Abstract: A nonvolatile memory (NVM) device includes a plurality of memory blocks and a control logic receiving a specific command and an address. The control logic may perform a cell count-based dynamic read (CDR) operation on memory cells connected to one of wordlines of a selected block, among the plurality of memory blocks, in response to the address. The control logic includes a cell count comparator circuit configured to compare: (1) a first cell count value for a highest state among a plurality of states with at least one reference value according to the CDR operation and (2) a second cell count value for an erase state among the plurality of states with the at least one reference value. Additionally, the control logic includes a read level selector configured to select a read level according to a result of the comparison of the cell count comparator circuit.

Abstract: Provided is a memory device including a plurality of memory blocks including of at least one subblock, wherein the memory block includes a first subblock configured to store first data including of at least one bit, and a second subblock configured to perform an erase operation independently of the first subblock and store second data including of at least one bit. The memory device is configured to perform a read operation on the second data in response to a write operation being performed on the second data in the second subblock. The memory device is configured to perform a write operation on the first data in the first subblock in response to a read operation being performed on the second data in the second subblock.

Abstract: A nonvolatile memory (NVM) device includes a plurality of memory blocks and a control logic receiving a specific command and an address. The control logic may perform a cell count-based dynamic read (CDR) operation on memory cells connected to one of wordlines of a selected block, among the plurality of memory blocks, in response to the address. The control logic includes a cell count comparator circuit configured to compare: (1) a first cell count value for a highest state among a plurality of states with at least one reference value according to the CDR operation and (2) a second cell count value for an erase state among the plurality of states with the at least one reference value. Additionally, the control logic includes a read level selector configured to select a read level according to a result of the comparison of the cell count comparator circuit.

Abstract: A storage device may include a memory device, a storage controller, log likelihood ratio (LLR) optimization circuit, and an LLR set register configured to a store a symmetric LLR set and an asymmetric LLR set. The memory device may include first memory cells of a first memory page connected to a target wordline. The LLR optimization circuit may be configured to generate a first readout error index for data stored in the first memory cells. The storage controller may be configured to select one of the symmetric LLR set and the asymmetric LLR set based on the first readout error index. The storage controller may include a decoder configured to perform error correction code (ECC) decoding by applying LLR values of the LLR set selected by the LLR set selection circuit to data read from the first memory cells.

Abstract: A storage device is provided. The storage device includes: a nonvolatile memory device including a memory cell array, the memory cell array having a user area and a power loss protection (PLP) area; and a storage controller configured to, based on sudden power-off being detected, write first PLP data in a first memory cell connected to a first word line of the PLP area and write second PLP data in a second memory cell connected to a second word line of the PLP area. A first write energy of the first memory cell is less than a second write energy of the second memory cell.

Abstract: A storage device includes at least one non-volatile memory including a plurality of blocks, each block of the plurality of blocks including a plurality of independently erasable sub-blocks. The storage device further includes a storage controller configured to select an erase mode from among a plurality of erase modes according to at least one of an operation schedule and a power consumption of the non-volatile memory, and control an erase operation of the non-volatile memory, according to the selected erase mode. Based on the selected erase mode being a first sub-block erase mode, the storage controller controls an erase operation with respect to one selected sub-block of a selected block. Based on the selected erase mode being a second sub-block erase mode, the storage controller controls an erase operation with respect to two or more selected sub-blocks of the selected block.

Abstract: A non-volatile memory device includes a substrate, a stack structure that includes a first gate layer that extends in a horizontal direction and a second gate layer that extends in the horizontal direction and is disposed apart from the first gate layer in a vertical direction, a plurality of first channel structures that penetrate in the vertical direction through a first channel region of the stack structure, a plurality of second channel structures that penetrate in the vertical direction through a second channel region of the stack structure, a first anti-fuse structure and a second anti-fuse structure that each penetrate in the vertical direction through an anti-fuse region of the stack structure, a first anti-fuse transistor that is electrically connected to the first gate layer through the first anti-fuse structure, and a second anti-fuse transistor that is electrically connected to the second gate layer through the second anti-fuse structure.

Abstract: A storage device including a nonvolatile memory device and a memory controller and an operating method of the storage device are provided. The nonvolatile memory device includes a plurality of memory areas each including one or more memory cells, one or more temperature sensors configured to generate first temperature information by measuring at least one temperature of at least one memory area from among the plurality of memory areas periodically between a first time point and a second time point, and a buffer configured to store the first temperature information.

Abstract: Provided is a three-dimensional storage device using wafer-to-wafer bonding. A storage device includes a first chip including a first substrate and a peripheral circuit region including a first control logic circuit configured to control operation modes of the non-volatile memory device and a second chip including a second substrate and three-dimensional arrays of non-volatile memory cells. The second chip may be vertically stacked on the first chip so that a first surface of the first substrate faces a first surface of the second substrate, and a second control logic circuit is configured to control operation conditions of the non-volatile memory device and is arranged on a second surface of the second substrate, the second surface of the second substrate being opposite to the first surface of the second substrate of the second chip.

Abstract: Provided is a semiconductor device. The semiconductor device includes: a plurality of insulating layers and a plurality of gate electrodes alternately arranged in a first direction; and a plurality of channel structures passing through the plurality of gate electrodes and the plurality of insulating layers in the first direction, wherein each of the plurality of gate electrodes includes: a first conductive layer including an inner wall surrounding the plurality of channel structures; and a second conductive layer that is separated from the plurality of channel structures in a second direction perpendicular to the first direction, wherein resistivity of the second conductive layer is less than resistivity of the first conductive layer.

