Abstract: A multilayer printed circuit board (PCB) includes a laminate between a first core and a second core. The first core is located in a middle position of the multi-layer PCB and includes a resistive heating element directly upon a first core substrate. A portion of the resistive heating element protrudes from the multi-layer PCB perimeter. A laminator that fabricates the PCB includes a platen, a power supply, a processor, and memory that has program instructions embodied therewith which are readable by the processor to cause the laminator to position the platen against a surface of the multi-layer PCB and cure the laminate by heating the multi-layer PCB with the platen and cure the laminate by heating the multi-layer PCB with the resistive heating element.

Abstract: A multi-layer thermal interface material including two or more thermal interface materials laminated together, where each of the two or more thermal interface materials comprise different mechanical properties.

Abstract: A system and method for providing a secure image load. The system includes a microcontroller. The microcontroller has a plurality of physically modifiable internal components (PMIC). Each of the plurality of PMICs can only be modified one time. The system further includes an image loader configured to load a boot image from the memory of the microcontroller, and a checksum calculator configured to calculate a checksum value for the boot image. The system further includes a checksum burner configured to modify the plurality of PMICs to create a binary representation of the checksum value for the image. A checksum value is calculated for the image. This checksum value is written to the microcontroller. The value is burned into the microcontroller using the PMICs. Further, responses to the checksum mismatch are burned into the microcontroller using the PMICs that are present in the microcontroller.

Abstract: A system and method for providing content to a user outside of a home region. A portable device displays content to a user through a network connection. A home content provider provides content to the portable device from the home region. Some of the content provided is region restricted content. A location verifier determines that the portable device and the user are both physically located within the home region. The location verifier issues to the user a location token when the user and the portable device are in the home region. A token verifier verifies the location token when the user requests the region restricted content outside of the home region. The token verifier further instructs the home content provider to provide region restricted content to the user when the user has the location token.

Abstract: A microcapsule, a method, and an article of manufacture. The microcapsule includes a degradable shell and a polymerizing agent encapsulated by the degradable shell. The method includes selecting a polymerizing agent, encapsulating the polymerizing agent in a degradable shell, and rupturing the degradable shell by exposure to an energy source, such as a laser, a UV radiation source, and/or a heat source. The article of manufacture includes a microcapsule having a degradable shell and a polymerizing agent encapsulated by the degradable shell.

Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.

Abstract: In an embodiment, a method of forming a stub-less via is provided. The method includes depositing a plurality of microcapsules containing a metal material in a via of a printed circuit board (PCB); rupturing the microcapsules and releasing the metal material; and sintering the metal material. In another embodiment, a method of forming a stub-less via is provided. The method includes forming a via in a printed circuit board (PCB); installing a plug in a portion of the via; depositing in the via a plurality of nanoparticles containing a metal material; and sintering the metal material.

Abstract: A device includes a syringe, which has a tip, plunger, and barrel containing a fluid. The device also includes a needle electrode coupled to the tip of the syringe, a release component, and a control component configured to receive electrical measurements made by the needle electrode, determine impedance values from the electrical measurements, and identify a target tissue based on the impedance values. In response to the identification, the control component generates instructions to reposition a release component. A method includes receiving electrical measurements from a needle electrode, determining impedance values based on the electrical measurements. A target tissue is identified based on the impedance values, and a release component is repositioned in response.

Abstract: Forming a thermal interface material structure includes forming an assembly that includes a thermal interface material disposed between a first mating surface and a second mating surface. The first mating surface is associated with a module lid, and the second mating surface is associated with a heat sink. Protruding surface features are incorporated onto the first mating surface or the second mating surface. The process also includes compressing the assembly to form a thermal interface material structure. The thermal interface material structure includes the thermal interface material disposed within an interface defined by the first mating surface and the second mating surface. The protruding surface features protrude from the first mating surface or the second mating surface into selected areas of the interface to limit relative movement of the mating surfaces into the selected areas during thermal cycling to reduce thermal interface material migration out of the interface.

Abstract: A method and a system for non-destructively detecting defects within and/or on plated-through holes are provided. The method includes sealing a plated-through hole on a printed circuit board to detect for possible defects along the sidewall of the plated-through hole. The method further includes applying an airflow through the plated-through hole and measuring the airflow entering the plated-through hole at the gasket to determine the initial airflow calculation. The method also includes measuring the airflow again as it exits the plated-through hole to determine an exit airflow calculation. A determination of the quality of the plated-through hole is made by the method by analyzing the initial airflow calculation and the exit airflow calculation.

