Patents by Inventor Eric DiStefano

Eric DiStefano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070177349
    Abstract: A fluid mover includes a rotor to transfer momentum with a fluid when operated at a given volumetric flow rate through the rotor. The rotor includes a plurality of enclosed passages to transfer momentum in or out of the fluid as the fluid passes through the enclosed passages in response to rotation of the rotor. The passages are formed with a cross sectional shape and cross sectional dimensions along their entire length sufficient to establish and maintain laminar flow of the fluid along the entire length of the enclosed passages when the fluid is passing through the rotor at the given volumetric flow rate. The fluid mover also includes a housing having at least one inlet and at least one outlet for the fluid.
    Type: Application
    Filed: November 22, 2006
    Publication date: August 2, 2007
    Inventors: Himanshu Pokharna, Eric Baugh, Eric DiStefano, Jason Ku, Rajiv Mongia, Yoshifumi Nishi, Theodore Hill, Charles Hill
  • Patent number: 7243497
    Abstract: An apparatus to use a refrigerator in a mobile computing device is described. In one embodiment, the refrigerator is a thermoacoustic based refrigerator. In one embodiment, the refrigerator is a Stirling based refrigerator.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: July 17, 2007
    Assignee: Intel Corporation
    Inventors: Rajiv K. Mongia, Himanshu Pokhama, Eric DiStefano
  • Publication number: 20070076374
    Abstract: An apparatus includes a microchannel structure that has microchannels formed therein. The microchannels are for transporting a coolant and are intended to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus further includes a cover positioned on the microchannel structure. The cover has formed therein a right-angle passage to provide fluid communication between a first port on a lower horizontal surface of the cover and a second port on a vertical surface of the cover. The cover includes a plurality of tabs. Each tab extends from a respective corner of the cover. The tabs each have an aperture formed therein. The apertures are shaped and sized to receive a fastener.
    Type: Application
    Filed: September 30, 2005
    Publication date: April 5, 2007
    Inventors: Rajiv Mongia, Himanshu Pokharna, Eric DiStefano, Shawn McEuen, Brian Wilk
  • Publication number: 20070076376
    Abstract: A method, apparatus and computer system are described for providing for the transfer of heat from electronic components. The computer system includes a frame and an apparatus. The apparatus includes a chassis component with a heat pipe, a heat exchanger, a conduit of tubing, a cold plate, and a pump to provide for the flow of the fluid between the heat exchanger and the cold plate. The heat pipe is thermally coupled between the cold plate and the heat exchanger to provide for the transfer of thermal energy from the cold plate to the heat exchanger independently of the conduit of tubing. The heat pipe may transfer a substantial amount of the thermal energy from the cold plate to the heat exchanger. The heat pipe may operate passively and provide cooling in an ambient manner.
    Type: Application
    Filed: September 30, 2005
    Publication date: April 5, 2007
    Inventors: Rajiv Mongia, Himanshu Pokharna, Eric DiStefano
  • Patent number: 7193316
    Abstract: According to some embodiments, a microchannel is provided to transport a coolant. The microchannel may be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. Moreover, a movable portion may be provided to adjust a volume of a space associated with the microchannel (e.g., when the coolant freezes).
    Type: Grant
    Filed: December 16, 2004
    Date of Patent: March 20, 2007
    Assignee: Intel Corporation
    Inventors: Rajiv K. Mongia, Himanshu Pokharna, Eric DiStefano
  • Patent number: 7164580
    Abstract: A system for using a plenum to cool components of the system is described. The plenum distributes air to local hot spots of the system which are remote from a fan source. A central processing fan, a separate system fan, or an external air source may be used to generate the air to be distributed.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: January 16, 2007
    Assignee: Intel Corporation
    Inventor: Eric DiStefano
  • Patent number: 7131487
    Abstract: An apparatus for cooling heat producing devices is disclosed. In one embodiment, the apparatus includes a heat absorber attached to a first end of a base. Both the base and the heat absorber may be formed of a thermally conductive material, and a width of the heat absorber is greater than a width of the base.
    Type: Grant
    Filed: December 14, 2001
    Date of Patent: November 7, 2006
    Assignee: Intel Corporation
    Inventors: Je Young Chang, Eric DiStefano
  • Publication number: 20060221568
    Abstract: A method and apparatus for measuring the temperature of a computer system, such as a notebook computer, is described. A sensor module is to mount within the computer system spaced from an interior surface of a chassis of the system, the sensor to measure an internal surface of a chassis of the system.
    Type: Application
    Filed: March 31, 2005
    Publication date: October 5, 2006
    Inventors: Jim Kardach, David Williams, Eric Distefano, Marlon Cardenas, Jim Hermerding
  • Publication number: 20060149974
    Abstract: A system for measuring and managing thermal operations of a processor core on a semiconductor die using a sensor positioned in a hotspot of the processor core. A measured temperature reading is determined based upon a temperature sensed by the sensor. Interrupt signals and a software readable register indicating temperature information provide feedback about the thermal environment to the processor. Based upon the measured temperature reading, the interrupt signals direct the processor to modify operation.
    Type: Application
    Filed: December 30, 2004
    Publication date: July 6, 2006
    Inventors: Efraim Rotem, Jim Hermerding, Eric Distefano, Barnes Cooper
  • Publication number: 20060131733
    Abstract: According to some embodiments, a microchannel is provided to transport a coolant. The microchannel may be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. Moreover, a movable portion may be provided to adjust a volume of a space associated with the microchannel (e.g., when the coolant freezes).
