Patents by Inventor Eun KO

Eun KO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250143150
    Abstract: A display device includes: a substrate comprising light-emitting areas and a non-light-emitting area; a light emitting element layer on the substrate; a thin-film encapsulation layer on the light emitting element layer; a wavelength conversion layer on the thin-film encapsulation layer; a binding member on the wavelength conversion layer and comprising an epoxy group; an opposing substrate facing the substrate; a color filter layer on a surface of the opposing substrate; and an auxiliary layer on the color filter layer and comprising an amine group, wherein the binding member and the auxiliary layer are in contact with each other, and the epoxy group of the binding member and the amine group of the auxiliary layer are chemically bonded to each other.
    Type: Application
    Filed: May 13, 2024
    Publication date: May 1, 2025
    Inventors: Yo Han KIM, Ji Eun KO, Won Min YUN, Hae Myeong LEE, Byoung Duk LEE, Seung Ju LEE, Su Min JUNG, Hye Young HAN
  • Publication number: 20250107407
    Abstract: A display device that includes a light emitting element layer disposed on a substrate, a thin-film encapsulation layer disposed on the light emitting element layer, a wavelength conversion layer disposed on the thin-film encapsulation layer and including a bank which defines light emitting areas and a non-light emitting area, a dam structure disposed on the wavelength conversion layer and overlapping at least one of the light emitting areas, a filling layer disposed on the wavelength conversion layer and disposed between portions of the dam structure, a color filter layer disposed on the dam structure, and a counter substrate disposed on the color filter layer, wherein the filling layer overlaps ones of the light emitting areas not overlapping the dam structure.
    Type: Application
    Filed: April 22, 2024
    Publication date: March 27, 2025
    Applicant: Samsung Display Co., LTD.
    Inventors: Soo Dong KIM, Jung Hwan YI, Ji Eun KO, Rae Young KIM, Yo Han KIM, Je Won YOO, Su Min JUNG, Hye Young HAN
  • Publication number: 20240237229
    Abstract: The present invention relates to a release layer for a metal foil with carrier and a metal foil with carrier including the release layer. The release layer is designed for easy removal of the carrier and includes one or more nitrogenous heterocyclic compounds and one or more inorganic compounds containing at least one metal selected from the group consisting of nickel, molybdenum, cobalt, phosphorus, manganese, and iron.
    Type: Application
    Filed: December 10, 2021
    Publication date: July 11, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dea Geun KIM, Myong Hwan PARK, Nak Eun KO, Ju Yong SIM
  • Publication number: 20240174812
    Abstract: Provided is a leveling agent that controls a plating process for forming a circuit pattern. The leveling agent allows the circuit pattern to have a uniform height and square shape even though the circuit pattern has various line widths. Also provided is an electroplating composition including the leveling agent.
    Type: Application
    Filed: June 24, 2022
    Publication date: May 30, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dae Geun KIM, Nak Eun KO, Ju Yong SIM
  • Publication number: 20240140905
    Abstract: The present invention relates to a leveler capable of efficiently filling the inside of via holes formed during the manufacturing process of a printed circuit board, and an electroplating composition comprising the same. When via holes on a substrate are filled with the electroplating composition according to the present invention, the via holes can be filled in a relatively short time while minimizing the formation of dimples or voids.
    Type: Application
    Filed: June 27, 2023
    Publication date: May 2, 2024
    Inventors: Dea Geun KIM, Sung Wook CHUN, Bo Mook CHUNG, Nak Eun KO
  • Publication number: 20240138075
    Abstract: The present invention relates to a release layer for a metal foil with carrier and a metal foil with carrier including the release layer. The release layer is designed for easy removal of the carrier and includes one or more nitrogenous heterocyclic compounds and one or more inorganic compounds containing at least one metal selected from the group consisting of nickel, molybdenum, cobalt, phosphorus, manganese, and iron.
    Type: Application
    Filed: December 10, 2021
    Publication date: April 25, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dea Geun KIM, Myong Hwan PARK, Nak Eun KO, Ju Young SIM
  • Publication number: 20240133039
    Abstract: The present invention relates to a leveling agent and an electrolytic composition comprising the same. When the via hole in the substrate is filled with the electrolytic composition according to the present invention, the via hole can be filled within a relatively short time while minimizing the formation of dimples or voids.
    Type: Application
    Filed: July 29, 2022
    Publication date: April 25, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dea Geun KIM, Nak Eun KO, Ju Yong SIM
  • Publication number: 20240132441
    Abstract: The present invention relates to a leveling agent and an electrolytic composition comprising the same. When the via hole in the substrate is filled with the electrolytic composition according to the present invention, the via hole can be filled within a relatively short time while minimizing the formation of dimples or voids.
