Abstract: A multi-layer cooling structure comprising a first substrate layer comprising an array of cooling channels, a second substrate layer comprising a nozzle structure that includes one or more nozzles, an outlet, and an outlet manifold, a third substrate layer comprising an inlet manifold and an inlet, and one or more TSVs disposed through the first substrate layer, second substrate layer, and third substrate layer. At least one of the one or more TSVs is metallized. The first substrate layer and the second substrate layer are directly bonded, and the second substrate layer and the third substrate layer are directly bonded.

Abstract: A system includes an electronic device and a sensor to detect sensor data corresponding to the electronic device. The system also includes a machine learning processor that receives the sensor data and generates a model of the electronic device to determine a T squared threshold and a Q threshold using a machine learning algorithm. The machine learning processor also performs a T squared analysis of the electronic device by comparing a T squared value to the T squared threshold, and a Q analysis of the electronic device by comparing a Q value to the Q threshold. The machine learning processor also determines that the model is faulty when the T squared value is less than the T squared threshold and the Q value is greater than or equal to the Q threshold, and generates a new model or updates the model when the model is determined to be faulty.

Abstract: Embodiments described herein generally relate to an assembly including a manifold structure. The manifold structure includes a fluid inlet and a fluid outlet. The fluid inlet is for receiving a cooling fluid into the manifold structure and the fluid outlet is for removing the cooling fluid from the manifold structure. The manifold structure also includes a first cooling surface and an opposite second cooling surface. The first cooling surface includes a cooling chip inlet opening fluidly coupled to a cooling chip outlet opening. The fluid inlet is fluidly coupled to the cooling chip inlet opening. The second cooling surface includes a cavity. A first integrated fluid channel fluidly couples the cooling chip outlet opening to the cavity and a second integrated fluid channel fluidly couples the cavity to the fluid outlet. A cooling chip includes a plurality of microchannels, which fluidly couple the cooling chip to the first cooling surface.

Abstract: An electronics control system includes a power control unit disposed above a graphics processing unit and thermally connected to a cooling assembly inside. The system also includes a graphics processing unit disposed below the power control unit and thermally connected to the cooling assembly, an auxiliary DC-DC converter disposed below the power control unit and thermally connected to the cooling assembly, and a cooling assembly disposed at a predetermined location and configured to simultaneously transfer heat away from a power control unit, graphics processing unit, and auxiliary DC-DC converter via fluid circulation are presented.

Abstract: Methods, systems, and devices for an external vehicle charging system. The external vehicle charging system includes a first set of inductive coils. The first set of inductive coils include a first inductive coil and a second inductive coil and are configured to provide an alternating magnetic field to one or more inductive loops of a vehicle. The external vehicle charging system includes a sensor configured to detect a position of the one or more inductive loops and a processor. The processor is configured to determine a first threshold distance between the first inductive coil and the second inductive coil to reduce or eliminate interference. The processor is configured to activate the first inductive coil and the second inductive coil so that the first inductive coil and the second inductive coil align with the one or more inductive loops based on the detected position and the first threshold distance.

Abstract: Heat transfer apparatuses and methods for directing heat transfer are disclosed. A heat transfer apparatus includes a vapor chamber having a first surface and a second surface where the first surface and the second surface define a chamber space and at least one of the first surface and the second surface includes a hydrophilic coating. The heat transfer apparatus also includes one or more first ultrasonic oscillators coupled to the first surface, one or more second ultrasonic oscillators coupled to the second surface, and a controller having a non-transitory, processor-readable storage medium storing programming instructions for selectively activating the one or more first ultrasonic oscillators or the one or more second ultrasonic oscillators based on an intended direction of heat flux.

Abstract: An electronics assembly comprising at least one circuit board substrate comprising a fluid inlet channel and a fluid outlet channel and at least one heat generating component coupled to the circuit board substrate. The at least one heat generating component is fluidly coupled to the fluid inlet channel and the fluid outlet channel. A heat exchanger is directly coupled to the circuit board substrate and comprises an inlet plenum fluidly coupled to the fluid outlet channel of the circuit board substrate and an outlet plenum fluidly coupled to the inlet channel of the circuit board substrate. A pump is fluidly coupled to the circuit board substrate and the heat exchanger.

