Patents by Inventor Fa Wang

Fa Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8040690
    Abstract: An inner-connecting structure of a lead frame. The lead frame includes a metal frame having a plurality of leads. The inner-connecting structure of the lead frame includes an insulation film arranged on some of those leads, covering a portion of a first surface of the lead; a plurality of holes formed on the insulation film to expose some of those leads, wherein the hole exposes a portion of the first surface of the lead; and a conductive element selectively connecting the exposed portion of those leads electrically. Besides, an inner-connecting method of the lead frame is also disclosed herein. The insulation film is utilized to separate the conductive element from the lead frame so that the leads can be easily interconnected with each other.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: October 18, 2011
    Assignee: Powertech Technology Inc.
    Inventor: Chin-Fa Wang
  • Publication number: 20110215454
    Abstract: A Chip-On-Lead (COL) type semiconductor package having small chip hidden between leads is revealed. The lower surfaces of the leadframe's leads are attached to a wiring substrate and the leads are horizontally bent to form a die-holding cavity. A smaller chip is disposed on the wiring substrate by passing through the die-holding cavity to be on the same disposing level with the leads. At least a larger chip is disposed on the leads to overlap the smaller chip so that the small chip does not extrude from the leads. The encapsulant encapsulates a plurality of internal parts of the leads, the wiring substrate, and the larger chip. Therefore, the conventional unbalance issue of mold flow above and below the leads leading to cause excessive warpage can be avoided and numbers of stacked larger chips can be increased to have larger memory capacities.
    Type: Application
    Filed: March 8, 2010
    Publication date: September 8, 2011
    Inventor: Chin-Fa Wang
  • Publication number: 20110121561
    Abstract: A pipe connector has a main body, a sleeve and elastic claws. The reducing flanged pipe of the main body is linked to several guiding lugs with a guiding surface. Several inclined pushing discs are formed on the inner wall of the sleeve and abutted with the guiding lugs. A radiative swinging baseline facing the inner wall of the sleeve is formed at the center of the main body. With the lowering force applied to the sleeve, the guiding lug can be elastically accumulated to swing inwards or outwards on the swinging baseline under the guidance of the inclined pushing disc. When the force applied by the user is released, the sleeve will be resumed to move up with the resetting of the guiding lug. The pipe connector of the present invention is characterized by simple construction and more stable guidance with improved applicability and industrial benefits.
    Type: Application
    Filed: November 21, 2009
    Publication date: May 26, 2011
    Applicant: WININ ENTERPRISE Co., Ltd.
    Inventor: Hsin-Fa WANG
  • Publication number: 20110122137
    Abstract: A video summarized method based on mining the story structure and semantic relations among concept entities has steps of processing a video to generate multiple important shots that are annotated with respective keywords: Performing a concept expansion process by using the keywords to create expansion trees for the annotated shots; rearranging the keywords of the expansion trees and classifying to calculate relations thereof; applying a graph entropy algorithm to determine significant shots and edges interconnected with the shots. Based on the determined result of the graph entropy algorithm, a structured relational graph is built to display the significant shots and edges thereof. Consequently, users can more rapidly browse the content of a video and comprehend if different shots are related.
    Type: Application
    Filed: November 23, 2009
    Publication date: May 26, 2011
    Applicant: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Jhing-Fa WANG, Bo-Wei CHEN, Jia-Ching WANG, Chia-Hung CHANG
  • Patent number: 7931225
    Abstract: The present invention provides a water hose winding device. The winding device main body includes a water hose winding rack, a water inlet adapter, a water hose exit guide hole, a driving motor, and a gearing component. The water outlet end of the water hose is configured with a wireless winding control mechanism, which includes a radio signal transmitter and a control switch. The winding device main body is configured with a radio signal receiver to receive the wireless control signal transmitted by the radio signal transmitter, and the driving end radio signal receiver is electrically connected to the driving motor. When the driving end radio signal receiver receives the wireless control signal, it can start or shut off the driving motor.
