Abstract: A lead frame with downset baffle paddles and a semiconductor package utilizing the same are revealed. The lead frame primarily comprises a plurality of leads formed on a first plane, a baffle paddle formed on a second plane in parallel, and an internal tie bar formed between the first plane and the second plane. The internal tie bar has at least two or more windings such as “S” shaped to flexibly connect the baffle paddle to an adjacent one of the leads. Therefore, the internal tie bar can reduce the shifting and twisting of the connected lead during the formation of the downset of the baffle paddle.

Abstract: A TV program information management method has steps of creating a channel information table, receiving and updating channel program information, generating arranged channel information and receiving download request. A management platform generates an arranged channel information according to the channel information table and the updating channel program information. The arranged channel information is hierarchical information related to cable providers, grouped channels by similarity that are provided by the cable providers, programs of the channels and ratings of the programs. A remote control downloads the arranged channel information therein so a desired program may be selected easily.

Abstract: The present invention discloses an audio signal segmentation algorithm comprising the following steps. First, an audio signal is provided. Then, an audio activity detection (AAD) step is applied to divide the audio signal into at least one noise segment and at least one noisy audio segment. Then, an audio feature extraction step is used on the noisy audio segment to obtain multiple audio features. Then, a smoothing step is applied. Then, multiple speech frames and multiple music frames are discriminated. The speech frames and the music frames compose at least one speech segment and at least one music segment. Finally, the speech segment and the music segment are segmented from the noisy audio segment.

Abstract: The present invention provides an impingement sprinkler with adjustable outflow angle. The invention includes a main body, at a lower side of which there is an inflow tube coupling end, and at upper side of which there is an upper frame. An outlet coupling portion is arranged at the lower flange close to the upper frame. A rotating member is arranged onto the upper frame of the main body; and an adjustable outflow head is assembled onto the outlet coupling portion of the main body, allowing the outflow angle to be freely adjusted. It is possible to adjust freely the sprinkling angle with the adjustable outflow head.

Abstract: An inner-connecting structure of the lead frame is disclosed in the present invention, which includes a plurality of leads, an insulation film arranged on a portion of a first surface of those leads, a plurality of holes formed on the insulation film to expose a portion of the first surface of a portion of those leads, and a conductive element selectively connecting the exposed portion of those leads electrically. Besides, an inner-connecting method of the lead frame is also disclosed herein. The insulation film is utilized to separate the conductive element from the lead frame so that the lead can be easily interconnected with each other.

Abstract: A method and system used to determine the similarity between an input speech data and a sample speech data is provided. First, the input speech data is segmented into a plurality of input speech frames and the sample speech data is segmented into a plurality of sample speech frames. Then, the input speech frames and the sample speech frames are used to build a matching matrix, wherein the matching matrix comprises the distance values between each of the input speech frames and each of the sample speech frames. Next, the distance values are used to calculate a matching score. Finally, the similarity between the input speech data and the sample speech data is determined according to this matching score.

Abstract: The present invention provides a handheld tool having a handle, extended into a 3D profile. There is a palm through-hole, being arranged at both sides of the handle and penetrating the handle. The long-shaped palm through-hole is consistent with the long handle, and the pore shape and aperture of the palm through-hole must be suitable for the penetration of a palm. Two first web ribs are formed at two opposite sides of the shorter section of the palm through-hole. The two first web ribs are intended for abutting with the first web of hand. A convex working end is arranged at an extended end of the handle. With this handheld tool, the user can fetch and operate other tools easily while holding this handheld tool, thereby realizing convenient operation with improved applicability.

Abstract: A leadframe-based semiconductor package and a leadframe for the package are revealed. The semiconductor package primarily includes parts of the leadframe including one or more first leads, one or more second leads, and a supporting bar disposed between the first leads and the second leads and further includes a chip attached to the first leads, the second leads and the supporting bar, a plurality of bonding wires and an encapsulant. The supporting bar has an extended portion projecting from the first bonding finger and the second bonding finger and connected to a non-lead side of the encapsulant wherein the extended portion has an arched bend to absorb the pulling stresses and to block stress transmission. Cracks caused by delamination of the supporting bar will not be created during trimming the supporting bar along the non-lead side of the encapsulant. Moisture penetration along the cracks of the supporting bar to the die- bonding plane under the chip is desirably prevented.

