured to detect an output current of the matrix converter. The pulse width modulator is configured to generate a PWM pulse command signal by using the input voltage, the output current, and an output line voltage command. The input voltage command calculator is configured to calculate an input voltage command of the matrix converter.
    Type: Application
    Filed: November 30, 2010
    Publication date: May 19, 2011
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Yozo UEDA, Ryuji SUENAGA, Eiji WATANABE
  • Patent number: 7915538
    Abstract: A multilayer wiring board having a plurality of wiring boards in which wiring layers and resin layers in each wiring board are alternately arranged in a laminated formation. In the multilayer wiring board, all the resin layers and the wiring layers, except a resin layer in the plurality of wiring boards, are separated in a same position between the plurality of wiring boards and the resin layer is continuous in the same position.
    Type: Grant
    Filed: January 29, 2008
    Date of Patent: March 29, 2011
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Masamitsu Ikumo, Tadahiro Okamoto, Eiji Watanabe
  • Publication number: 20100324501
    Abstract: A gasket for use in a syringe so formed as to liquid-tightly and slidably contact an inner surface of an outer cylinder of the syringe, the gasket including a gasket body made of an elastic body and a coating layer formed in a portion thereof which contacts at least the syringe, wherein the coating layer includes a composition containing silicone resin which comprises a condensate of reactive silicone resin having a terminal silanol group and which has a siloxane bond derived from the silanol group, and does not contain solid fine particles.
    Type: Application
    Filed: June 28, 2010
    Publication date: December 23, 2010
    Applicant: Terumo Kabushiki Kaisha
    Inventors: Aiko HORIUCHI, Eiji Watanabe, Shigeru Suzuki, Masami Shimoda
  • Patent number: 7754534
    Abstract: A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.
    Type: Grant
    Filed: April 21, 2008
    Date of Patent: July 13, 2010
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Nobukatsu Saito, Masaharu Minamizawa, Yoshiyuki Yoneda, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi, Tadahiro Okamoto, Eiji Watanabe
  • Publication number: 20100143854
    Abstract: In a burning air feeding device (9) of alternating heat-exchanging type, the feed of burning air and the discharge of a burned exhaust gas are performed at the speeds of 80 to 200 m/sec. A burner structure (4) is constituted such that a low-calorie fuel gas is preheated with the heat of a precombustion high-calorie fuel gas till the low-calorie fuel gas reaches a mixing starting zone (CA), and such that the precombustion high-calorie fuel gas and the low-calorie fuel gas are burned together in the mixing starting zone (CA). The sum (Q1+Q2) of an air quantity (Q1) fed from the hot air feeding ports of a plurality of fuel gas burning devices and an air quantity (Q2) of a precombustion air to be mixed with the high-calorie fuel gas in the plural fuel gas burning devices is set to 1.02 to 1.10 times as high as the stoichiometric air quantity (Qs) necessary for the combustion, and the ratio (Q2/(Q1+Q2)) is set within the range of 0.011 to 0.047.
    Type: Application
    Filed: June 19, 2008
    Publication date: June 10, 2010
    Applicants: CHIYODA CORPORATION, NIPPON FURNACE CO., LTD.
    Inventors: Tomoyuki Mikuriya, Toshiaki Yoshioka, Ryoichi Kawarata, Eiji Watanabe, Nobuhiro Onda, Takeo Nikkuni, Shuhei Wakamatsu, Susumu Mochida, Tadahiro Araake, Hiroyuki Nakamura
  • Patent number: 7721714
    Abstract: A fuel delivery pipe capable of reducing a pressure pulsation at the time of a fuel injection due to injection nozzles, preventing vibrations and noises at an underfloor pipe arrangement, and turning down a radiate sound from the fuel delivery pipe, wherein a flexible absorbing wall surface 10 formed on a wall surface of a fuel delivery body 1 is loosened due to internal pressure changes to render internal volume of the fuel delivery body 1 increasable, ?L/?{square root over ( )}V determined by sonic speed ?L of fuel flowing through the fuel delivery body 1 and the internal volume V of the fuel delivery body 1 is set as 20×103(m?0.5·sec?1)??L/?{square root over ( )}V?85×103(m?0.5·sec?1) while a ratio ?L/?H of equivalent sonic speed ?H in a high frequency area to the sonic speed ?L of the fuel is set as ?L/?H?0.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: May 25, 2010
    Assignee: Usui Kokusai Sangyo Kaisha, Ltd.
    Inventors: Masayoshi Usui, Eiji Watanabe, Hikari Tsuchiya, Yoshiyuki Serizawa, Kazuteru Mizuno, Koichi Hayashi, Tetsuo Ogata
  • Patent number: 7692720
    Abstract: A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of the semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein a distance between the outer surface of the light-receiving region and the third surface of the light-transmission member is 0.5 mm or more.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: April 6, 2010
    Assignee: FUJIFILM Corporation
    Inventors: Kazuhiro Nishida, Hiroshi Maeda, Yoshihisa Negishi, Shunichi Hosaka, Masatoshi Yasumatsu, Eiji Watanabe
  • Patent number: 7688382
    Abstract: A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein the light-transmission member comprises low ?-ray glass.