Abstract: A method and a system for detecting defects in plated-through hole by partially submerging a printed circuit board in a fluid bath. The method includes partially submerging a printed circuit board on a first side and measuring a capillary height difference within a plated-through hole and the surrounding fluid bath. The method further includes partially submerging the printed circuit board on a second side and measuring a second capillary height difference within the plated-through hole and the surrounding fluid bath. The method also includes comparing the measured values with predetermined values to determine the quality of the plated-through hole.

Abstract: Provided is a method for collecting sensor data using time-domain reflectometry (TDR). A master device transmits a TDR signal to a first sensor. A reflected signal is received in response to the transmitted TDR signal. The reflected signal is analyzed to determine an impedance of the first sensor. Based on the impedance of the first sensor, a sensor value for the first sensor is determined.

Abstract: A shoe may include an upper sole and an outer sole. In one state of the shoe, the upper sole is conductively connected to the outer sole. In another state of the shoe, the upper sole is electrically insulated from the outer sole. The shoe may be changed between these states.

Abstract: A method, composition, and article of manufacture. The method can include depositing a layer, which includes a set of particles and a set of microcapsules encapsulating polymerizing agents. The method can also include fusing particles in selected areas of the layer with a laser, and rupturing at least a portion of microcapsules using at least one energy source selected from the laser, an ultraviolet (UV) radiation source, and a heat source. The composition can include a set of particles and a set of microcapsules, each containing a polymerizing agent encapsulated by a degradable shell. The article of manufacture can include fused layers that include fused particles and pores sealed in reactions with polymerizing agents released from degradable microcapsules.

Abstract: A microcapsule, a method, and an article of manufacture. The microcapsule includes a degradable shell and a polymerizing agent encapsulated by the degradable shell. The method includes selecting a polymerizing agent, encapsulating the polymerizing agent in a degradable shell, and rupturing the degradable shell by exposure to an energy source, such as a laser, a UV radiation source, and/or a heat source. The article of manufacture includes a microcapsule having a degradable shell and a polymerizing agent encapsulated by the degradable shell.

Abstract: A lock system and method for alerting a user or other entity that a lock has been or is being tampered with is disclosed. The lock includes at least one enhanced security pin that is electrically isolated from the rest of the lock. When the lock picker attempts to pick the lock a portion of the enhanced security pin contacts either the plug or the outer casing of the lock to complete a circuit with an alert component. The completion of the circuit causes the alert component to generate an alert signal that can be observed by the user or other entity.

Abstract: A process of curing a photo-curable material includes dispersing a microcapsule in a material that includes a photo-initiator and a photo-curable material. The process also includes applying a stimulus to the microcapsule to trigger a chemiluminescent reaction within the microcapsule. The chemiluminescent reaction generating a photon having a wavelength within a particular emission range that is consistent with an absorption range of the photo-initiator. The photon exits the microcapsule to trigger the photo-initiator to initiate or catalyze curing of the photo-curable material.

Abstract: Described herein are techniques for reducing resin squeeze-out including a method comprising receiving a first component and a second component, where the first component is configured to be joined to the second component at an overlap area using an adhesive layer to form a structure having a ledge. The method further comprises applying the adhesive layer to the overlap area on the first component. The method further comprises selectively curing a portion of the adhesive layer adjacent to the ledge. The method further comprises forming the structure by combining the first component, the second component, and the adhesive layer and curing a remainder of the adhesive layer.

Abstract: A method and circuit for implementing transient electronic circuits for security applications, and a design structure on which the subject circuit resides are provided. Silver nanowire traces are fabricated forming a protection circuit in a soluble material. A frangible material is provided separating the soluble material from a solvent layer proximately located. During a tampering event the frangible material is ruptured releasing the solvent which contacts and dissolves the soluble material and disperses the silver nanowire traces creating an electrical open in the protection circuit. The electrical open enables enhanced tampering detection.

Abstract: A process of forming a thermal interface material structure includes selectively masking a putty pad that includes ultraviolet (UV) curable cross-linkers to form a masked putty pad. The masked putty pad has a first area that is exposed and a second area that is masked. The process also includes exposing the masked putty pad to UV light to form a selectively cross-linked putty pad. The process includes disposing the selectively cross-linked putty pad between an electrical component and a heat spreader to form an assembly. The process further includes compressing the assembly to form a thermal interface material structure that includes a selectively cross-linked thermal interface material.