Patents by Inventor Ercan M. Dede
Ercan M. Dede has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Power electronics assemblies having a semiconductor device with metallized embedded cooling channels
Patent number: 10121729Abstract: A power electronics assembly having a semiconductor device that includes a first device surface opposite a second device surface, a semiconductor substrate layer that extends from the first device surface to a substrate-drift interface, a semiconductor drift layer that extends from the substrate-drift interface towards the second device surface, and a semiconductor fluid channel is positioned within the semiconductor substrate layer of the semiconductor device. Further, the semiconductor fluid channel includes an inner surface. Moreover, a fluid channel metallization layer is positioned along the inner surface of the semiconductor fluid channel.Type: GrantFiled: July 25, 2016Date of Patent: November 6, 2018Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Ercan M. Dede, Kyosuke Miyagi, Yuji Fukuoka -
Publication number: 20180276546Abstract: A method for predicting a failure of a power control unit of a vehicle is provided. The method includes obtaining data from a plurality of sensors of the power control unit of a vehicle subject to simulated multi-load conditions, implementing a machine learning algorithm on the data to obtain machine learning data, obtaining new data from the plurality of sensors of power control unit of the vehicle subject to real multi-load conditions, implementing the machine learning algorithm on the new data to obtain test data, predicting a failure of the power control unit based on a comparison between the test data and the machine learning data.Type: ApplicationFiled: March 24, 2017Publication date: September 27, 2018Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Shailesh Joshi, Hiroshi Ukegawa, Ercan M. Dede, Kyosuke N. Miyagi
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Patent number: 10066876Abstract: Embodiments of an evaporator chamber heat flux rectifier and thermal switch are provided. Some embodiments include an evaporator layer with a first thermally conductive surface, a wicking structure for facilitating evaporation of a fluid in the vapor chamber heat flux rectifier, and a condenser layer that includes a second thermally conductive surface. Some embodiments include a middle layer, where when heat is applied to the first thermally conductive surface, the vapor chamber heat flux rectifier operates as a thermal conductor. Some embodiments that operate as a thermal switch include a non-condensable gas reservoir that is coupled to the condenser layer. The non-condensable gas reservoir may store a non-condensable gas when a threshold heat flux is applied to the evaporator layer. The non-condensable gas provides thermal insulation between the evaporator layer and the condenser layer when the threshold heat flux is not applied to the evaporator layer.Type: GrantFiled: September 9, 2016Date of Patent: September 4, 2018Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., The Board of Trustees of the Leland Stanford Junior UniversityInventors: Feng Zhou, Ercan M. Dede, Mehdi Asheghi, James W. Palko, Kenneth E. Goodson
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Publication number: 20180229618Abstract: Methods, systems, and apparatus for an electric vehicle. The system includes a battery control unit configured to be in a grid-connected mode or a stand-alone mode. The system includes a shared boost converter connected to a battery. The shared boost converter receives alternating current (AC) power, steps up voltage and converts the AC power to direct current (DC) power when the battery control unit is in the grid-connected mode. The shared boost converter receives DC power from the battery and steps up voltage when the battery control unit is in the stand-alone mode. The system also includes an inverter configured to receive the stepped up DC power when the battery control unit is in the stand-alone mode and convert the DC power to AC power. The system also includes a motor/generator connected to the inverter and configured to receive AC power for powering a drivetrain of the electric vehicle.Type: ApplicationFiled: February 14, 2017Publication date: August 16, 2018Inventors: Jae Seung Lee, Jongwon Shin, Ercan M. Dede
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Patent number: 10032694Abstract: A power electronics assembly includes a semiconductor device stack having a wide bandgap semiconductor device, a semiconductor cooling chip thermally coupled to the wide bandgap semiconductor device, and a first electrode electrically coupled to the wide bandgap semiconductor device and positioned between the wide bandgap semiconductor device and the semiconductor cooling chip. The semiconductor cooling chip is positioned between a substrate layer and the wide bandgap semiconductor device. The substrate layer includes a substrate inlet port and a substrate outlet port. An integrated fluid channel system extends between the substrate inlet port and the substrate outlet port and includes a substrate fluid inlet channel extending from the substrate inlet port into the substrate layer, a substrate fluid outlet channel extending from the substrate outlet port into the substrate layer, and one or more cooling chip fluid channels extending into the semiconductor cooling chip.Type: GrantFiled: June 7, 2016Date of Patent: July 24, 2018Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INCInventors: Yuji Fukuoka, Ercan M. Dede, Shailesh N. Joshi, Feng Zhou
