Patents by Inventor Eric DiStefano

Eric DiStefano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230168732
    Abstract: In one embodiment, a processor includes at least one core to execute instructions and a power controller coupled to the at least one core. The power controller may include a first logic to cause the at least one core to exit an idle state and enter into a maximum performance state for a first time duration, thereafter enter into an intermediate power state for a second time duration, and thereafter enter into a sustained performance state. Other embodiments are described and claimed.
    Type: Application
    Filed: August 4, 2022
    Publication date: June 1, 2023
    Applicant: Tahoe Research, Ltd.
    Inventors: Efraim Rotem, Doron Rajwan, Eliezer Weissmann, Nir Rosenzweig, Eric Distefano, Ishmael F. Santos, James G. Hermerding, II
  • Patent number: 11435816
    Abstract: In one embodiment, a processor includes at least one core to execute instructions and a power controller coupled to the at least one core. The power controller may include a first logic to cause the at least one core to exit an idle state and enter into a maximum performance state for a first time duration, thereafter enter into an intermediate power state for a second time duration, and thereafter enter into a sustained performance state. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: September 6, 2022
    Assignee: Intel Corporation
    Inventors: Efraim Rotem, Doron Rajwan, Eliezer Weissmann, Nir Rosenzweig, Eric Distefano, Ishmael F. Santos, James G. Hermerding, II
  • Patent number: 11301011
    Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: April 12, 2022
    Assignee: INTEL CORPORATION
    Inventors: Ketan R. Shah, Tawfik M. Rahal-Arabi, Eric DiStefano, James G. Hermerding, II
  • Publication number: 20210349522
    Abstract: In one embodiment, a processor includes at least one core to execute instructions and a power controller coupled to the at least one core. The power controller may include a first logic to cause the at least one core to exit an idle state and enter into a maximum performance state for a first time duration, thereafter enter into an intermediate power state for a second time duration, and thereafter enter into a sustained performance state. Other embodiments are described and claimed.
    Type: Application
    Filed: March 29, 2021
    Publication date: November 11, 2021
    Inventors: Efraim Rotem, Doron Rajwan, Eliezer Weissmann, Nir Rosenzweig, Eric Distefano, Ishmael F. Santos, James G. Hermerding, II
  • Patent number: 10990161
    Abstract: In one embodiment, a processor includes at least one core to execute instructions and a power controller coupled to the at least one core. The power controller may include a first logic to cause the at least one core to exit an idle state and enter into a maximum performance state for a first time duration, thereafter enter into an intermediate power state for a second time duration, and thereafter enter into a sustained performance state. Other embodiments are described and claimed.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: April 27, 2021
    Assignee: Intel Corporation
    Inventors: Efraim Rotem, Doron Rajwan, Eliezer Weissmann, Nir Rosenzweig, Eric Distefano, Ishmael F. Santos, James G. Hermerding, II
  • Publication number: 20200218319
    Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.
    Type: Application
    Filed: November 26, 2019
    Publication date: July 9, 2020
    Applicant: INTEL CORPORATION
    Inventors: Ketan R. Shah, Tawfik M. Rahal-Arabi, Eric DiStefano, James G. Hermerding, II
  • Patent number: 10488899
    Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: November 26, 2019
    Assignee: Intel Corporation
    Inventors: Ketan R. Shah, Tawfik M. Rahal-Arabi, Eric Distefano, James G. Hermerding, II
  • Publication number: 20190235618
    Abstract: In one embodiment, a processor includes at least one core to execute instructions and a power controller coupled to the at least one core. The power controller may include a first logic to cause the at least one core to exit an idle state and enter into a maximum performance state for a first time duration, thereafter enter into an intermediate power state for a second time duration, and thereafter enter into a sustained performance state. Other embodiments are described and claimed.
    Type: Application
    Filed: April 12, 2019
    Publication date: August 1, 2019
    Inventors: Efraim Rotem, Doron Rajwan, Eliezer Weissmann, Nir Rosenzweig, Eric Distefano, Ishmael F. Santos, James G. Hermerding, II
  • Patent number: 10289514
    Abstract: An apparatus and method for a user configurable reliability control loop. For example, one embodiment of a processor comprises: a reliability meter to track accumulated stress on components of the processor based on measured processor operating conditions; and a controller to receive stress rate limit information and to responsively specify a set of N operating limits on the processor in accordance with the accumulated stress and the stress rate limit information; and performance selection logic to output one or more actual operating conditions for the processor based on the N operating limits specified by the controller.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: May 14, 2019
    Assignee: Intel Corporation
    Inventors: Dorit Shapira, Krishnakanth V. Sistla, Efraim Rotem, Eric Distefano, James G. Hermerding, II, Esfir Natanzon
  • Patent number: 10281975
    Abstract: In one embodiment, a processor includes at least one core to execute instructions and a power controller coupled to the at least one core. The power controller may include a first logic to cause the at least one core to exit an idle state and enter into a maximum performance state for a first time duration, thereafter enter into an intermediate power state for a second time duration, and thereafter enter into a sustained performance state. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: May 7, 2019
    Assignee: Intel Corporation
    Inventors: Efraim Rotem, Doron Rajwan, Eliezer Weissmann, Nir Rosenzweig, Eric Distefano, Ishmael F. Santos, James G. Hermerding, II
  • Publication number: 20180157298
    Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.