    Type: Grant
    Filed: May 20, 2009
    Date of Patent: April 26, 2011
    Inventor: Hsin-Fa Wang
  • Publication number: 20110064418
    Abstract: A transceiver includes a lead-frame, a signal emitter, a signal receiver, and a coupling lens. The signal emitter and the signal receiver are attached on a same pad of the lead-frame. The coupling lens covers the signal emitter and the signal receiver. Since the positions of the signal emitter and the signal receiver are adjacent to each other, the coupling lens can be used to couple the signal emitter and the signal receiver for transmitting and receiving signals.
    Type: Application
    Filed: September 16, 2009
    Publication date: March 17, 2011
    Applicant: LITE-ON SINGAPORE PTE. LTD.
    Inventors: You-Fa WANG, Yun XU
  • Patent number: 7884472
    Abstract: A semiconductor package with a substrate ID code and its manufacturing method are revealed. A circuit and a solder mask are formed on the bottom surface of a substrate where the solder mask covers most of the circuit and a circuit-free zone of the substrate. A chip is disposed on the top surface of the substrate. A substrate ID code consisting of a plurality of laser marks is inscribed in the solder mask or in a portion of an encapsulant on the bottom surface away from the circuit to show the substrate lot number on the bottom surface. Therefore, quality control and failure tracking and management can easily be implemented by tracking the substrate ID code from the semiconductor package without changing the appearance of the semiconductor package. Furthermore, the substrate ID code can be implemented by the existing laser imprinting machines for semiconductor packaging processes and be formed at the same time of formation of a product code.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: February 8, 2011
    Assignee: Powertech Technology Inc.
    Inventors: Chin-Ti Chen, Ching-Wei Hung, Bing-Shun Yu, Chin-Fa Wang
  • Patent number: 7841545
    Abstract: The present invention provides an impingement sprinkler with adjustable outflow angle. The invention includes a main body, at a lower side of which there is an inflow tube coupling end, and at upper side of which there is an upper frame. An outlet coupling portion is arranged at the lower flange close to the upper frame. A rotating member is arranged onto the upper frame of the main body; and an adjustable outflow head is assembled onto the outlet coupling portion of the main body, allowing the outflow angle to be freely adjusted. It is possible to adjust freely the sprinkling angle with the adjustable outflow head.
    Type: Grant
    Filed: November 25, 2008
    Date of Patent: November 30, 2010
    Inventor: Hsin-Fa Wang
  • Publication number: 20100295292
    Abstract: The present invention provides a water hose connector, having a main body, elastic snapper seat, and a sleeve and pipe locking ring. Several oblique guide blocks are prefabricated onto the reducing flanged tube of the main body and are provided with an oblique guide surface. Snapped limit portions are formed transversely inwards at the bottom of the oblique guide blocks. The elastic snapper seat contains a C-shaped chassis and several elastic claws arranged at intervals. The C-shaped chassis is abutted on the flanged ring of the reducing flanged tube, and locked securely onto the snapped limit portion at the bottom of the oblique guide block. Elastic pushers are prefabricated onto inner wall of the sleeve and aligned with the oblique guide blocks.
    Type: Application
    Filed: May 22, 2009
    Publication date: November 25, 2010
    Inventor: Hsin-Fa WANG
  • Publication number: 20100294872
    Abstract: The present invention provides a water hose winding device. The winding device main body includes a water hose winding rack, a water inlet adapter, a water hose exit guide hole, a driving motor, and a gearing component. The water outlet end of the water hose is configured with a wireless winding control mechanism, which includes a radio signal transmitter and a control switch. The winding device main body is configured with a radio signal receiver to receive the wireless control signal transmitted by the radio signal transmitter, and the driving end radio signal receiver is electrically connected to the driving motor. When the driving end radio signal receiver receives the wireless control signal, it can start or shut off the driving motor.