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Patent number: 10020243Abstract: A power electronics assembly having a semiconductor device stack having a wide bandgap semiconductor device, a first electrode electrically coupled the wide bandgap semiconductor device, and a second electrode electrically coupled the wide bandgap semiconductor device. A substrate layer is coupled to the semiconductor device stack such that the first electrode is positioned between the substrate layer and the wide bandgap semiconductor device. The substrate layer includes a substrate inlet port and a substrate outlet port. An integrated fluid channel system extends between the substrate inlet and outlet ports and includes a substrate fluid inlet channel extending from the substrate inlet port into the substrate layer, a substrate fluid outlet channel extending from the substrate outlet port into the substrate layer, and one or more semiconductor fluid channels extending into the wide bandgap semiconductor device in fluid communication with the substrate fluid inlet and outlet channels.Type: GrantFiled: June 7, 2016Date of Patent: July 10, 2018Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Yuji Fukuoka, Ercan M. Dede, Shailesh N. Joshi, Feng Zhou
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Patent number: 10011222Abstract: A system includes a shell at least partially formed in a shape of a steering wheel and having a first layer and a second layer spaced apart from one another. The system further includes an LED coupled to the shell or the steering wheel. The system also includes a positive triboelectric material coupled to the first layer of the shell and that loses electrons in response to friction. The system further includes a negative triboelectric material coupled to the second layer of the shell and that gains electrons in response to friction. The system further includes an electrical connector coupled to the LED and at least one of the positive triboelectric material or the negative triboelectric material. Current flows through the electrical connector to illuminate the LED when force is being applied to the shell causing the positive triboelectric material to contact the negative triboelectric material.Type: GrantFiled: May 2, 2017Date of Patent: July 3, 2018Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.Inventors: Songtao Wu, Chi-Ming Wang, Khoa Vo, Debasish Banerjee, Ercan M. Dede
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Patent number: 9990457Abstract: A device includes an electrical circuit having one or more parallel layers and one or more electronic components of a switching circuit configured to operate at one or more frequencies mounted to several layers of the electrical circuit. Wire traces electrically connecting the one or more electronic components have cutouts with predetermined patterns and dimensions formed along edges where AC current flow is concentrated to increase an effective edge length of the wire traces to reduce oscillation and heat loss of the traces.Type: GrantFiled: January 12, 2016Date of Patent: June 5, 2018Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.Inventors: Masanori Ishigaki, Danny J. Lohan, Ercan M. Dede
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Publication number: 20180073814Abstract: Embodiments of an evaporator chamber heat flux rectifier and thermal switch are provided. Some embodiments include an evaporator layer with a first thermally conductive surface, a wicking structure for facilitating evaporation of a fluid in the vapor chamber heat flux rectifier, and a condenser layer that includes a second thermally conductive surface. Some embodiments include a middle layer, where when heat is applied to the first thermally conductive surface, the vapor chamber heat flux rectifier operates as a thermal conductor. Some embodiments that operate as a thermal switch include a non-condensable gas reservoir that is coupled to the condenser layer. The non-condensable gas reservoir may store a non-condensable gas when a threshold heat flux is applied to the evaporator layer. The non-condensable gas provides thermal insulation between the evaporator layer and the condenser layer when the threshold heat flux is not applied to the evaporator layer.Type: ApplicationFiled: September 9, 2016Publication date: March 15, 2018Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., The Board of Trustees of the Leland Stanford Junior UniversityInventors: Feng Zhou, Ercan M. Dede, Mehdi Asheghi, James W. Palko, Kenneth E. Goodson
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Power Electronics Assemblies Having a Semiconductor Device with Metallized Embedded Cooling Channels
Publication number: 20180025962Abstract: A power electronics assembly having a semiconductor device that includes a first device surface opposite a second device surface, a semiconductor substrate layer that extends from the first device surface to a substrate-drift interface, a semiconductor drift layer that extends from the substrate-drift interface towards the second device surface, and a semiconductor fluid channel is positioned within the semiconductor substrate layer of the semiconductor device. Further, the semiconductor fluid channel includes an inner surface. Moreover, a fluid channel metallization layer is positioned along the inner surface of the semiconductor fluid channel.Type: ApplicationFiled: July 25, 2016Publication date: January 25, 2018Inventors: Ercan M. Dede, Kyosuke Miyagi, Yuji Fukuoka -