Abstract: A light guide device and a backlight module. The backlight module comprises a light guide device and a plurality of light sources. The light guide device comprises a housing, comprising a frame around the housing; and a light guide plate, integrated inside the frame and comprising a light-emitting surface on one side of the light guide plate inside the frame and a light-receiving surface on one edge of the light guide plate, wherein a plurality of slots are disposed between the light guide plate and the frame and on other edges different from the edge whereon the light-receiving surface is disposed, and each of a plurality of barriers is disposed on an inner side of the light guide plate while being adjacent to one of the plurality of slots. The barriers are capable of reflecting the light traveling toward the frame back to the backlight module to improve the light efficiency.

Abstract: A leadframe-based semiconductor package and a leadframe for the package are revealed. The semiconductor package primarily includes parts of the leadframe including one or more first leads, one or more second leads, and a supporting bar disposed between the first leads and the second leads and further includes a chip attached to the first leads, the second leads and the supporting bar, a plurality of bonding wires and an encapsulant. The supporting bar has an extended portion projecting from the first bonding finger and the second bonding finger and connected to a non-lead side of the encapsulant wherein the extended portion has an arched bend to absorb the pulling stresses and to block stress transmission. Cracks caused by delamination of the supporting bar will not be created during trimming the supporting bar along the non-lead side of the encapsulant. Moisture penetration along the cracks of the supporting bar to the die-bonding plane under the chip is desirably prevented.

Abstract: The present invention discloses a video summarization system and the method thereof. A similarity computing apparatus computes the similarity between each frame to obtain multiple similarity values. A key frame extracting apparatus chooses the key frames from the frames wherein the sum of the similarity values between the key frames is a minimum. A feature space mapping apparatus converts the sentences into multiple corresponding sentence vectors and computes the distance between each sentence vector to obtain multiple distance values. A clustering apparatus divides the sentences into multiple clusters according to the distance values and the importance of the sentences, and also applies a splitting step to split the cluster with the highest importance into multiple new clusters. A key sentence extracting apparatus chooses multiple key sentence from the clusters, wherein the sum of the importance of the key sentences is the maximum.

Abstract: A chip mounting device includes at least one chip mounting unit and at least one side rail configured beside the chip mounting unit. The chip mounting unit includes a die pad and a plurality of conductive contacts. The side rail includes at least one identifying element. A chip package array with the above-mentioned chip mounting device is also disclosed. The chip mounting device and chip package array includes the identifying element configured on the side rail to improve the identification of semi-finished packaged chips during chip package process to be read automatically by machines instead of operators, and further decrease the loss caused by misjudgments of operators.

Abstract: A Chip-On-Lead (COL) semiconductor package is revealed, primarily comprising a plurality of leadframe's leads each having a carrying bar, a finger and a connecting portion connecting the carrying bar to the finger. A chip has a back surface attached to the carrying bars and is electrically connected to the fingers by a plurality of bonding wires. Therein, at least one of the bonding wires overpasses one of the connecting portions without electrical relationship. An insulation tape is attached onto the connecting portions in a manner to be formed between the overpassing section of the bonding wire and the overpast connecting portion so that electrical short can be avoided during wire-bonding processes of the COL semiconductor package. Therefore, the carrying bars under the chip have more flexibility in the layout design of COL semiconductor packages to use die pad(s) with smaller dimensions or even eliminate die pad.

Abstract: A semiconductor package with a substrate ID code and its manufacturing method are revealed. A circuit and a solder mask are formed on the bottom surface of a substrate where the solder mask covers most of the circuit and a circuit-free zone of the substrate. A chip is disposed on the top surface of the substrate. A substrate ID code consisting of a plurality of laser marks is inscribed in the solder mask or in a portion of an encapsulant on the bottom surface away from the circuit to show the substrate lot number on the bottom surface. Therefore, quality control and failure tracking and management can easily be implemented by tracking the substrate ID code from the semiconductor package without changing the appearance of the semiconductor package. Furthermore, the substrate ID code can be implemented by the existing laser imprinting machines for semiconductor packaging processes and be formed at the same time of formation of a product code.

