Abstract: Cooling systems and vehicles containing cooling systems are disclosed. A cooling system may include an evaporator, a condenser positioned downstream from the evaporator, a pump positioned downstream from the condenser, and a two phase cooler positioned downstream from the pump and in series upstream from the evaporator. The two phase cooler may receive thermal energy from a heat generating device to preheat a working fluid and directs the preheated working fluid to the evaporator.

Abstract: Cooling systems and vehicles containing cooling systems are disclosed. A cooling system may include an evaporator, a condenser positioned downstream from the evaporator, a pump positioned downstream from the condenser, and a two phase cooler positioned downstream from the pump and in series upstream from the evaporator. The two phase cooler may receive thermal energy from a heat generating device to preheat a working fluid and directs the preheated working fluid to the evaporator.

Abstract: Power electronics modules having jet impingement assemblies utilized to cool heat generating devices are disclosed. In one embodiment, a jet impingement assembly includes coupled manifold plates having a fluid inlet and outlet, a distribution surface, and a collection surface. The distribution surface of the first and second manifold plate is coupled to define a distribution manifold having a fluid distribution channel and one or more arrays of orifices extending through both manifold plates. Heat transfer plates are coupled to each manifold plate's collection surface forming impingement chambers. The heat transfer plates include one or more arrays of fins extending toward the collection surface of each manifold plate fluidly coupled to the fluid outlet. The first and second manifold plates and the first and second heat transfer plates are positioned in a horizontal stack such that the fluid inlets of both manifold plates are adjacent.

Abstract: Transient liquid phase compositions and bonding assemblies are disclosed. In one embodiment, a transient liquid phase composition includes a plurality of particles. Each particle includes a core, an inner shell surrounding the core, the inner shell, and an outer shell surrounding the inner shell. The core is made of a first high melting temperature material, the inner shell is made of a second high melting temperature material, and the outer shell is made of a low melting temperature material. The melting temperature of the low melting temperature material is less than the melting temperature of both the first and second high melting temperature materials.

Abstract: Two-phase cooling systems, power electronics modules, and methods for extending a maximum heat flux point of a two-phase cooling device are disclosed. In one embodiment, a method of operating a two-phase cooling device having an inlet, a chamber fluidly coupled to the inlet, and a heat transfer surface configured to receive heat flux from a heat generating device includes detecting at least one two-phase process parameter of the two-phase cooling device, and controlling a temperature of a coolant fluid at the inlet such that it is a first inlet temperature Tin1 when the at least one two-phase process parameter is less than a threshold. The method further includes controlling a temperature of the coolant fluid at the inlet such that it is a second inlet temperature Tin2, where Tin2 is less than Tin1.

Abstract: Circuit boards and computer-implemented methods for designing circuit boards are disclosed. In one embodiment, a method of designing a circuit board having an insulator substrate includes determining, by a computer, a plurality of thermal conductor traces that is arranged to direct heat flux generated by a heat generating component away from a temperature sensitive component, and determining a plurality of electrical connection traces based on an input schematic. At least a portion of the plurality of electrical connection traces incorporate at least a portion of the plurality of thermal conductor traces to define a conductive trace pattern that electrically connects pins of two or more components located on the substrate. The conductive trace pattern includes the plurality of thermal conductor traces and the plurality of electrical connection traces. Disruption of the plurality of thermal conductor traces is avoided while determining the plurality of electrical connection traces.

Abstract: Two-phase cooling systems, power electronics modules, and methods for extending a maximum heat flux point of a two-phase cooling device are disclosed. In one embodiment, a method of operating a two-phase cooling device having an inlet, a chamber fluidly coupled to the inlet, and a heat transfer surface configured to receive heat flux from a heat generating device includes detecting at least one two-phase process parameter of the two-phase cooling device, and controlling a temperature of a coolant fluid at the inlet such that it is e a first inlet temperature Tin1 when the at least one two-phase process parameter is less than a threshold. The method further includes controlling a temperature of the coolant fluid at the inlet such that it is a second inlet temperature Tin2, where Tin2 is less than Tin1.

Abstract: Power electronics modules having jet impingement assemblies utilized to cool heat generating devices are disclosed. In one embodiment, a jet impingement assembly includes coupled manifold plates having a fluid inlet and outlet, a distribution surface, and a collection surface. The distribution surface of the first and second manifold plate is coupled to define a distribution manifold having a fluid distribution channel and one or more arrays of orifices extending through both manifold plates. Heat transfer plates are coupled to each manifold plate's collection surface forming impingement chambers. The heat transfer plates include one or more arrays of fins extending toward the collection surface of each manifold plate fluidly coupled to the fluid outlet. The first and second manifold plates and the first and second heat transfer plates are positioned in a horizontal stack such that the fluid inlets of both manifold plates are adjacent.