Publication number: 20170346056Abstract: An insulation system for a vehicle includes a vehicle component that operates at an operating temperature that is higher than an initial temperature, an insulation member thermally coupled to the vehicle component and thermally coupled to an ambient medium, the insulation member including an enclosed chamber, the enclosed chamber including a chamber wall that defines an interior volume, and carbon dioxide positioned within the interior volume of the enclosed chamber, where the chamber wall prevents flow of the carbon dioxide out of the enclosed chamber.Type: ApplicationFiled: May 26, 2016Publication date: November 30, 2017Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Shailesh N. Joshi, Ercan M. Dede
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Publication number: 20170328648Abstract: Heat transfer apparatuses and methods for directing heat transfer are disclosed. A heat transfer apparatus includes a vapor chamber having a first surface and a second surface where the first surface and the second surface define a chamber space and at least one of the first surface and the second surface includes a hydrophilic coating. The heat transfer apparatus also includes one or more first ultrasonic oscillators coupled to the first surface, one or more second ultrasonic oscillators coupled to the second surface, and a controller having a non-transitory, processor-readable storage medium storing programming instructions for selectively activating the one or more first ultrasonic oscillators or the one or more second ultrasonic oscillators based on an intended direction of heat flux.Type: ApplicationFiled: May 11, 2016Publication date: November 16, 2017Applicant: Toyota Motor Engineering & Manufacturing North America Inc.Inventors: Ercan M. Dede, Feng Zhou, Shailesh N. Joshi
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Patent number: 9779199Abstract: Circuit boards and computer-implemented methods for designing circuit boards are disclosed. In one embodiment, a method of designing a circuit board having an insulator substrate includes determining, by a computer, a plurality of thermal conductor traces that is arranged to direct heat flux generated by a heat generating component away from a temperature sensitive component, and determining a plurality of electrical connection traces based on an input schematic. At least a portion of the plurality of electrical connection traces incorporate at least a portion of the plurality of thermal conductor traces to define a conductive trace pattern that electrically connects pins of two or more components located on the substrate. The conductive trace pattern includes the plurality of thermal conductor traces and the plurality of electrical connection traces. Disruption of the plurality of thermal conductor traces is avoided while determining the plurality of electrical connection traces.Type: GrantFiled: July 25, 2014Date of Patent: October 3, 2017Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Paul D. Schmalenberg, Ercan M. Dede, Tsuyoshi Nomura
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Publication number: 20170263532Abstract: A power electronics assembly includes a semiconductor device stack having a wide bandgap semiconductor device, a semiconductor cooling chip thermally coupled to the wide bandgap semiconductor device, and a first electrode electrically coupled to the wide bandgap semiconductor device and positioned between the wide bandgap semiconductor device and the semiconductor cooling chip. The semiconductor cooling chip is positioned between a substrate layer and the wide bandgap semiconductor device. The substrate layer includes a substrate inlet port and a substrate outlet port. An integrated fluid channel system extends between the substrate inlet port and the substrate outlet port and includes a substrate fluid inlet channel extending from the substrate inlet port into the substrate layer, a substrate fluid outlet channel extending from the substrate outlet port into the substrate layer, and one or more cooling chip fluid channels extending into the semiconductor cooling chip.Type: ApplicationFiled: June 7, 2016Publication date: September 14, 2017Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Yuji Fukuoka, Ercan M. Dede, Shailesh N. Joshi, Feng Zhou
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Publication number: 20170262660Abstract: Systems, apparatuses, and methods for verifying an authenticity of an electronic device are disclosed. An apparatus includes one or more heat generating components coupled to an electronic device and arranged in a particular configuration such that, when selectively activated, the one or more heat generating components emit thermal radiation in a specific heat pattern that corresponds to the particular configuration and the selective activation. The specific heat pattern is readable by a thermal reading device to obtain information regarding the apparatus.Type: ApplicationFiled: March 11, 2016Publication date: September 14, 2017Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Ercan M. Dede, Paul Schmalenberg