Abstract: A lead frame with downset baffle paddles and a semiconductor package utilizing the same are revealed. The lead frame primarily comprises a plurality of leads formed oil a first plane, a baffle paddle formed on a second plane in parallel, and an internal tie bar formed between the first plane and the second plane. The internal tie bar has at least two or more windings such as “S” shaped to flexibly connect the baffle paddle to an adjacent one of the leads. Therefore, the internal tie bar can reduce the shifting and twisting of the connected lead during the formation of the downset of the baffle paddle.

Abstract: A stationary exercise apparatus with adjustable members for varying the stride path and the exercise intensity of a user. The stationary exercise apparatus has a frame. The frame has side portions positioned at left and right sides. The rearward of the frame and the side portions define a space for a user to get on the stationary exercise apparatus via the space. The stationary exercise apparatus further comprises top members which are movably coupled to the side portions of the frame for the user to grip thereon to safely get on the stationary exercise apparatus.

Abstract: A unit selection module for Chinese Text-to-Speech (TTS) synthesis includes a probabilistic context free grammar (PCFG) parser, a latent semantic indexing (LSI) module, and a modified variable-length unit selection scheme; any Chinese sentence is firstly input and then parsed into a context-free grammar (CFG) by the PCFG parser; wherein there are several possible CFGs for every Chinese sentence, and the CFG (or the syntactic structure) with the highest probability is then taken as the best CFG (or the syntactic structure) of the Chinese sentence; the LSI module is then used to calculate the structural distance between all the candidate synthesis units and the target unit in a corpus; through the modified variable-length unit selection scheme, tagged with the dynamic programming algorithm, the units are searched to find the best synthesis unit concatenation sequence.

Abstract: A semiconductor package primarily comprises a plurality of leadframe's leads, a chip, a paddle, an adhesive and an encapsulant encapsulating the components mentioned above. The paddle has a carrying surface and an exposed external surface. The first chip is attached to one surface of the leads. The paddle is attached to an opposing surface of the leads by the adhesive bonding the carrying surface to the leads. Furthermore, the adhesive further encapsulates the gaps between the leads without contaminating the exposed external surface and with the exposed external surface exposed from the encapsulant. Therefore, the leads obtain a better support so that the encapsulated portions of the leads will not shift nor expose from the encapsulant during molding processes without encapsulated bubbles between the leads and the paddle. The heat dissipation is also enhanced.

Abstract: A switching device for a transfer switch has a pivotal body, a solenoid, a resilient pushing device and a main spring. The pivotal body has a pivotal axis, a first recess, a second recess and a connecting axis. The first and second recesses are defined adjacent to each other. The connecting axis is defined between the first and second recesses. The solenoid is connected to the pivotal body with a lever and has a driving shaft with a center line. The main spring has a connecting end being connected to the pivotal body at a point on the connecting axis. The lever has a center line. The connecting end of the main spring connected to the connecting axis is offset to the center line of the lever when the center line of the lever aligns with the center line of the driving shaft.

Abstract: A method of forming an identification code for wire bonders is revealed. Firstly, a chip with a plurality of bonding pads is provided and is disposed on a chip carrier with a plurality of bonding fingers. A binary-code baseline is defined on the chip carrier to divide each of the bonding fingers into a first coding area adjacent the bonding pads and a second coding area far away from the bonding pads. Then, a plurality of bonding wires are formed by wire bonding to electrically connect the bonding pads to the bonding fingers and an ID code for wire bonders is formed at the same time where each bonding wire has an end selectively bonded to either the first coding area or the second coding area of the corresponding bonding finger to form an ID code for wire bonders. Since the ID code for wire bonders is constituted by the selected locations of the ends of the bonding wires, the ID code do not get lost or damaged during packaging processes nor contaminate the packages.