    Type: Application
    Filed: July 29, 2022
    Publication date: April 25, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dea Geun KIM, Nak Eun KO, Ju Yong SIM
  • Publication number: 20240015885
    Abstract: The present invention relates to a metal foil having a rough surface, a carrier-attached metal foil including the metal foil, and a printed circuit board manufactured using the metal foil. The rough surface is naturally formed during formation of the metal foil. The formation of the rough surface allows the metal foil to have a high adhesive strength to an insulating resin substrate and enables the manufacture of a printed circuit board with improved efficiency.
    Type: Application
    Filed: December 10, 2021
    Publication date: January 11, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dea Geun KIM, Myong Hwan PARK, Nak Eun KO, Ju Yong SIM
  • Patent number: 11475354
    Abstract: Provided is a deep learning method including a step of each of at least two or more deep learning machines learning a web traffic by using a hexadecimal; a step of the deep learning machines learning the web traffic by using an incremental learning using a weight; a step of, when the web traffic is received, each of the deep learning machines encoding a character string of the web traffic with UTF-8 hexadecimal; a step of each of the deep learning machines converting the character string into an image and deep learning the image.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: October 18, 2022
    Assignee: Cloudbric Corp
    Inventors: Seung Young Park, Tai Yun Kim, Tae Joon Jung, Eun A Ko
  • Patent number: 11285993
    Abstract: An apparatus and a method for controlling a vehicle steering system, which are capable of improving a sense of unity between driver's driving input and vehicle motion and the stability of the vehicle by estimating a side slip angle and performing return control, may include an assist torque determination module for determining assist torque for steering assist, a return control module for determining steering return torque for returning the steering wheel to a neutral position, a side slip angle estimation module for estimating a side slip angle, a side slip control module for determining a return control gain value in a response to the estimated side slip angle, a correction unit of correcting the determined steering return torque in a response to the return control gain value, and a torque compensation unit of determining final assist torque by compensating the determined assist torque with the corrected steering return torque.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: March 29, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Chan Jung Kim, Il Rae Park, Young Eun Ko
  • Patent number: 11257801
    Abstract: A stacked semiconductor package includes a first semiconductor chip having a first active surface over which first bonding pads including peripheral bonding pads and central bonding pads are arranged, a first encapsulation member, two second semiconductor chips having second active surfaces over which second bonding pads are arranged at one side peripheries and disposed to be separated from each other such that the second active surfaces face the first active surface and the second bonding pads overlap with the peripheral bonding pads, first coupling members interposed between the peripheral bonding pads and the second bonding pads, a second encapsulation member formed over second side surfaces of the second semiconductor chips including a region between the second semiconductor chips, and a mold via formed through a portion of the second encapsulation member in the region between the second semiconductor chips and coupled with the central bonding pads.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: February 22, 2022
    Assignee: SK hynix Inc.
    Inventors: Sang-Eun Lee, Hyung-Dong Lee, Eun Ko
  • Patent number: 10857119
    Abstract: The present invention relates to a composition containing a monoacetyldiglyceride compound as an active ingredient, for inhibiting blood cancer or metastasis, and a use thereof. The monoacetyldiglyceride compound according to the present invention has excellent effects of inhibiting the expression of IL-4 and inhibiting the activity of STAT-6, and thereby is capable of overcoming side effects of currently used blood cancer or metastasis inhibiting agents. Also, the monoacetyldiglyceride compound is a non-toxic compound having superior therapeutic effects and thus can be useful as a composition for preventing, treating, or improving blood cancer and metastasis.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: December 8, 2020
    Assignees: Enzychem Lifesciences Corporation, Korea Research Institute of Bio Science and Biotechnology
    Inventors: Jae Wha Kim, Sei-Ryang Oh, Kyung Seop Ahn, Ho Bum Kang, Jae Min Shin, Young Eun Ko, Tae Suk Lee, Myung Hwan Kim, Jong Koo Kang, Yong-Hae Han, Ki-Young Sohn
  • Publication number: 20200330421
    Abstract: The present invention relates to a composition containing a monoacetyldiglyceride compound as an active ingredient, for inhibiting blood cancer or metastasis, and a use thereof. The monoacetyldiglyceride compound according to the present invention has excellent effects of inhibiting the expression of IL-4 and inhibiting the activity of STAT-6, and thereby is capable of overcoming side effects of currently used blood cancer or metastasis inhibiting agents. Also, the monoacetyldiglyceride compound is a non-toxic compound having superior therapeutic effects and thus can be useful as a composition for preventing, treating, or improving blood cancer and metastasis.