    Type: Application
    Filed: December 16, 2004
    Publication date: June 22, 2006
    Inventors: Rajiv Mongia, Himanshu Pokharna, Eric DiStefano
  • Publication number: 20060113066
    Abstract: A cooling system using counter-flow air and fins with thermal isolation sections is disclosed. The cooling system includes a pump and a liquid coolant. Counter-flow air is applied in a direction generally opposite to a direction of the liquid coolant. The thermally isolation fins help reducing conduction of heat.
    Type: Application
    Filed: December 1, 2004
    Publication date: June 1, 2006
    Inventors: Rajiv Mongia, Himanshu Pokharna, Eric Distefano
  • Patent number: 7048038
    Abstract: A technique for increasing the thermal capability of a portable electronic device includes transferring dissipated heat from a heat source disposed within the portable electronic device to at least one heat exchanger via at least one respective thermal transfer device. This may be in addition to another heat exchanger connected to the heat source via another thermal transfer device. At least one external fan is disposed adjacent to the at least one heat exchanger and dissipated heat transferred from the heat source to the at least one heat exchanger is removed via a flow of air generated by the at least one external fan. This may be in addition to an internal fan disposed adjacent the another heat exchanger to dissipate heat transferred from the heat source to the anther heat exchanger via flow of air generated by the internal fan. The at least one thermal transfer device may be a heat pipe. The portable electronic device may be a notebook computer and the heat source disposed therein may be a processor.
    Type: Grant
    Filed: January 6, 2004
    Date of Patent: May 23, 2006
    Assignee: Intel Corporation
    Inventors: Himanshu Pokharna, Eric Distefano
  • Patent number: 7031159
    Abstract: A system and a method for using parallel heat exchangers to disperse heat from a mobile computing system are disclosed. In one possible embodiment, multiple heat exchangers are thermally coupled to a thermal attach platform. Multiple remote heat exchangers may be thermally coupled to the thermal attach platform using a heat pipe for each remote heat exchanger or a single heat pipe for all the remote heat exchangers. In one embodiment, the thermal attach platform may be a copper block or a heat pipe chamber. An air circulation unit may be coupled adjacent to each remote heat exchanger. Direct attachment heat exchangers may be directly attached to the thermal attach platform. An air circulation unit, such as a fan, may be coupled adjacent to the direct attachment heat exchanger, either vertically or horizontally.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: April 18, 2006
    Assignee: Intel Corporation
    Inventors: Eric DiStefano, Ravi S. Prasher, Himanshu Pokharna
  • Patent number: 7023697
    Abstract: An apparatus including an actuation membrane unit to generate air movement in a direction of a heat generating device to reduce an ambient temperature of the device.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: April 4, 2006
    Assignee: Intel Corporation
    Inventors: Himanshu Pokharna, Eric DiStefano
  • Publication number: 20060068251
    Abstract: A fuel cell module for powering a computer system is described. Specifically, the fuel cell module may comprise a fuel cell stack, fuel storage unit, and a thermal management unit. Electricity to power the computer system is generated by the fuel cell stack. The fuel storage unit supplies the fuel for the fuel cell stack. The thermal management unit is used to monitor and remove heat and water byproducts generated by the fuel cell stack.
    Type: Application
    Filed: September 29, 2004
    Publication date: March 30, 2006
    Inventors: Rajiv Mongia, Eric DiStefano
  • Publication number: 20060064999
    Abstract: A method of creating a thermal influence table to describe thermal relationships between components in a system and use of the thermal influence table in a system is described. The thermal influence matrix may be generated dynamically for a system. The matrix may be used by a thermal management policy to enable a hot device to be cooled by power management of another device in the system.
    Type: Application
    Filed: September 29, 2004
    Publication date: March 30, 2006
    Inventors: Jim Hermerding, Barnes Cooper, Steve Frayne, Eric Distefano, Sridhar Machiroutu
  • Publication number: 20050284166
    Abstract: An apparatus to use a compressor in a mobile computing device to increase a temperature of a working fluid used to absorb heat generated by a heat generating unit of the mobile computer. In one embodiment, the apparatus includes a working fluid loop with the fluid of the loop being in thermal contact with the heat generating device, and the fluid is to pass through a heat exchanger to dissipate heat from the fluid.
    Type: Application
    Filed: June 23, 2004
    Publication date: December 29, 2005
    Inventors: Rajiv Mongia, Himanshu Pokharna, Eric DiStefano
  • Publication number: 20050217279
    Abstract: An apparatus to use a refrigerator in a mobile computing device is described. In one embodiment, the refrigerator is a thermoacoustic based refrigerator. In one embodiment, the refrigerator is a Stirling based refrigerator.
    Type: Application
    Filed: September 30, 2004
    Publication date: October 6, 2005
    Inventors: Rajiv Mongia, Himanshu Pokharna, Eric DiStefano
  • Publication number: 20050217278
    Abstract: An apparatus to use a refrigerator in a mobile computing device is described. In one embodiment, the refrigerator includes a cold reservoir to absorb heat generated by a heat generating unit of the mobile device. A heat exchanger is used to dissipate heat of a hot reservoir of the refrigerator. In an alternative embodiment, the apparatus includes a working fluid loop, with a fluid of the loop to be in thermal contact with the heat generating device, and the cold reservoir of the refrigerator to absorb heat from the fluid.
    Type: Application
    Filed: September 30, 2004
    Publication date: October 6, 2005
    Inventors: Rajiv Mongia, Himanshu Pokharna, Eric DiStefano
  • Publication number: 20050219819
    Abstract: A thermal management system of a notebook computer that has an improved heat exchanger is described. Specifically, the heat exchanger may comprise a heat exchanger tube insert, a plurality of internal fins in the heat exchanger tube, or a flattened heat exchanger tube.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 6, 2005
    Inventors: Himanshu Pokharna, Eric DiStefano, Rajiv Mongia