Abstract: A system, computer readable medium, and a method for monitoring power module degradation in a vehicle are provided. The method includes determining a structure function of a power module, determining a change in the structure function based on a comparison between the structure function and an initial or baseline structure function associated with the power module, outputting a degradation determination result based on the change in the structure function, and generating an alert when the degradation determination result exceeds a predetermined or adaptively determined degradation criterion value.

Abstract: An autonomous driving system includes an aerial vehicle and an autonomous vehicle. The aerial vehicle includes an imaging device configured to obtain map data, an optical-to-electrical transducer configured to convert optical power to electrical power for operating the aerial vehicle, one or more processors, one or more memory modules, and machine readable instructions stored in the one or more memory modules of the aerial vehicle that, when executed by the one or more processors, cause the aerial vehicle to output the map data. The autonomous vehicle includes an optical power generator configured to transmit an optical power beam to the optical-to-electrical transducer of the aerial vehicle. The autonomous vehicle receives the map data output by the imaging device from the aerial vehicle.

Abstract: A heat exchanging system includes one or more heat exchanging portions, wherein each heat exchanging portion includes an optimized internal fin structure. The optimization of the optimized internal fin structure includes receiving existing heat exchanging system. information, analyzing exterior fluid flow around the one or more heat exchanging portions as a heat flux analysis, determining boundary conditions of a heat flux distribution based on the heat flux analysis, receiving material properties of the one or more heat exchanging portions, and designing the optimized internal fin structure based on the existing heat exchanging system information, the boundary conditions of the heat flux distribution, and the material properties of the one or more heat exchanging portions.

Abstract: Methods, systems, and devices for inductively charging a vehicle. The inductive charging system includes multiple inductive coils for receiving a wireless transferred power. The inductive charging system includes a power electronics circuit that converts the wireless transferred power to a DC current and one or more power storage devices for storing the electrical energy by charging the one or more power storage devices using the DC current. The inductive charging system includes one or more motors configured to move the vehicle using the electrical energy. The inductive charging system includes an electronic control unit that is configured to control at least one of an amount of the electrical energy that is stored in each of the one or more power storage devices or an amount of the electrical energy that is distributed to the one or more motors to move the vehicle.

Abstract: A power electronics assembly includes a semiconductor device stack having a wide bandgap semiconductor device, a semiconductor cooling chip thermally coupled to the wide bandgap semiconductor device, and a first electrode electrically coupled to the wide bandgap semiconductor device and positioned between the wide bandgap semiconductor device and the semiconductor cooling chip. The semiconductor cooling chip is positioned between a substrate layer and the wide bandgap semiconductor device. The substrate layer includes a substrate inlet port and a substrate outlet port. An integrated fluid channel system extends between the substrate inlet port and the substrate outlet port and includes a substrate fluid inlet channel extending from the substrate inlet port into the substrate layer, a substrate fluid outlet channel extending from the substrate outlet port into the substrate layer, and one or more cooling chip fluid channels extending into the semiconductor cooling chip.

Abstract: Methods, systems, and apparatus for generating and storing electrical energy for a partially or fully electric vehicle having a motor/generator, the system includes an auxiliary power device configured to generate electrical energy by converting non-electrical energy into electrical energy. The system includes a transmitter connected to the auxiliary power device and configured to wirelessly transmit the electrical energy generated by the auxiliary power device. The system includes a battery configured to store electrical energy and power the motor/generator to propel the vehicle. The system includes a receiver connected to the battery and configured to receive electrical energy and charge the battery. The system includes a power bus configured to wirelessly receive the generated electrical energy from the transmitter and transmit the generated electrical energy to the receiver.

