Abstract: An apparatus to use a refrigerator in a mobile computing device is described. In one embodiment, the refrigerator includes a cold reservoir to absorb heat generated by a heat generating unit of the mobile device. A heat exchanger is used to dissipate heat of a hot reservoir of the refrigerator. In an alternative embodiment, the apparatus includes a working fluid loop, with a fluid of the loop to be in thermal contact with the heat generating device, and the cold reservoir of the refrigerator to absorb heat from the fluid.

Abstract: Embodiments of the present invention provides an electronic component cooling system and method that diverts a portion of a cooling fan's cooling air from high power electronic components such as processors and directs the cooling air to other electronic components of a system. Active cooling air may be provided at higher velocities and lower temperatures to cool electronic components of a system such as a computer or other electronic device. An attach block may be thermally coupled to a first electronic component. A heat exchanger may be thermally coupled to the attach block. A cooling fan may receive inlet air and may generate cooling air. A plenum duct between the cooling fan and the heat exchanger may direct the generated cooling air from the fan to the heat exchanger. A portion of the generated cooling air from the cooling fan may be diverted towards a second electronic component included in the system.

Abstract: A system and a method for using parallel heat exchangers to disperse heat from a mobile computing system are disclosed. In one possible embodiment, multiple heat exchangers are thermally coupled to a thermal attach platform. Multiple remote heat exchangers may be thermally coupled to the thermal attach platform using a heat pipe for each remote heat exchanger or a single heat pipe for all the remote heat exchangers. In one embodiment, the thermal attach platform may be a copper block or a heat pipe chamber. An air circulation unit may be coupled adjacent to each remote heat exchanger. Direct attachment heat exchangers may be directly attached to the thermal attach platform. An air circulation unit, such as a fan, may be coupled adjacent to the direct attachment heat exchanger, either vertically or horizontally.

Abstract: Cooling techniques to cool electronic devices in a computer system are disclosed. For one embodiment, the cooling technique utilizes a combination of an active cooling component with a passive cooling component. The active cooling component includes a heat exchanger, a pipe loop, and a pump. A liquid coolant is to extract heat from an electronic device and be transported by the pipe loop to the heat exchanger where the heat is rejected. The flow of the liquid coolant between the electronic device and the heat exchanger is enhanced by the pump. The passive cooling component includes a heat pipe. An evaporation end of the heat pipe is coupled to the electronic device to extract heat from the electronic device. A condensation end of the heat pipe is coupled to the heat exchanger to condense vapor in the heat pipe.

Abstract: According to one embodiment of the present invention, a cooling apparatus for notebook computer systems is disclosed. The apparatus includes: an evaporator coupled to a heat generating device to extract the generated heat away from the device, the device being installed inside a notebook computer, a heat exchanger coupled to the evaporator; a transport medium to flow inside the evaporator and the heat exchanger to transfer the generated heat from the device to the heat exchanger; and a pump attached to the evaporator and the heat exchanger to force the transport medium between the evaporator and the heat exchanger.

Abstract: A system and a method for using parallel heat exchangers to disperse heat from a mobile computing system are disclosed. In one possible embodiment, multiple heat exchangers are thermally coupled to a thermal attach platform. Multiple remote heat exchangers may be thermally coupled to the thermal attach platform using a heat pipe for each remote heat exchanger or a single heat pipe for all the remote heat exchangers. In one embodiment, the thermal attach platform may be a copper block or a heat pipe chamber. An air circulation unit may be coupled adjacent to each remote heat exchanger. Direct attachment heat exchangers may be directly attached to the thermal attach platform. An air circulation unit, such as a fan, may be coupled adjacent to the direct attachment heat exchanger, either vertically or horizontally.

Abstract: A notebook computer system that utilizes both natural convection and forced convection cooling methods is described. Specifically, at low power levels, the forced convection components are disabled to conserve energy and to reduce noise.

Abstract: Apparatus and method are provided to enable cooling electronic components in computer systems using liquid metal as a coolant. The liquid metal coolant extracts heat generated by an electronic component and flows to a heat exchanger where the heat is rejected into ambient air through force convection. A pump is used to enable the liquid metal coolant to circulate in a closed loop system.

Abstract: According to one embodiment of the present invention, a cooling apparatus for notebook computer systems is disclosed. The apparatus includes: an evaporator coupled to a heat generating device to extract the generated heat away from the device, the device being installed inside a notebook computer; a heat exchanger coupled to the evaporator; a transport medium to flow inside the evaporator and the heat exchanger to transfer the generated heat from the device to the heat exchanger; and a pump attached to the evaporator and the heat exchanger to force the transport medium between the evaporator and the heat exchanger.

Abstract: A first cooling system pre-heats a fuel for a fuel cell, and a second cooling system cools a heat generating device using a fluid medium.

Abstract: A fuel cell and a platform associated with the fuel cell include a common fluid cooling system.

Abstract: A protective layer and an encapsulant for a thermal interface are disclosed. In one embodiment, an apparatus has a heat generating device, a heat dissipating device, a thermal interface between the heat generating and heat dissipating devices, and an encapsulant covering the thermal interface. In another embodiment, layers of grease are applied between the thermal interface and at least one of the heat generating and heat dissipating devices. In a further embodiment, a method comprises encapsulating a thermal interface in an encapsulant to protect the thermal interface. In another embodiment, a method comprises applying a first layer of grease between a heat generating device and a thermal interface and a second layer of grease between a heat dissipating device and the thermal interface.

Abstract: An apparatus including an actuation membrane unit to generate air movement in a direction of a heat generating device to reduce an ambient temperature of the device.

Abstract: A docking station is provided with apertures that line up with apertures in a notebook. When the notebook is docked on the docking station, air is forced out of the notebook through the openings of the docking station and the notebook.

Abstract: A docking station is provided with a thermoelectric module to generate cool air of a first temperature to be fed into a docked computer.

Abstract: A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.

Abstract: A technique for increasing the thermal capability of a portable electronic device includes transferring dissipated heat from a heat source disposed within the portable electronic device to at least one heat exchanger via at least one respective thermal transfer device. This may be in addition to another heat exchanger connected to the heat source via another thermal transfer device. At least one external fan is disposed adjacent to the at least one heat exchanger and dissipated heat transferred from the heat source to the at least one heat exchanger is removed via a flow of air generated by the at least one external fan. This may be in addition to an internal fan disposed adjacent the another heat exchanger to dissipate heat transferred from the heat source to the anther heat exchanger via flow of air generated by the internal fan. The at least one thermal transfer device may be a heat pipe. The portable electronic device may be a notebook computer and the heat source disposed therein may be a processor.

Abstract: A system for using a plenum to cool components of the system is described. The plenum distributes air to local hot spots of the system which are remote from a fan source. A central processing fan, a separate system fan, or an external air source may be used to generate the air to be distributed.

Abstract: A method and apparatus for cooling a portable computer system using a computer cooler with a cold plate that comes into contact with the portable computer system to transfer heat from the portable computer system to the environment surrounding the computer cooler.

Abstract: An external heat exchanger to be attached external to a computer to force air into an internal chamber of the computer, to reduce an ambient temperature within the chamber of the computer.