Abstract: An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a hydrophobic coating to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary hydrophobic coatings include, but are not limited to, polydialkylsiloxanes such as polydimethylsiloxanes. In one embodiment, a multilayer hose is immersed in a solution containing hydrophobizing siloxane monomers dissolved in a solvent. The coated multilayer hose is then dried to evaporate the solvent. As the solvent evaporates, the siloxane monomers bind together to form the hydrophobic coating. In some embodiments, one or more hoses each provided with a hydrophobic coating interconnect liquid-coolant cooling system components (e.g.

Abstract: A microcapsule, method, and article of manufacture are disclosed. The microcapsule includes an outer shell, a molecular sensitizer, a molecular annihilator, and an inner shell separating the molecular sensitizer from the molecular annihilator. The method includes forming microcapsules, each microcapsule having an outer shell, a molecular sensitizer, a molecular annihilator, and an inner shell separating the molecular sensitizer from the molecular annihilator. The article of manufacture includes at least one of the microcapsules.

Abstract: A composition, method, and article of manufacture are disclosed. The composition and the article of manufacture include a silica particle and light upconversion molecules incorporated into the silica particle. The method includes obtaining sidechain-modified light upconversion molecules, and incorporating the sidechain-modified light upconversion molecules into a silica particle to form a light upconversion particle.

Abstract: A composition, method, and article of manufacture are disclosed. The microcapsule includes a polymer shell encapsulating a core component. The polymer shell includes light upconversion molecules. The article of manufacture includes the microcapsule. The method includes obtaining light upconversion molecules having sidechains with reactive functional groups, and forming a microcapsule. The microcapsule includes a polymer shell encapsulating a core component. The polymer shell includes light upconversion molecules. The article of manufacture includes the microcapsule.

Abstract: A microcapsule, method, and article of manufacture are disclosed. The microcapsule includes an outer shell, a molecular sensitizer, a molecular annihilator, and an inner shell separating the molecular sensitizer from the molecular annihilator. The method includes forming microcapsules, each microcapsule having an outer shell, a molecular sensitizer, a molecular annihilator, and an inner shell separating the molecular sensitizer from the molecular annihilator. The article of manufacture includes at least one of the microcapsules.

Abstract: A composition, method, and article of manufacture are disclosed. The composition is a microcapsule that includes a transparent shell encapsulating a mixture comprising light upconversion molecules. The method is a method of forming a microcapsule, which includes obtaining light upconversion molecules, forming an emulsion of the light upconversion molecules and a shell formation solution, and encapsulating the light upconversion molecules in a transparent shell. The article of manufacture comprises the microcapsule.

Abstract: A composition, method, and article of manufacture are disclosed. The composition includes a silica particle with light upconversion molecules bound to its surface. The method includes obtaining silica particles and light upconversion molecules having sidechains with reactive functional groups. The method further includes binding the light upconversion molecules to surfaces of the silica particles. The article of manufacture includes the composition.

Abstract: A system and method for pairing two devices for secure communications. A user selects a first device to pair with a second device. The first and second devices have the ability to securely communicate with each other through the use of encrypted communications. An encryption key is written to the first device and then burned into the encryption module on the first device. A corresponding decryption key is written to the second device and then is burned into the decryption module of the second device.

Abstract: A thermo-gravimetric analysis system includes a chamber having an interior; and a sample crucible connected to and inside of the chamber, the sample crucible configured to hold a sample material. The system further includes a reference crucible connected to and inside of the chamber; and a metal organic framework (MOF) crucible connected to and inside of the chamber, separate from the sample crucible, the MOF crucible including an MOF material.

Abstract: A multilayer component is coated with a fluorogenic probe designed to give off florescence when in contact with one or more metals in the multilayer component. The fluorogenic probe is exposed to radiation. The intensity and wavelength of the florescence is measured to determine a porosity of the one or more layers of the multilayer component.

Abstract: A device, method, and article of manufacture for corrosion monitoring are disclosed. The device includes a corrodible component and a silicone layer positioned over the corrodible component. The method includes providing a corrosion monitoring assembly having a corrodible component and a silicone layer positioned over the corrodible component. The article of manufacture includes a corrosion monitoring assembly having a corrodible component and a silicone layer positioned over the corrodible component.

Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

Abstract: A composite material incorporates multi-compartment microcapsules that produce heat when subject to a stimulus such as a compressive force or a magnetic field. The stimulus ruptures an isolating structure within the multi-compartment microcapsule, allowing reactants within the multi-compartment microcapsule to produce heat from an exothermic reaction. In some embodiments, the composite material is a laminate used in the manufacture of multi-layer printed circuit boards (PCBs) and provides heat during the curing process of the multi-layer PCBs to ensure a consistent thermal gradient in the multi-layer product.

Abstract: A method, system and computer program product for implementing enhanced component reliability for leading edge components in a server computer system based upon system humidity conditions. A humidity value is identified and compared with a threshold value at an air flow input in contact with the leading edge components. One or more air flow control elements are used to direct air flow based upon the compared humidity values of the server system.

Abstract: A method and a system for detecting defects in plated-through hole by partially submerging a printed circuit board in a fluid bath. The method includes partially submerging a printed circuit board on a first side and measuring a capillary height difference within a plated-through hole and the surrounding fluid bath. The method further includes partially submerging the printed circuit board on a second side and measuring a second capillary height difference within the plated-through hole and the surrounding fluid bath. The method also includes comparing the measured values with predetermined values to determine the quality of the plated-through hole.

Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.

Abstract: A self-heating thermal interface material (TIM) may be formed using heating components dispersed within the TIM. The heating components may produce heat when the TIM is compressed. The heating components may be formed from microcapsules and the microcapsules may contain exothermic reactants. The reactants may be isolated from contact within the microcapsule until a compressive force is applied.

Abstract: A heat exchange apparatus, and method of forming the apparatus, are disclosed. The apparatus includes a thermally conductive substrate with a metal microlattice structure adhered to the thermally conductive substrate and in thermal communication with the thermally conductive substrate, the metal microlattice structure comprising a region containing an electroless metal. A method of making the apparatus includes forming a polymer lattice, applying the polymer lattice to a thermally conductive substrate, forming an electroless plated metal layer on the polymer lattice, forming an electroplated metal layer on the electroless metal layer, and forming a metal microlattice of the electroless metal layer and the electroplated metal layer.

Abstract: Embodiments of the present invention are directed to an in-situ warpage monitoring system and method for preventing head-in-pillow (HIP) or other potential defect escapes during a solder reflow process. In a non-limiting embodiment of the invention, a product is passed through a reflow oven. The product can include a printed circuit board (PCB). An amount of warpage of the product is measured at one or more monitoring devices positioned along the reflow oven. Each measured amount of warpage is compared to a predetermined warpage limit. The product is sorted into one of a plurality of designated lots based on the comparison. The lots can include a pass lot, a fail lot, and a marginal pass lot.

Abstract: A chain-reactive, heat-generating microcapsule comprises a first compartment including a first component and a second compartment including a second component. An isolating structure separates the first and second compartments. The isolating structure may rupture when heated above a normal ambient temperature and/or in response to a compressive force. The first component reacts with the second component to produce heat. The microcapsule may further incorporate a blowing agent that responds to heating. In some embodiments, a core within the first compartment comprises a blowing agent material that responds to the heat produced when the first and second components react. The microcapsules can be incorporated into a material comprising a heat-curable resin precursor such that heat generated by the microcapsules can be used to cure the resin precursor.