    Type: Application
    Filed: May 20, 2009
    Publication date: November 25, 2010
    Inventor: Hsin-Fa Wang
  • Patent number: 7812430
    Abstract: A lead frame with downset baffle paddles and a semiconductor package utilizing the same are revealed. The lead frame primarily comprises a plurality of leads formed on a first plane, a baffle paddle formed on a second plane in parallel, and an internal tie bar formed between the first plane and the second plane. The internal tie bar has at least two or more windings such as ā€œSā€ shaped to flexibly connect the baffle paddle to an adjacent one of the leads. Therefore, the internal tie bar can reduce the shifting and twisting of the connected lead during the formation of the downset of the baffle paddle.
    Type: Grant
    Filed: March 4, 2008
    Date of Patent: October 12, 2010
    Assignee: Powertech Technology Inc.
    Inventors: Chin-Fa Wang, Wan-Jung Hsieh, Yu-Mei Hsu
  • Publication number: 20100257564
    Abstract: A TV program information management method has steps of creating a channel information table, receiving and updating channel program information, generating arranged channel information and receiving download request. A management platform generates an arranged channel information according to the channel information table and the updating channel program information. The arranged channel information is hierarchical information related to cable providers, grouped channels by similarity that are provided by the cable providers, programs of the channels and ratings of the programs. A remote control downloads the arranged channel information therein so a desired program may be selected easily.
    Type: Application
    Filed: May 26, 2009
    Publication date: October 7, 2010
    Inventor: CHIEN-FA WANG
  • Patent number: 7774203
    Abstract: The present invention discloses an audio signal segmentation algorithm comprising the following steps. First, an audio signal is provided. Then, an audio activity detection (AAD) step is applied to divide the audio signal into at least one noise segment and at least one noisy audio segment. Then, an audio feature extraction step is used on the noisy audio segment to obtain multiple audio features. Then, a smoothing step is applied. Then, multiple speech frames and multiple music frames are discriminated. The speech frames and the music frames compose at least one speech segment and at least one music segment. Finally, the speech segment and the music segment are segmented from the noisy audio segment.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: August 10, 2010
    Assignee: National Cheng Kung University
    Inventors: Jhing-Fa Wang, Chao-Ching Huang, Dian-Jia Wu
  • Publication number: 20100127098
    Abstract: The present invention provides an impingement sprinkler with adjustable outflow angle. The invention includes a main body, at a lower side of which there is an inflow tube coupling end, and at upper side of which there is an upper frame. An outlet coupling portion is arranged at the lower flange close to the upper frame. A rotating member is arranged onto the upper frame of the main body; and an adjustable outflow head is assembled onto the outlet coupling portion of the main body, allowing the outflow angle to be freely adjusted. It is possible to adjust freely the sprinkling angle with the adjustable outflow head.
    Type: Application
    Filed: November 25, 2008
    Publication date: May 27, 2010
    Applicant: Cheng-An WANG
    Inventor: Hsin-Fa WANG
  • Publication number: 20100110654
    Abstract: An inner-connecting structure of the lead frame is disclosed in the present invention, which includes a plurality of leads, an insulation film arranged on a portion of a first surface of those leads, a plurality of holes formed on the insulation film to expose a portion of the first surface of a portion of those leads, and a conductive element selectively connecting the exposed portion of those leads electrically. Besides, an inner-connecting method of the lead frame is also disclosed herein. The insulation film is utilized to separate the conductive element from the lead frame so that the lead can be easily interconnected with each other.
    Type: Application
    Filed: December 22, 2008
    Publication date: May 6, 2010
    Inventor: Chin-Fa WANG
  • Patent number: 7707032
    Abstract: A method and system used to determine the similarity between an input speech data and a sample speech data is provided. First, the input speech data is segmented into a plurality of input speech frames and the sample speech data is segmented into a plurality of sample speech frames. Then, the input speech frames and the sample speech frames are used to build a matching matrix, wherein the matching matrix comprises the distance values between each of the input speech frames and each of the sample speech frames. Next, the distance values are used to calculate a matching score. Finally, the similarity between the input speech data and the sample speech data is determined according to this matching score.