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Publication number: 20170263531Abstract: A power electronics assembly having a semiconductor device stack having a wide bandgap semiconductor device, a first electrode electrically coupled the wide bandgap semiconductor device, and a second electrode electrically coupled the wide bandgap semiconductor device. A substrate layer is coupled to the semiconductor device stack such that the first electrode is positioned between the substrate layer and the wide bandgap semiconductor device. The substrate layer includes a substrate inlet port and a substrate outlet port. An integrated fluid channel system extends between the substrate inlet and outlet ports and includes a substrate fluid inlet channel extending from the substrate inlet port into the substrate layer, a substrate fluid outlet channel extending from the substrate outlet port into the substrate layer, and one or more semiconductor fluid channels extending into the wide bandgap semiconductor device in fluid communication with the substrate fluid inlet and outlet channels.Type: ApplicationFiled: June 7, 2016Publication date: September 14, 2017Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Yuji Fukuoka, Ercan M. Dede, Shailesh N. Joshi, Feng Zhou
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Publication number: 20170235852Abstract: Systems and methods of simulating a physical bond layer comprising a composite material and predicting one or more properties of the composite material are disclosed. A method includes obtaining one or more X-ray images of a bulk physical sample of a composite material, the one or more X-ray images including one or more visual identifiers that correspond to one or more materials present in the bulk physical sample, and generating a three dimensional image of the bulk physical sample from the one or more X-ray images. The three dimensional image includes one or more labels indicating the presence and location of the one or more materials. The method further includes creating a meshed three dimensional microstructure-based model from the three dimensional image and simulating a physical bond layer with the meshed three dimensional microstructure-based model. The meshed three dimensional microstructure-based model incorporates data obtained from the one or more labels.Type: ApplicationFiled: February 17, 2016Publication date: August 17, 2017Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Shailesh N. Joshi, Masao Noguchi, Ercan M. Dede
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Publication number: 20170202078Abstract: A device includes an electrical circuit having one or more parallel layers and one or more electronic components of a switching circuit configured to operate at one or more frequencies mounted to several layers of the electrical circuit. Wire traces electrically connecting the one or more electronic components have cutouts with predetermined patterns and dimensions formed along edges where AC current flow is concentrated to increase an effective edge length of the wire traces to reduce oscillation and heat loss of the traces.Type: ApplicationFiled: January 12, 2016Publication date: July 13, 2017Applicant: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.Inventors: Masanori ISHIGAKI, Danny J. LOHAN, Ercan M. DEDE
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Patent number: 9622380Abstract: Two-phase jet impingement cooling devices and electronic device assemblies are disclosed. In one embodiment, a cooling device includes a manifold having a fluid inlet surface, a fluid outlet surface defining an outlet manifold, and a fluid outlet. The fluid inlet surface includes an inlet channel fluidly coupled to a first jet region and a second jet region each including a plurality of jet orifices and a plurality of surface features extending from the fluid inlet surface. A target plate is coupled to the fluid outlet surface of the manifold that includes a target surface, a first heat sink, and a second heat sink. A cover plate is coupled to the fluid inlet surface of the manifold, which includes a fluid inlet port fluidly coupled to the inlet channel of the manifold, and a fluid outlet port fluidly coupled to the fluid outlet of the manifold.Type: GrantFiled: September 30, 2015Date of Patent: April 11, 2017Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Shailesh N. Joshi, Ercan M. Dede
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Publication number: 20170094837Abstract: Two-phase jet impingement cooling devices and electronic device assemblies are disclosed. In one embodiment, a cooling device includes a manifold having a fluid inlet surface, a fluid outlet surface defining an outlet manifold, and a fluid outlet. The fluid inlet surface includes an inlet channel fluidly coupled to a first jet region and a second jet region each including a plurality of jet orifices and a plurality of surface features extending from the fluid inlet surface. A target plate is coupled to the fluid outlet surface of the manifold that includes a target surface, a first heat sink, and a second heat sink. A cover plate is coupled to the fluid inlet surface of the manifold, which includes a fluid inlet port fluidly coupled to the inlet channel of the manifold, and a fluid outlet port fluidly coupled to the fluid outlet of the manifold.Type: ApplicationFiled: September 30, 2015Publication date: March 30, 2017Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Shailesh N. Joshi, Ercan M. Dede