Abstract: A method, a device, and a composition are disclosed. The method includes providing a polyol blend that includes a polyol resin and an electromagnetic (EMA) additive, providing an isocyanate resin selected such that blending the isocyanate resin with the polyol blend results in an EMA spray foam. The device includes a first compartment containing an isocyanate resin and a second compartment containing a polyol blend, which includes a polyol resin and an EMA additive. The composition includes a polyurethane spray foam and an EMA additive blended into the polyurethane spray foam.

Abstract: A latch mechanism includes a mounting bracket, a stop connected to the mounting bracket, a first spring connected to the mounting bracket and in contact with the stop to preload the first spring, and a latch. The latch includes a second spring rotatably connected to the mounting bracket, and a body connected to the second spring. The body includes a pad at one end of the body, and a first pawl at a second end of the body opposite of the pad.

Abstract: A composition, method, and article of manufacture are disclosed. The microcapsule includes a polymer shell encapsulating a core component. The polymer shell includes light upconversion molecules. The article of manufacture includes the microcapsule. The method includes obtaining light upconversion molecules having sidechains with reactive functional groups, and forming a microcapsule. The microcapsule includes a polymer shell encapsulating a core component. The polymer shell includes light upconversion molecules. The article of manufacture includes the microcapsule.

Abstract: A system and method for pairing two devices for secure communications. A user selects a first device to pair with a second device. The first and second devices have the ability to securely communicate with each other through the use of encrypted communications. An encryption key is written to the first device and then burned into the encryption module on the first device. A corresponding decryption key is written to the second device and then is burned into the decryption module of the second device.

Abstract: Embodiments of the present invention are directed to an in-situ warpage monitoring system and method for preventing head-in-pillow (HIP) or other potential defect escapes during a solder reflow process. In a non-limiting embodiment of the invention, a product is passed through a reflow oven. The product can include a printed circuit board (PCB). An amount of warpage of the product is measured at one or more monitoring devices positioned along the reflow oven. Each measured amount of warpage is compared to a predetermined warpage limit. The product is sorted into one of a plurality of designated lots based on the comparison. The lots can include a pass lot, a fail lot, and a marginal pass lot.

Abstract: A shoe may include an upper sole and an outer sole. In one state of the shoe, the upper sole is conductively connected to the outer sole. In another state of the shoe, the upper sole is electrically insulated from the outer sole. The shoe may be changed between these states.

Abstract: Disclosed aspects relate to a structure which includes shape memory materials having transition triggers to transition the shape memory materials between initial states and transitioned states. A first physical shape of the structure exists when the first shape memory material has the first initial state and the second shape memory material has the second initial state. A second physical shape of the structure exists when the first shape memory material has the first transitioned state and the second shape memory material has the second initial state. A third physical shape of the structure exists when the first shape memory material has the first transitioned state and the second shape memory material has the second transitioned state. The physical shapes of the structure are reversible in nature. In embodiments, the shape memory materials are bonded to a flexible substrate or are clad together.

Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

Abstract: A system and method for providing a secure image load. The system includes a microcontroller. The microcontroller has a plurality of physically modifiable internal components (PMIC). Each of the plurality of PMICs can only be modified one time. The system further includes an image loader configured to load a boot image from the memory of the microcontroller, and a checksum calculator configured to calculate a checksum value for the boot image. The system further includes a checksum burner configured to modify the plurality of PMICs to create a binary representation of the checksum value for the image. A checksum value is calculated for the image. This checksum value is written to the microcontroller. The value is burned into the microcontroller using the PMICs. Further, responses to the checksum mismatch are burned into the microcontroller using the PMICs that are present in the microcontroller.

Abstract: A process of utilizing a water-sensitive fluorophore for moisture content evaluation in a hygroscopic polymer includes forming a blend that includes a hygroscopic polymer resin and a water-sensitive fluorophore. The process includes forming pellets having a particular geometry from the blend, determining fluorescence properties of at least one of the pellets, and determining moisture content of at least one of the pellets. The process also includes generating a calibration curve for the particular pellet geometry by correlating the fluorescence properties with the moisture content. The process further includes providing the calibration curve for non-destructive moisture content evaluation of a material derived from the pellets.