    Type: Grant
    Filed: July 22, 2004
    Date of Patent: March 30, 2010
    Assignee: FUJIFILM Corporation
    Inventors: Kazuhiro Nishida, Hiroshi Maeda, Yoshihisa Negishi, Shunichi Hosaka, Eiji Watanabe, Masatoshi Yasumatsu
  • Patent number: 7669933
    Abstract: A headrest mechanism includes a headrest stay, a headrest support, an engagement member, a plurality of adjustment portions, and a pullout prevention portion. The height of a headrest may be adjusted by pushing the button portion of the headrest support to disengage the engagement member provided in the headrest support from an adjustment portions provided on the side surface of a headrest stay. The headrest, including the headrest stay, may be removed by turning a lock portion of the headrest support by 90 degrees, pushing the button portion and pulling up the headrest. Thus, the headrest can be removed without using any additional tools.
    Type: Grant
    Filed: May 18, 2007
    Date of Patent: March 2, 2010
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Eiji Watanabe
  • Patent number: 7670745
    Abstract: The invention provides an alkali soluble polymer including a specific vinylketone phenol and a derivative thereof as radical polymerizable monomers and a positive working photosensitive resin composition containing the alkali soluble polymer and a photosensitizing agent. According to the invention, there can be provided an alkali soluble resin having high solvent resistance, high water resistance, high acid resistance, high alkali resistance, high thermal resistance, high transparency, excellent adhesiveness with a substrate, and the like and useful for the formation of a patterned resin film obtained by developing in an aqueous alkali solution and a positive working photosensitive resin composition including such an alkali soluble resin.
    Type: Grant
    Filed: November 2, 2007
    Date of Patent: March 2, 2010
    Assignee: Chisso Corporation
    Inventors: Tomohiro Etou, Eiji Watanabe, Ryouta Mineo
  • Publication number: 20100019782
    Abstract: The present invention provides a cellular potential measurement container that can measure a cellular potential with high accuracy while suppressing noise even when the number of the cells to be subjected to the measurement is increased. The cellular potential measurement container includes a first solution reservoir 14, a second solution reservoir 15, a partition substrate 18, a first electrode 27a, a second electrode 27b, a first measurement terminal 13a, and a second measurement terminal 13b. The first solution reservoir 14 and the second solution reservoir 15 are partitioned with the partition substrate 18, and the partition substrate 18 has a through hole 19. A first end of the through hole 19 is open toward the first solution reservoir 14 while a second end of the through hole 19 is open toward the second solution reservoir 15. The opening at the first end of the through hole 19 can hold a cell.
    Type: Application
    Filed: June 28, 2006
    Publication date: January 28, 2010
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Eiji Watanabe, Akira Higuchi, Masaya Nakatani
  • Patent number: 7608456
    Abstract: In a microplate processing apparatus that removes lid (11) of microplate (10) conveyed by microplate conveying mechanism (3), performs a dispensing process by dispensing head (8), and attaches lid (11) after the dispensing process is completed, lid (11) removed by lid removing mechanism (6) at second position (P2), is conveyed to fourth position (P4) located downstream, in advance of microplate (10) with this lid (11) having been attached, by microplate conveying mechanism (3), to be retained by lid attaching mechanism (9), and then is attached to microplate (10) having been conveyed to fourth position (P4), after the dispensing process is completed.
    Type: Grant
    Filed: April 5, 2005
    Date of Patent: October 27, 2009
    Assignee: Panasonic Corporation
    Inventors: Akira Higuchi, Eiji Watanabe
  • Patent number: 7602801
    Abstract: There is provided a packet processing device for, when decoding variable length data that is split into packets, realizing a reduction in processing load at a decoder, by providing information for identifying a start position of the data. A header analyzing section (11) determines whether data stored in a packet is start data containing start information or other data. A data extracting section (12) extracts data from a packet and stores the data in a buffer (13). A buffer controlling section (14) causes a start position memory (15) and a number-of-starts counter (16) to retain an address position and the number of start data stored in the buffer (13). A decode section (20) refers to the start position memory (15) and the number-of-starts counter (16) and executes a decode process for the data stored in the buffer (13).
    Type: Grant
    Filed: June 7, 2004
    Date of Patent: October 13, 2009
    Assignee: Panasonic Corporation
    Inventors: Shigeo Hayashi, Eiji Watanabe, Hidekatsu Ozeki
  • Publication number: 20090191386
    Abstract: A positive photosensitive polymer composition of the invention contains: a copolymer obtained by the radical polymerization of monomers including a radical polymerizable monomer (a1) having a (meth)acryloyl group and a polyalkylene glycol group a terminal of which is an alkoxy group; and a 1,2-quinone diazide compound. The positive photosensitive polymer composition may further contain a copolymer obtained by the radical polymerization of monomers not including the monomer (a1).
    Type: Application
    Filed: January 14, 2009
    Publication date: July 30, 2009
    Applicant: CHISSO CORPORATION
    Inventors: Toshiyuki TAKAHASHI, Eiji WATANABE, Tomohiro ETOU, Yuuki KIMURA
  • Patent number: 7485465
    Abstract: In a microplate processing apparatus that removes lid (11) of microplate (10) conveyed by microplate conveying mechanism (3) to perform a dispensing process by dispensing head (8), and that attaches lid (11) after the dispensing process is completed, lid (11) removed by lid removing mechanism (6) at first position (P1) is conveyed to third position (P3) located downstream, by microplate conveying mechanism (3), to be held by lid attaching mechanism (9), and then lid (11) is attached to microplate (10) having been conveyed to third position (P3), after the dispensing process is completed, while microplate (10) with this lid (11) having been attached is being lifted to processing position (P4) above microplate conveying mechanism (3), by microplate stage (12).
    Type: Grant
    Filed: April 5, 2005
    Date of Patent: February 3, 2009
    Assignee: Panasonic Corporation
    Inventors: Akira Higuchi, Eiji Watanabe