Patents by Inventor Eun KO

Eun KO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130307276
    Abstract: Provided is a wind power generating apparatus including a generating tower that has a wall surface in which a plurality of through-holes for inflow of wind are formed, wind inlet walls that protrude outwardly from the respective through-holes so as to guide the inflow of wind, a generating blade that rotates by means of the wind introduced into the generating tower, a generator that generates electricity in conjunction with the rotation of the generating blade, a wind inlet port formed through the respective through-holes formed in the wall surface of the generating tower, and a wind contact member, which is connected to an end of the generating blade, which has a triangular pyramid shape with an open front surface so as to extend the area pressurized by the wind introduced through the wind inlet port, and which has a flow channel dividing member arranged across the open front surface.
    Type: Application
    Filed: January 17, 2012
    Publication date: November 21, 2013
    Inventor: Young-Eun Ko
  • Patent number: 8551687
    Abstract: The present invention relates to a polyimide photosensitive resin composition that is capable of being developed by an alkali aqueous solution, and a dry film that is produced by the same, and more particularly to a photosensitive resin composition which comprises a) a polyamic acid, b) two or more (meth)acrylate—based compounds that include one or more double bonds between carbons, c) a photopolymerization initiator, d) a phosphorus—based flame retardant, and e) an organic solvent, and a dry film that is produced by the same.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: October 8, 2013
    Assignee: LG Chem, Ltd.
    Inventors: Kwang-Joo Lee, Heon-Sik Song, You-Jin Kyung, Joo-Eun Ko, Jung-Il Yoon, Jung-Jin Shim
  • Patent number: 8426029
    Abstract: The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polymide resin layer. The polymide resin layer has a modulus of elasticity of 70 Mpa at 400° C.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: April 23, 2013
    Assignee: LG Chem, Ltd.
    Inventors: Byung-Nam Kim, Heon-Sik Song, Joo-Eun Ko, Soon-Yong Park, Jung-Jin Shim
  • Patent number: 8341109
    Abstract: A method and system using a processor for reasoning an optimized service of a ubiquitous system using context information and emotion awareness. The system using a processor for reasoning an optimized service of a ubiquitous system includes: a ubiquitous system unit to collect information about surroundings of a user; a context awareness unit to recognize a state of the user based on the information collected in the ubiquitous system unit, and to generate context information; an emotion awareness unit to recognize an emotion of the user based on the information collected in the ubiquitous system unit, and to generate emotion information; a combination unit to combine the context information and the emotion information; and a service selection unit to reason and select a service for the user based on the combination result of the combination unit.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: December 25, 2012
    Assignee: Chung-Ang University Industry-Academy Cooperation Foundation
    Inventors: Kwee-Bo Sim, Kwang-Eun Ko
  • Patent number: 8288656
    Abstract: The present invention provides a photosensitive resin composition comprising: a polyamic acid including a specific repeating unit; a heterocyclic amine compound; a (metha)acrylate-based compound including one or more double bonds between carbons; a photoinitiator; and an organic solvent, and a dry film prepared therefrom. The photosensitive resin composition can be cured at a low temperature to offer process safety and work convenience, and has excellent bending resistance, soldering heat resistance, and a property of filling the pattern, as well as excellent heat resistance and mechanical properties.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: October 16, 2012
    Assignee: LG Chem, Ltd.
    Inventors: Kwang-Joo Lee, Joo-Eun Ko, Byung-Nam Kim, Heon-Sik Song, You-Jin Kyung, Hee-Jung Kim
  • Publication number: 20120243186
    Abstract: The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polymide resin layer. The polymide resin layer has a modulus of elasticity of 70 Mpa at 400° C.
    Type: Application
    Filed: June 8, 2012
    Publication date: September 27, 2012
    Inventors: Byung-Nam KIM, Heon-Sik SONG, Joo-Eun KO, Soon-Yong PARK, Jung-Jin SHIM
  • Patent number: 8221842
    Abstract: The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polyimide resin layer. The polyimide resin layer has a modulus of elasticity of 70 Mpa at 400° C.
    Type: Grant
    Filed: March 6, 2007
    Date of Patent: July 17, 2012
    Assignee: LG Chem, Ltd.
    Inventors: Byung-Nam Kim, Heon-Sik Song, Joo-Eun Ko, Soon-Yong Park, Jung-Jin Shim
  • Publication number: 20120172039
    Abstract: A system and method for securing a lost terminal using a wireless network are provided. The system includes a lost terminal registration server to store unique terminal information of a lost terminal, and a terminal including a wireless Local Area Network (LAN) module to connect to the lost terminal registration server to determine whether the terminal is registered as a lost terminal in the lost terminal registration server. If the terminal is determined to be a lost terminal, then the lost terminal may be tracked and/or locked to secure the terminal.