Abstract: A storage device includes at least one non-volatile memory including a plurality of blocks, each block of the plurality of blocks including a plurality of independently erasable sub-blocks. The storage device further includes a storage controller configured to select an erase mode from among a plurality of erase modes according to at least one of an operation schedule and a power consumption of the non-volatile memory, and control an erase operation of the non-volatile memory, according to the selected erase mode. Based on the selected erase mode being a first sub-block erase mode, the storage controller controls an erase operation with respect to one selected sub-block of a selected block. Based on the selected erase mode being a second sub-block erase mode, the storage controller controls an erase operation with respect to two or more selected sub-blocks of the selected block.

Abstract: An example program method of a non-volatile memory device comprises receiving a write request of multi-page data from a host, comparing an available memory capacity of a digest memory with a threshold, setting a write mode of the non-volatile memory device to a pre-program operation mode based on the available memory capacity being greater than or equal to the threshold, and programming the multi-page data into a pre-program block of the non-volatile memory device.

Abstract: A non-volatile memory device is provided. The non-volatile memory device includes: sub-blocks provided on a substrate. The sub-blocks include: a first sub-block connected to a first word line group including a first number of word lines; and a second sub-block connected to a second word line group including a second number of word lines. The first sub-block includes: at least one first memory cell storing M-bit data; and second memory cells each storing N-bit data. The second sub-block includes: at least one third memory cell storing K-bit data; and fourth memory cells each storing L-bit data. M, N, K, and L are positive integers, N is greater than M, and L is greater than K. The first number and the second number are different, and the at least one first memory cell and the at least one third memory cell include different numbers of memory cells.

Abstract: A non-volatile memory device includes a substrate, a stack structure that includes a first gate layer that extends in a horizontal direction and a second gate layer that extends in the horizontal direction and is disposed apart from the first gate layer in a vertical direction, a plurality of first channel structures that penetrate in the vertical direction through a first channel region of the stack structure, a plurality of second channel structures that penetrate in the vertical direction through a second channel region of the stack structure, a first anti-fuse structure and a second anti-fuse structure that each penetrate in the vertical direction through an anti-fuse region of the stack structure, a first anti-fuse transistor that is electrically connected to the first gate layer through the first anti-fuse structure, and a second anti-fuse transistor that is electrically connected to the second gate layer through the second anti-fuse structure.

Abstract: A memory device includes a plurality of sub-blocks having different sizes and arranged in a vertical direction above a substrate, wherein a first sub-block and a second sub-block among the plurality of sub-blocks each includes a normal region and a reserved region configured to store data after at least some pieces of data stored in the normal region are invalidated, a third sub-block among the plurality of sub-blocks has a smallest size among the different sizes, and a size of the normal region of each of the first sub-block and the second sub-block is equal to or less than the size of the third sub-block.

Abstract: A storage device, including a nonvolatile memory device and a storage controller configured to control the nonvolatile memory device. The nonvolatile memory device includes a memory cell array including a plurality of word-lines stacked on a substrate, a plurality of memory cells provided in a plurality of channel holes, and a word-line cut region dividing the plurality of word-lines into a plurality of memory blocks. The storage controller groups a plurality of target memory cells into outer cells and inner cells. The storage controller includes an error correction code (ECC) decoder configured to perform an ECC decoding operation by obtaining outer cell bits and inner cell bits during a read operation on the plurality of target memory cells, and applying different log likelihood ratio (LLR) values to the outer cell bits and the inner cell bits.

Abstract: A method of operating a memory system includes programming, in a memory device, K logical pages stored in a page buffer circuit into a memory cell array, reading, from the memory device, the K logical pages programmed into the memory cell array into the page buffer circuit after a first delay time elapses, transmitting, in a memory controller, N?K logical pages to the memory device, and programming, in the memory device, N logical pages into the memory cell array based on the read K logical pages and the N?K logical pages, wherein K is a positive integer and N is a positive integer greater than K.

Abstract: A storage device includes a nonvolatile memory device including a memory cell array and a storage controller to control the nonvolatile memory device. The memory cell array includes word-lines, memory cells and word-line cut regions dividing the word-lines into memory blocks. The storage controller includes an error correction code (ECC) engine including an ECC encoder and a memory interface. The ECC encoder performs a first ECC encoding operation on each of sub data units in user data to generate parity bits and generate a plurality of ECC sectors, selects outer cell bits to be stored in outer cells to constitute an outer ECC sector including the outer cell bits and performs a second ECC encoding operation on the outer ECC sector to generate outer parity bits. The memory interface transmits, to the nonvolatile memory device, a codeword set including the ECC sectors and the outer parity bits.

Abstract: The present disclosure provides storage devices and methods for operating the same. In some embodiments, a storage device includes a non-volatile memory including a plurality of sub-blocks that are independently erasable, and a processor configured to control a garbage collection operation on the plurality of sub-blocks. The plurality of sub-blocks includes a plurality of first sub-blocks that have a first block size and a plurality of second sub-blocks that have a second block size. The second block size is different from the first block size. The processor is further configured to select a victim sub-block with a lowest ratio of a valid page count to an invalid page count from among the plurality of sub-blocks, and copy a valid page of the victim sub-block to a target sub-block from among the plurality of sub-blocks.

Abstract: A storage device, including a nonvolatile memory device and a storage controller configured to control the nonvolatile memory device. The nonvolatile memory device includes a memory cell array including a plurality of word-lines stacked on a substrate, a plurality of memory cells provided in a plurality of channel holes, and a word-line cut region dividing the plurality of word-lines into a plurality of memory blocks. The storage controller groups a plurality of target memory cells into outer cells and inner cells. The storage controller includes an error correction code (ECC) decoder configured to perform an ECC decoding operation by obtaining outer cell bits and inner cell bits during a read operation on the plurality of target memory cells, and applying different log likelihood ratio (LLR) values to the outer cell bits and the inner cell bits.