Abstract: Provided is a method for collecting sensor data using time-domain reflectometry (TDR). A primary device transmits a TDR signal to a first sensor. A reflected signal is received in response to the transmitted TDR signal. The reflected signal is analyzed to determine an impedance of the first sensor. Based on the impedance of the first sensor, a sensor value for the first sensor is determined.

Abstract: A method, printed circuit board assembly (PCBA), and device comprising a PCBA are disclosed. The method includes obtaining a material comprising silver halide grains, incorporating the material into a PCBA having at least one component in contact with the material, detecting a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enacting a data protection response. The PCBA includes a material comprising silver halide grains, at least one component in contact with the material, and a monitoring component. The monitoring component is configured to detect a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enact a data protection response.

Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

Abstract: A system and method for providing a secure image load. The system includes a microcontroller. The microcontroller has a plurality of physically modifiable internal components (PMIC). Each of the plurality of PMICs can only be modified one time. The system further includes an image loader configured to load a boot image from the memory of the microcontroller, and a checksum calculator configured to calculate a checksum value for the boot image. The system further includes a checksum burner configured to modify the plurality of PMICs to create a binary representation of the checksum value for the image. A checksum value is calculated for the image. This checksum value is written to the microcontroller. The value is burned into the microcontroller using the PMICs. Further, responses to the checksum mismatch are burned into the microcontroller using the PMICs that are present in the microcontroller.

Abstract: Provided is a method for collecting sensor data using time-domain reflectometry (TDR). A primary device transmits a TDR signal to a first sensor. A reflected signal is received in response to the transmitted TDR signal. The reflected signal is analyzed to determine an impedance of the first sensor. Based on the impedance of the first sensor, a sensor value for the first sensor is determined.

Abstract: A system and method for making vias in a laminated printed circuit board (PCB). A drill having both a mechanical drill and a laser drill is used to make the via. The mechanical drill is moved over a location in the PCB where a blind via is desired. The mechanical drill drills to a point where a tip of a bit of the mechanical drill is a predetermined distance above a target interconnect layer. Then the drill is moved such that the laser drill is located over the via where the mechanical drill had drilled the via. The laser drill then ablates the resin remaining above the target interconnect layer.

Abstract: A composition, method, and article of manufacture are disclosed. The composition is formed by polymerizing monomers, and includes at least one flame-retardant bis(triketone) monomer and at least one amine monomer. The method includes obtaining at least one flame-retardant bis(triketone) monomer, obtaining at least one amine monomer, and polymerizing the monomers to form a flame-retardant polydiketoenamine. The article of manufacture includes a polymer formed by polymerizing at least one flame-retardant bis(triketone) monomer and at least one amine monomer.

Abstract: Method, apparatus, and computer program product are provided for determining a maximum temperature to which a perishable good or other temperature sensitive item was exposed. In some embodiments, a capacitance of a circuit provided on a substrate is measured. The circuit includes capacitor(s) each having first and second plates separated from each other by an ionic liquid (IL) in a solid state. The IL melts at a predetermined temperature and flows away from the first and second plates into a void. In some embodiments, the predetermined temperature at which the IL melts is different for each capacitor. For example, each capacitor in the circuit may employ a different N-alkyl bezothiazolium salt. A maximum temperature of exposure is determined based on the measured capacitance. In some embodiments, a decision of whether to discard the perishable good or other temperature sensitive item may be based on the determined maximum temperature.

Abstract: Described herein are techniques for reducing resin squeeze-out including a method comprising receiving a first component and a second component, where the first component is configured to be joined to the second component at an overlap area using an adhesive layer to form a structure having a ledge. The method further comprises applying the adhesive layer to the overlap area on the first component. The method further comprises selectively curing a portion of the adhesive layer adjacent to the ledge. The method further comprises forming the structure by combining the first component, the second component, and the adhesive layer and curing a remainder of the adhesive layer.

Abstract: A method, composition, and article of manufacture. The method can include depositing a layer, which includes a set of particles and a set of microcapsules encapsulating polymerizing agents. The method can also include fusing particles in selected areas of the layer with a laser, and rupturing at least a portion of microcapsules using at least one energy source selected from the laser, an ultraviolet (UV) radiation source, and a heat source. The composition can include a set of particles and a set of microcapsules, each containing a polymerizing agent encapsulated by a degradable shell. The article of manufacture can include fused layers that include fused particles and pores sealed in reactions with polymerizing agents released from degradable microcapsules.