    Type: Grant
    Filed: October 20, 2005
    Date of Patent: April 27, 2010
    Assignee: National Cheng Kung University
    Inventors: Jhing-Fa Wang, Po-Chuan Lin, Li-Chang Wen
  • Publication number: 20100043606
    Abstract: The present invention provides a handheld tool having a handle, extended into a 3D profile. There is a palm through-hole, being arranged at both sides of the handle and penetrating the handle. The long-shaped palm through-hole is consistent with the long handle, and the pore shape and aperture of the palm through-hole must be suitable for the penetration of a palm. Two first web ribs are formed at two opposite sides of the shorter section of the palm through-hole. The two first web ribs are intended for abutting with the first web of hand. A convex working end is arranged at an extended end of the handle. With this handheld tool, the user can fetch and operate other tools easily while holding this handheld tool, thereby realizing convenient operation with improved applicability.
    Type: Application
    Filed: September 7, 2008
    Publication date: February 25, 2010
    Inventor: Hsin-Fa WANG
  • Publication number: 20090302443
    Abstract: A leadframe-based semiconductor package and a leadframe for the package are revealed. The semiconductor package primarily includes parts of the leadframe including one or more first leads, one or more second leads, and a supporting bar disposed between the first leads and the second leads and further includes a chip attached to the first leads, the second leads and the supporting bar, a plurality of bonding wires and an encapsulant. The supporting bar has an extended portion projecting from the first bonding finger and the second bonding finger and connected to a non-lead side of the encapsulant wherein the extended portion has an arched bend to absorb the pulling stresses and to block stress transmission. Cracks caused by delamination of the supporting bar will not be created during trimming the supporting bar along the non-lead side of the encapsulant. Moisture penetration along the cracks of the supporting bar to the die- bonding plane under the chip is desirably prevented.
    Type: Application
    Filed: June 5, 2008
    Publication date: December 10, 2009
    Inventors: Chin-Fa Wang, Wan-Jung Hsieh, Yu-Mei Hsu
  • Publication number: 20090303748
    Abstract: A light guide device and a backlight module. The backlight module comprises a light guide device and a plurality of light sources. The light guide device comprises a housing, comprising a frame around the housing; and a light guide plate, integrated inside the frame and comprising a light-emitting surface on one side of the light guide plate inside the frame and a light-receiving surface on one edge of the light guide plate, wherein a plurality of slots are disposed between the light guide plate and the frame and on other edges different from the edge whereon the light-receiving surface is disposed, and each of a plurality of barriers is disposed on an inner side of the light guide plate while being adjacent to one of the plurality of slots. The barriers are capable of reflecting the light traveling toward the frame back to the backlight module to improve the light efficiency.
    Type: Application
    Filed: May 22, 2009
    Publication date: December 10, 2009
    Applicant: WINTEK CORPORATION
    Inventors: MING-CHUAN LIN, KUANG-MIN WU, CHIU-CHIH FU, HSING-FA WANG, SHIH-CHENG WANG, TSUNG-YI LIN
  • Patent number: 7619307
    Abstract: A leadframe-based semiconductor package and a leadframe for the package are revealed. The semiconductor package primarily includes parts of the leadframe including one or more first leads, one or more second leads, and a supporting bar disposed between the first leads and the second leads and further includes a chip attached to the first leads, the second leads and the supporting bar, a plurality of bonding wires and an encapsulant. The supporting bar has an extended portion projecting from the first bonding finger and the second bonding finger and connected to a non-lead side of the encapsulant wherein the extended portion has an arched bend to absorb the pulling stresses and to block stress transmission. Cracks caused by delamination of the supporting bar will not be created during trimming the supporting bar along the non-lead side of the encapsulant. Moisture penetration along the cracks of the supporting bar to the die-bonding plane under the chip is desirably prevented.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: November 17, 2009
    Assignee: Powertech Technology Inc.
    Inventors: Chin-Fa Wang, Wan-Jung Hsieh, Yu-Mei Hsu