Abstract: Bridge circuits provide a reduced amplitude of gate-source voltage oscillation when the switches switch states during short circuit triggered turnoff for protection. Bridge circuits reduce an amplitude of an oscillation voltage between a gate and a source of a transistor that is utilized as a switch in the bridge circuit. This is beneficial because the reduced amplitude reduces the likelihood of damage to the transistor. A bridge circuit includes a first power rail and a second power rail. The bridge circuit further includes a first circuit having a first switch and a second switch connected in parallel between the first power rail and the second power rail. The bridge circuit further includes at least one passive circuit element connected in parallel with a primary energy flow path of the first circuit to damp oscillation voltage of the first circuit.

Abstract: Methods, systems, and device for wirelessly charging a device. The inductive charging system includes a power source for providing an electrical charge that is wirelessly transferred or emitted to charge a first device. The inductive charging system includes a configurable grid that is configured to form a first inductive loop and multiple switches. Each switch is configured to open and close to electrically connect different portions of the configurable grid. The inductive charging system includes a processor connected to the multiple switches. The processor is configured to operate the multiple switches to open and close the portions of the configurable grid to form the first inductive loop that wirelessly transfers the electrical charge to the first device.

Abstract: A method includes collecting, via processing circuitry, a first set of multi-load data from a power control unit of a vehicle and usage data at a first servicing of the vehicle, computing, via the processing circuitry, a Mahalanobis Distance (MD) using the first set of multi-load data, defining, via the processing circuitry, a healthy state and an anomaly threshold based on the MD, correlating, via the processing circuitry, the first set of usage data to the anomaly threshold; generating, via the processing circuitry, a usage based servicing schedule for a vehicle; collecting, via the processing circuitry, a next set of multi-load data and usage data at a next servicing of the vehicle; updating, via the processing circuitry, the MD, a servicing schedule and evaluating the performance of the vehicle; determining, via the processing circuitry, whether the MD crosses the anomaly threshold; and transmitting, via a network, a servicing alert.

Abstract: Systems, apparatuses, and methods for verifying an authenticity of an electronic device are disclosed. An apparatus includes one or more heat generating components coupled to an electronic device and arranged in a particular configuration such that, when selectively activated, the one or more heat generating components emit thermal radiation in a specific heat pattern that corresponds to the particular configuration and the selective activation. The specific heat pattern is readable by a thermal reading device to obtain information regarding the apparatus.

Abstract: A cooling structure includes a first substrate layer including an array of cooling channels, a second substrate layer including a nozzle structure, an outlet manifold, and an outlet, a third substrate layer including an inlet, and inlet manifold, and one or more flow directing features are disposed within the inlet manifold. The one or more flow directing features include one or more micro-pillars extending into the cooling fluid flow path from the inlet manifold, the first substrate layer includes one or more first substrate layer through-holes, the second substrate layer includes one or more second substrate layer-through holes, and the third substrate layer includes one or more third-substrate layer through holes. The first substrate layer through-holes, the second substrate layer through-holes, and the third substrate layer through-holes are aligned into one or more TSVs and metallized.

Abstract: An integrated thermal management assembly, device or system for a power conversion device having a driver board and a power board. The integrated thermal management assembly includes a double-sided cooler. The double-sided cooler has a first layer that includes a first surface that is positioned below an inner surface of the power board. The double-sided cooler has a second surface positioned above an inner surface of the driver board. The double-sided cooler includes a first coolant channel in between the first surface and the second surface. The thermal integrated assembly includes a coolant that flows within the first coolant channel and that is configured to dissipate heat projected through the double-sided cooler.

Abstract: A power electronics assembly includes a semiconductor device stack having a wide bandgap semiconductor device, a semiconductor cooling chip thermally coupled to the wide bandgap semiconductor device, and a first electrode electrically coupled to the wide bandgap semiconductor device and positioned between the wide bandgap semiconductor device and the semiconductor cooling chip. The semiconductor cooling chip is positioned between a substrate layer and the wide bandgap semiconductor device. The substrate layer includes a substrate inlet port and a substrate outlet port. An integrated fluid channel system extends between the substrate inlet port and the substrate outlet port and includes a substrate fluid inlet channel extending from the substrate inlet port into the substrate layer, a substrate fluid outlet channel extending from the substrate outlet port into the substrate layer, and one or more cooling chip fluid channels extending into the semiconductor cooling chip.