Abstract: Thin film transistors (TFTs) and methods of manufacturing the same. A TFT may include a floating channel on a surface of a channel and spaced apart from a source and a drain, and an insulating layer formed on the floating channel and designed to determine a distance between the floating channel and the source or the drain.

Abstract: In one embodiment, the electrowetting device includes a first medium; a second medium that is not mixed with the first medium and has a refractive index different from a refractive index of the first medium; an upper electrode that adjusts an angle of a boundary surface between the first medium and the second medium; and a barrier wall that has a side surface surrounding the first and second mediums, allows the upper electrode to be disposed on a portion of the side surface, and has irregular widths.

Abstract: A light refraction controlling panel, a 3D-display, and a method of operating a 3D-display are provided. The light refraction controlling panel includes a transparent substrate, a barrier wall on the transparent substrate, first to fourth electrodes on the barrier wall, the first to fourth electrodes being separated from each other, an electro-wetting prism within the barrier wall, the electro-wetting prism being configured to refract incident light to a desired direction, and an isolation layer between the barrier wall and the first to fourth electrodes, and the electro-wetting prism. One electrode of two adjacent electrodes of the first to fourth electrodes is inside an other electrode of the two adjacent electrodes.

Abstract: A three-dimensional (3D) image display apparatus and method are provided. The 3D image display apparatus includes an image generating unit configured to generate an image, an active optical device configured to change a propagation path of light containing the generated image, and provide the generated image to multiple viewpoints that are located along a first direction parallel to the image generating unit, and a varifocal lens configured to vary a focal position of the generated image along a second direction away from the image generating unit.

Abstract: A vibration touch sensor includes; a first substrate, a second substrate arranged to face the first substrate with a predetermined gap therebetween, a first electrode disposed on the first substrate, a second electrode disposed on the second substrate, a piezoelectric material layer disposed on one of the first electrode and the second electrode, wherein the piezoelectric material layer generates an electrical signal in response to an external touch applied to at least one of the first substrate and the second substrate, and a controller which receives the electrical signal generated from the piezoelectric material layer and generates a touch input signal, the controller controlling an alternating current voltage applied to at least one of the first electrode and the second electrode.

Abstract: According to example embodiments, a semiconductor device includes a first electrode, a second electrode apart from the first electrode, and an active layer between the first and second electrodes. The active layer includes first and second layers, the first layer contacts the first and second electrodes, and the second layer is separated from at least one of the first and second electrodes.

Abstract: A transistor includes a channel layer disposed above a gate and including an oxide semiconductor. A source electrode contacts a first end portion of the channel layer, and a drain electrode contacts a second end portion of the channel layer. The channel layer further includes a fluorine-containing region formed in an upper portion of the channel layer between the source electrode and the drain electrode.

Abstract: A transistor includes a first active layer having a first channel region and a second active layer having a second channel region. A first gate of the transistor is configured to control electrical characteristics of at least the first active layer and a second gate is configured to control electrical characteristics of at least the second active layer. A source electrode contacts the first and second active layers. A drain electrode also contacts the first and second active layers.

Abstract: Transistors, methods of manufacturing the transistors, and electronic devices including the transistors. The transistor may include an oxide channel layer having a multi-layer structure. The channel layer may include a first layer and a second layer that are sequentially arranged from a gate insulation layer. The first layer may be a conductor, and the second layer may be a semiconductor having a lower electrical conductivity than that of the first layer. The first layer may become a depletion region according to a gate voltage condition.

Abstract: Thin film transistors (TFTs) and methods of manufacturing the same. A TFT may include a floating channel on a surface of a channel and spaced apart from a source and a drain, and an insulating layer formed on the floating channel and designed to determine a distance between the floating channel and the source or the drain.

Abstract: A semiconductor wire grid may include a plurality of wires arranged separately on a substrate, formed of a semiconductor, and including a groove therebetween, wherein conductivity of the semiconductor wire grid varies according to an applied voltage such that a polarization rate of the semiconductor wire grid is controlled.

Abstract: A thermoelectric touch sensor includes a first electrode, a thin film layer provided on the first electrode and including a thermoelectric material, a second electrode provided on the thin film layer, a sensing unit which senses at least one of a current flowing between the first electrode and the second electrode and a voltage applied between the first electrode and the second electrode.

Abstract: A vibration touch sensor includes; a first substrate, a second substrate arranged to face the first substrate with a predetermined gap therebetween, a first electrode disposed on the first substrate, a second electrode disposed on the second substrate, a piezoelectric material layer disposed on one of the first electrode and the second electrode, wherein the piezoelectric material layer generates an electrical signal in response to an external touch applied to at least one of the first substrate and the second substrate, and a controller which receives the electrical signal generated from the piezoelectric material layer and generates a touch input signal, the controller controlling an alternating current voltage applied to at least one of the first electrode and the second electrode.