    Type: Application
    Filed: September 1, 2011
    Publication date: July 5, 2012
    Applicant: Pantech Co., Ltd.
    Inventors: Soo Eun KO, Nak Jin KIM, Myong Ju KIM, Yong Pyo LEE, In Ho LEE, Jong Hwan LEE, Ho Jeong JEONG
  • Publication number: 20120012366
    Abstract: The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and that has an excellent developing property in an alkaline aqueous solution, flexibility, adhesion strength, resistance to welding heat, and pressure cooker test (PCT) resistance, and a dry film prepared from the composition.
    Type: Application
    Filed: September 23, 2011
    Publication date: January 19, 2012
    Applicant: LG CHEM, LTD.
    Inventors: Kwang-Joo LEE, You-Jin Kyung, Joo-Eun Ko, Heon-Sik Song, Jung-Jin Shim, Hee-Jung Kim
  • Patent number: 8034460
    Abstract: Disclosed herein are a metallic laminate, including (i) a metal layer and (ii) a polyimide resin layer having a coefficient of thermal expansion of 19 ppm/° C. or less and a glass transition temperature of 350° C. or more, laminated on the metal layer, and a method of manufacturing the same. According to this invention, the metallic laminate has a good external appearance, having no foam on the polyimide resin layer.
    Type: Grant
    Filed: July 18, 2006
    Date of Patent: October 11, 2011
    Assignee: LG Chem, Ltd.
    Inventors: Byung Nam Kim, Joo Eun Ko, Heon Sik Song, Byeong In Ahn
  • Publication number: 20110200939
    Abstract: The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and that has an excellent developing property in an alkaline aqueous solution, flexibility, adhesion strength, resistance to welding heat, and pressure cooker test (PCT) resistance, and a dry film prepared from the composition.
    Type: Application
    Filed: August 27, 2010
    Publication date: August 18, 2011
    Applicant: LG CHEM, LTD.
    Inventors: Kwang-Joo LEE, You-Jin KYUNG, Joo-Eun KO, Heon-Sik SONG, Jung-Jin SHIM, Hee-Jung KIM
  • Publication number: 20110067907
    Abstract: The present invention provides a photosensitive resin composition comprising: a polyamic acid including a specific repeating unit; a heterocyclic amine compound; a (metha)acrylate-based compound including one or more double bonds between carbons; a photoinitiator; and an organic solvent, and a dry film prepared therefrom. The photosensitive resin composition can be cured at a low temperature to offer process safety and work convenience, and has excellent bending resistance, soldering heat resistance, and a property of filling the pattern, as well as excellent heat resistance and mechanical properties.
    Type: Application
    Filed: August 27, 2010
    Publication date: March 24, 2011
    Applicant: LG CHEM, LTD.
    Inventors: Kwang-Joo LEE, Joo-Eun KO, Byung-Nam KIM, Heon-Sik SONG, You-Jin KYUNG, Hee-Jung KIM
  • Publication number: 20100316877
    Abstract: The present invention relates to a method for preparing polyimide having excellent heat resistance and processibility and, more particularly, to a method of preparing polyimide which has desirable mechanical strength during curing at low temperatures and excellent processibility to be used as an insulating film of a metal laminate plate or a coverlay film for print substrates or hard disks, and polyimide prepared using the same.
    Type: Application
    Filed: January 18, 2008
    Publication date: December 16, 2010
    Applicant: LG CHEM. LTD.
    Inventors: Heon-Sik Song, Kwang-Joo Lee, Joo-Eun Ko
  • Publication number: 20100228696
    Abstract: A method and system for reasoning an optimized service of a ubiquitous system using context information and emotion awareness may be provided. The system for reasoning an optimized service of a ubiquitous system, the system including: a ubiquitous system unit to collect information about surroundings of a user; a context awareness unit to recognize a state of the user based on the information collected in the ubiquitous system unit, and to generate context information; an emotion awareness unit to recognize an emotion of the user based on the information collected in the ubiquitous system unit, and to generate emotion information; a combination unit to combine the context information and the emotion information; and a service selection unit to reason and select a service for the user based on the combination result of the combination unit.
    Type: Application
    Filed: November 24, 2009
    Publication date: September 9, 2010
    Applicant: Chung-Ang University Industry-Academy Cooperation Foundation
    Inventors: Kwee-Bo SIM, Kwang-Eun KO
  • Publication number: 20100113640
    Abstract: The present invention relates to a polyimide photosensitive resin composition that is capable of being developed by an alkali aqueous solution, and a dry film that is produced by the same, and more particularly to a photosensitive resin composition which comprises a) a polyamic acid, b) two or more (meth)acrylate-based compounds that include one or more double bonds between carbons, c) a photopolymerization initiator, d) a phosphorus-based flame retardant, and e) an organic solvent, and a dry film that is produced by the same.