    Type: Application
    Filed: July 12, 2017
    Publication date: June 7, 2018
    Applicant: Intel Corporation
    Inventors: Ketan R. Shah, Tawfik M. Rahal-Arabi, Eric Distefano, James G. Hermerding, II
  • Patent number: 9898066
    Abstract: A technique to change a thermal design power (TDP) value. In one embodiment, one or more environmental or user-driven changes may cause a processor's TDP value to be changed. Furthermore, in some embodiments a change in TDP may alter a turbo mode target frequency.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: February 20, 2018
    Assignee: INTEL CORPORATION
    Inventors: Eric Distefano, Guy M. Therien, Vasudevan Srinivasan, Tawfik Rahal-Arabi, Venkatesh Ramani, Ryan D. Wells, Stephen H. Gunther, Jeremy Shrall, Hames Hermerding, II
  • Patent number: 9898067
    Abstract: A technique to change a thermal design power (TDP) value. In one embodiment, one or more environmental or user-driven changes may cause a processor's TDP value to be changed. Furthermore, in some embodiments a change in TDP may alter a turbo mode target frequency.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: February 20, 2018
    Assignee: INTEL CORPORATION
    Inventors: Eric Distefano, Guy M. Therien, Vasudevan Srinivasan, Tawfik M. Rahal-Arabi, Venkatesh Ramani, Ryan D. Wells, Stephen H. Gunther, Jeremy J. Shrall, James G. Hermerding, II
  • Publication number: 20170371401
    Abstract: In one embodiment, a processor includes at least one core to execute instructions and a power controller coupled to the at least one core. The power controller may include a first logic to cause the at least one core to exit an idle state and enter into a maximum performance state for a first time duration, thereafter enter into an intermediate power state for a second time duration, and thereafter enter into a sustained performance state. Other embodiments are described and claimed.
    Type: Application
    Filed: June 23, 2016
    Publication date: December 28, 2017
    Inventors: Efraim Rotem, Doron Rajwan, Eliezer Weissmann, Nir Rosenzweig, Eric Distefano, Ishmael F. Santos, James G. Hermerding, II
  • Patent number: 9710030
    Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: July 18, 2017
    Assignee: INTEL CORPORATION
    Inventors: Ketan R. Shah, Tawfik M. Rahal-Arabi, Eric Distefano, James G. Hermerding, II
  • Patent number: 9465418
    Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: October 11, 2016
    Assignee: INTEL CORPORATION
    Inventors: Ketan R. Shah, Tawfik M. Rahal-Arabi, Eric Distefano, James G. Hermerding, II
  • Publication number: 20160216754
    Abstract: A technique to change a thermal design power (TDP) value. In one embodiment, one or more environmental or user-driven changes may cause a processor's TDP value to be changed. Furthermore, in some embodiments a change in TDP may alter a turbo mode target frequency.
    Type: Application
    Filed: April 1, 2016
    Publication date: July 28, 2016
    Inventors: ERIC DISTEFANO, GUY M. THERIEN, VASUDEVAN SRINIVASAN, TAWFIK M. RAHAL-ARABI, VENKATESH RAMANI, RYAN D. WELLS, STEPHEN H. GUNTHER, JEREMY J. SHRALL, JAMES G. HERMERDING, II
  • Publication number: 20150377955
    Abstract: An apparatus and method for a user configurable reliability control loop. For example, one embodiment of a processor comprises: a reliability meter to track accumulated stress on components of the processor based on measured processor operating conditions; and a controller to receive stress rate limit information from a user or manufacturer and to responsively specify a set of N operating limits on the processor in accordance with the accumulated stress and the stress rate limit information; and performance selection logic to output one or more actual operating conditions for the processor based on the N operating limits specified by the controller.
    Type: Application
    Filed: June 30, 2014
    Publication date: December 31, 2015
    Inventors: Dorit Shapira, Krishnakanth V. Sistla, Efraim Rotem, Eric Distefano, James G. Hermerding, II, Esfir Natanzon
  • Patent number: 9176550
    Abstract: An apparatus may comprise a power management system. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: November 3, 2015
    Assignee: INTEL CORPORATION
    Inventors: Biswajit Sur, Eric Distefano, James G. Hermerding, II, Eugene P. Matter, John P. Wallace, Guy M. Therien
  • Publication number: 20150185795
    Abstract: A technique to change a thermal design power (TDP) value. In one embodiment, one or more environmental or user-driven changes may cause a processor's TDP value to be changed. Furthermore, in some embodiments a change in TDP may alter a turbo mode target frequency.
    Type: Application
    Filed: March 11, 2015
    Publication date: July 2, 2015
    Inventors: Eric Distefano, Guy M. Therien, Vasudevan Srinivasan, Tawfik Rahal-Arabi, Venkatesh Ramani, Ryan D. Wells, Stephen H. Gunther, Jeremy Shrall, James Hermerding, II