Abstract: A touch screen panel includes: a first substrate and a second substrate, which face each other with respect to a liquid crystal interposed therebetween; and a touch sensor interposed between the first substrate and the second substrate. The touch sensor includes: a plurality of first touch signal lines disposed on the first substrate and extending in a first direction; a protective layer disposed on the first substrate, the protective layer including a dielectric material and substantially the plurality of first touch signal lines; a plurality of contact pads disposed on the protective layer; a plurality of second touch signal lines disposed on the second substrate and extending in a second direction perpendicular to the first direction; and a plurality of touch sensor spacers electrically connected to the plurality of second touch signal lines. A gap between the touch sensor spacers and the plurality of contact pads is defined, and the spacers are disposed to face the plurality of contact pads.

Abstract: Disclosed are a crystallization pattern, and a method for crystallizing amorphous silicon. The method includes the steps of forming an amorphous silicon film on a glass substrate, forming a crystallization pattern by patterning the amorphous silicon film, and crystallizing the crystallization pattern into polycrystalline silicon by irradiating a laser onto the crystallization pattern. The crystallization pattern includes a peripheral region located within a first distance from an edge of the crystallization pattern, and an internal region located away from the edge of the crystallization pattern by more than the first distance. The internal region is divided into at least one sub-region, each sub-region includes one crystallization inducement pattern, and an edge of each sub-region is located within a second distance from the crystallization inducement pattern.

Abstract: Disclosed is a method for forming a polycrystalline film. The method for forming a polycrystalline film from a film deposited on a glass substrate while a buffer layer is interposed between the deposited film and the glass substrate, which includes the steps of: preparing a mask including a transparent region having a larger size than that of resolution limitation of a laser beam equipment and an opaque region having a size which is smaller than that of the resolution limitation of the laser beam equipment; and irradiating laser beam of the maximum intensity to a film under the transparent region while irradiating the laser beam having a minimum intensity exceeding zero to the film under an opaque region by using the mask, thereby crystallizing the film by single irradiation of the laser beam.

Abstract: Disclosed are a crystallization pattern, and a method for crystallizing amorphous silicon. The method includes the steps of forming an amorphous silicon film on a glass substrate, forming a crystallization pattern by patterning the amorphous silicon film, and crystallizing the crystallization pattern into polycrystalline silicon by irradiating a laser onto the crystallization pattern. The crystallization pattern includes a peripheral region located within a first distance from an edge of the crystallization pattern, and an internal region located away from the edge of the crystallization pattern by more than the first distance. The internal region is divided into at least one sub-region, each sub-region includes one crystallization inducement pattern, and an edge of each sub-region is located within a second distance from the crystallization inducement pattern.

Abstract: Disclosed is a method for forming a polycrystalline silicon film of a polycrystalline silicon thin film transistor. The method includes a step of crystallizing an amorphous silicon film deposited on a glass substrate by irradiating a laser beam onto the amorphous silicon film using a mask pattern. The glass substrate is horizontally moved by a predetermined distance unit corresponding to a translation distance of the mask pattern when the laser beam is irradiated onto the amorphous silicon film through a mask having the mask pattern, thereby growing grains in a circular shape.

Abstract: The present invention relates to a method for fabricating a single crystal silicon thin film at the desired location to the desired size from an amorphous or polycrystalline thin film on a substrate using laser irradiation and laser beam movement along the substrate having the semiconductor thin films being irradiated. This method comprises the steps of: forming a semiconductor layer or a metal thin film on a transparent or semi-transparent substrate; forming a single crystal seed region on the substrate of the desired size by a crystallization method using laser irradiation; and converting the desired region of the semiconductor layer or metal thin film into a single crystal region, using the single crystal seed region.

Abstract: Disclosed is a method for crystallizing a single crystalline Si film on an amorphous substrate, such as a glass substrate or a plastic substrate. The method includes the steps of selectively irradiating the laser beam onto a pixel section TFT forming region and a peripheral circuit TFT forming region of the amorphous silicon film through primary and secondary laser irradiation processes, thereby forming a poly-silicon film and irradiating the laser beam onto one of grains formed in the poly-silicon film through a third laser irradiation process, thereby forming a single crystalline silicon region having a desired size on a predetermined portion of the amorphous silicon film. The amorphous silicon film is locally crystallized into the single crystalline silicon film so that characteristics of TFTs for the pixel section and the peripheral circuit are improved while ensuring high uniformity.