    Type: Application
    Filed: August 20, 2008
    Publication date: May 6, 2010
    Applicant: LG CHEM, LTD.
    Inventors: Kwang-Joo Lee, Heon-Sik Song, You-Jin Kyung, Joo-Eun Ko, Jung-Il Yoon, Jung-Jin Shim
  • Patent number: 7670774
    Abstract: Oligonucleotide probes for analyzing 40 types of HPV were synthesized, and DNA chips were produced by using the oligonucleotide probes. The synthesis of the oligonucleotide probes is based on clones of L1 and E6/E7 genes of 35 types of HPV obtained from cervical cell specimens from 4,898 Korean adult women and tissue specimens from 68 cervical cancer cases in addition to information based on American and European cases. The DNA chips can analyze the 40 types of HPV found in cervical, diagnose complex infection by at least one type of HPV, and have excellent diagnostic sensitivity and specificity on HPV genetic type up to 100% and reproducibility. Also, the DAN chips are superior to conventional analytic method, and very economical, since they can analyze numerous specimens in shortest time. Accordingly, the DNA chips are useful for predicting cervical cancer and precancerous lesion.
    Type: Grant
    Filed: March 18, 2005
    Date of Patent: March 2, 2010
    Assignee: Goodgene Inc.
    Inventors: Woo-Chul Moon, Myung-Ryurl Oh, Su-Bin Yim, Tae-Han Eum, Eun-Hae Jung, Jung-Eun Ko, Jae-Han Bae
  • Publication number: 20090101393
    Abstract: The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polyimide resin layer The polyimide resin layer has a modulus of elasticity of 70 Mpa at 400° C.
    Type: Application
    Filed: March 6, 2007
    Publication date: April 23, 2009
    Inventors: Byung-Nam Kim, Heon-Sik Song, Joo-Eun Ko, Soon-Yong Park, Jung-Jin Shim
  • Patent number: 7491447
    Abstract: The present invention relates to a double-sided metallic laminate for a printed circuit board and a method for manufacturing the same. The double-sided metallic laminate which comprises a metallic layer at one side, a resin layer of a polyimide for improving adhesion with a metal, a resin layer of a low expansion polyimide having a thermal expansion coefficient of 5×10?6 to 2.5×10?5/° C. and a metallic layer at the other side, has excellent flexibility and thermal resistance, can prevent curl and is securely laminated, particularly without the use of an adhesive. Therefore, it is suitable for a printed circuit board of a small size electric appliance.
    Type: Grant
    Filed: March 25, 2004
    Date of Patent: February 17, 2009
    Assignee: LG Chem, Ltd.
    Inventors: Soon-yong Park, You-jin Kyung, Heon-sik Song, Byeong-in Ahn, Joo-eun Ko, Yong-jun Park, Se-myung Jang
  • Publication number: 20070248968
    Abstract: Oligonucleotide probes for analyzing 40 types of HPV were synthesized, and DNA chips were produced by using the oligonucleotide probes. The synthesis of the oligonucleotide probes is based on clones of L1 and E6/E7 genes of 35 types of HPV obtained from cervical cell specimens from 4,898 Korean adult women and tissue specimens from 68 cervical cancer cases in addition to information based on American and European cases. The DNA chips can analyze the 40 types of HPV found in cervical, diagnose complex infection by at least one type of HPV, and have excellent diagnostic sensitivity and specificity on HPV genetic type up to 100% and reproducibility. Also, the DAN chips are superior to conventional analytic method, and very economical, since they can analyze numerous specimens in shortest time. Accordingly, the DNA chips are useful for predicting cervical cancer and precancerous lesion.
    Type: Application
    Filed: March 18, 2005
    Publication date: October 25, 2007
    Applicant: Goodgene Inc.
    Inventors: Woo-Chul Moon, Myung-Ryurl Oh, Su-Bin Yim, Tae-Han Eum, Eun-Hae Jung, Jung-Eun Ko, Jae-Han Bae
  • Publication number: 20070042202
    Abstract: The present invention relates to a double-sided metallic laminate for a printed circuit board and a method for manufacturing the same. The double-sided metallic laminate which comprises a metallic layer at one side, a resin layer of a polyimide for improving adhesion with a metal, a resin layer of a low expansion polyimide having a thermal expansion coefficient of 5×10-6 to 2.5×10-5/iÉ and a metallic layer at the other side, has excellent flexibility and thermal resistance, can prevent curl and is securely laminated, particularly without the use of an adhesive. Therefore, it is suitable for a printed circuit board of a small size electric appliance.
    Type: Application
    Filed: March 25, 2004
    Publication date: February 22, 2007
    Applicant: LG CHEM, LTD.
    Inventors: Soon-yong Park, You-jin Kyung, Heon-sik Song, Byeong-in Ahn, Joo-eun Ko, Yong-jun Park, Se-myung Jang