    Type: Application
    Filed: May 28, 2020
    Publication date: October 22, 2020
    Applicants: Enzychem Lifesciences Corporation, Korea Research Institute of Bio Science and Biotechnology
    Inventors: Jae Wha Kim, Sei-Ryang Oh, Kyung Seop Ahn, Ho Bum Kang, Jae Min Shin, Young Eun Ko, Tae Suk Lee, Myung Hwan Kim, Jong Koo Kang, Yong-Hae Han, Ki Young Sohn
  • Patent number: 10792371
    Abstract: Provided is a conjugate including a c-Met targeting compound and a bioactive material and methods of use of the conjugate.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: October 6, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Su Young Chae, Sunghyun Kim, Eun Ko, Yun Ju Jeong, Jae Hyun Choi
  • Publication number: 20200164914
    Abstract: An apparatus and a method for controlling a vehicle steering system, which are capable of improving a sense of unity between driver's driving input and vehicle motion and the stability of the vehicle by estimating a side slip angle and performing return control, may include an assist torque determination module for determining assist torque for steering assist, a return control module for determining steering return torque for returning the steering wheel to a neutral position, a side slip angle estimation module for estimating a side slip angle, a side slip control module for determining a return control gain value in a response to the estimated side slip angle, a correction unit of correcting the determined steering return torque in a response to the return control gain value, and a torque compensation unit of determining final assist torque by compensating the determined assist torque with the corrected steering return torque.
    Type: Application
    Filed: July 31, 2019
    Publication date: May 28, 2020
    Applicant: Hyundai Motor Company
    Inventors: Chan Jung KIM, II Rae PARK, Young Eun KO
  • Publication number: 20200019880
    Abstract: Provided is a deep learning method including a step of each of at least two or more deep learning machines learning a web traffic by using a hexadecimal; a step of the deep learning machines learning the web traffic by using an incremental learning using a weight; a step of, when the web traffic is received, each of the deep learning machines encoding a character string of the web traffic with UTF-8 hexadecimal; a step of each of the deep learning machines converting the character string into an image and deep learning the image.
    Type: Application
    Filed: January 8, 2019
    Publication date: January 16, 2020
    Applicant: Cloudbric Corp
    Inventors: Seung Young Park, Tai Yun Kim, Tae Joon Jung, Eun A Ko
  • Publication number: 20190355707
    Abstract: A stacked semiconductor package includes a first semiconductor chip having a first active surface over which first bonding pads including peripheral bonding pads and central bonding pads are arranged, a first encapsulation member, two second semiconductor chips having second active surfaces over which second bonding pads are arranged at one side peripheries and disposed to be separated from each other such that the second active surfaces face the first active surface and the second bonding pads overlap with the peripheral bonding pads, first coupling members interposed between the peripheral bonding pads and the second bonding pads, a second encapsulation member formed over second side surfaces of the second semiconductor chips including a region between the second semiconductor chips, and a mold via formed through a portion of the second encapsulation member in the region between the second semiconductor chips and coupled with the central bonding pads.
    Type: Application
    Filed: August 1, 2019
    Publication date: November 21, 2019
    Applicant: SK hynix Inc.
    Inventors: Sang-Eun LEE, Hyung-Dong LEE, Eun KO
  • Patent number: 10418353
    Abstract: A stacked semiconductor package includes a first semiconductor chip having a first active surface over which first bonding pads including peripheral bonding pads and central bonding pads are arranged, a first encapsulation member, two second semiconductor chips having second active surfaces over which second bonding pads are arranged at one side peripheries and disposed to be separated from each other such that the second active surfaces face the first active surface and the second bonding pads overlap with the peripheral bonding pads, first coupling members interposed between the peripheral bonding pads and the second bonding pads, a second encapsulation member formed over second side surfaces of the second semiconductor chips including a region between the second semiconductor chips, and a mold via formed through a portion of the second encapsulation member in the region between the second semiconductor chips and coupled with the central bonding pads.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: September 17, 2019
    Assignee: SK hynix Inc.
    Inventors: Sang-Eun Lee, Hyung-Dong Lee, Eun Ko
  • Publication number: 20190022047
    Abstract: The present invention relates to a composition containing a monoacetyldiglyceride compound as an active ingredient, for inhibiting blood cancer or metastasis, and a use thereof. The monoacetyldiglyceride compound according to the present invention has excellent effects of inhibiting the expression of IL-4 and inhibiting the activity of STAT-6, and thereby is capable of overcoming side effects of currently used blood cancer or metastasis inhibiting agents. Also, the monoacetyldiglyceride compound is a non-toxic compound having superior therapeutic effects and thus can be useful as a composition for preventing, treating, or improving blood cancer and metastasis.
    Type: Application
    Filed: July 25, 2018
    Publication date: January 24, 2019
    Inventors: Jae Wha KIM, Sei-Ryang OH, Kyung Seop AHN, Ho Bum KANG, Jae Min SHIN, Young Eun KO, Tae Suk LEE, Myung Hwan KIM, Jong Koo KANG, Yong-Hae HAN, Ki-Young SOHN